Global Wire Bonder Equipment Market 2017-2021
About Wire Bonder Equipment
Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.
Technavio’s analysts forecast the global wire bonder equipment market to grow at a CAGR of 2.88% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global wire bonder equipment market for 2017-2021. To calculate the market size, the report considers the new installations, shipments, and sales of wire bonding systems in the semiconductor market.
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Wire Bonder Equipment Market 2017-2021
Technavio recognizes the following companies as the key players in the global wire bonder equipment market: ASM Pacific Technology, Kulicke& Soffa, and Palomar Technologies.
Other Prominent Vendors in the market are: Besi, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, SHINKAWA Electric, Toray Engineering, and West Bond.
Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is growing use of 3D chip packaging. Foundries have resorted to 3D packaging technology to meet the demands of electronic product manufacturers. EDMs are looking to cut down the space occupied by ICs in their devices, without compromising the power-saving capability. 3D packaging encompasses, stacking multiple chips in a single stack, thereby utilizing the least possible space in a device. The emergence of new types of chip packaging will offer OSATs and IDMs with new business and growth opportunities in the coming years, thereby propelling the growth of the semiconductor packaging equipment such as wire bonder equipment during the forecast period.”
According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is characterized by relationship-based sales. The selling price of such equipment is usually in the range of $100,000-$1,000,000. Therefore, manufacturers look to develop long-standing relations with customers buying their product offerings. The outlook of building such relations is to ensure repeat purchases by offering discounts and incentives for future orders. This is mostly practiced on those customers who account for around 5-10% of the equipment manufacturers sales.
Further, the report states that one of the major factors hindering the growth of this market is high investment market. The advent of new packaging solutions based on 3D technology such as flip-chip packaging, TSV stacked packaging, and MEMs packaging has changed the manufacturing landscape of the semiconductor industry. These technologies are being utilized to keep pace with the growing demand for compact semiconductor devices in the market. Equipment manufacturers have to undertake significant investments to ensure their devices are up-to-date with the latest technologies. These advances in technology have increased the complexity of the production process, consuming additional time while also increasing the probability of defects.
ASM Pacific Technology, Kulicke& Soffa, Palomar Technologies, Besi, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, SHINKAWA Electric, Toray Engineering, and West Bond.