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Global Wire Bonder Equipment Market 2017-2021

Global Wire Bonder Equipment Market 2017-2021

About Wire Bonder Equipment

Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.

Technavio’s analysts forecast the global wire bonder equipment market to grow at a CAGR of 2.88% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global wire bonder equipment market for 2017-2021. To calculate the market size, the report considers the new installations, shipments, and sales of wire bonding systems in the semiconductor market.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Wire Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • ASM Pacific Technology
  • Kulicke& Soffa
  • Palomar Technologies
Other prominent vendors
  • Besi
  • DIAS Automation
  • F&K Delvotec Bondtechnik
  • Hesse
  • Hybond
  • SHINKAWA Electric
  • Toray Engineering
  • West Bond
Market driver
  • Incentives and discounts for long-term customers
  • For a full, detailed list, view our report
Market challenge
  • High investment market
  • For a full, detailed list, view our report
Market trend
  • Growing use of 3D chip packaging
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – Global Wire Bonder Equipment Market 2017-2021
Technavio recognizes the following companies as the key players in the global wire bonder equipment market: ASM Pacific Technology, Kulicke& Soffa, and Palomar Technologies.
Other Prominent Vendors in the market are: Besi, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, SHINKAWA Electric, Toray Engineering, and West Bond.
Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is growing use of 3D chip packaging. Foundries have resorted to 3D packaging technology to meet the demands of electronic product manufacturers. EDMs are looking to cut down the space occupied by ICs in their devices, without compromising the power-saving capability. 3D packaging encompasses, stacking multiple chips in a single stack, thereby utilizing the least possible space in a device. The emergence of new types of chip packaging will offer OSATs and IDMs with new business and growth opportunities in the coming years, thereby propelling the growth of the semiconductor packaging equipment such as wire bonder equipment during the forecast period.”
According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is characterized by relationship-based sales. The selling price of such equipment is usually in the range of $100,000-$1,000,000. Therefore, manufacturers look to develop long-standing relations with customers buying their product offerings. The outlook of building such relations is to ensure repeat purchases by offering discounts and incentives for future orders. This is mostly practiced on those customers who account for around 5-10% of the equipment manufacturers sales.

Further, the report states that one of the major factors hindering the growth of this market is high investment market. The advent of new packaging solutions based on 3D technology such as flip-chip packaging, TSV stacked packaging, and MEMs packaging has changed the manufacturing landscape of the semiconductor industry. These technologies are being utilized to keep pace with the growing demand for compact semiconductor devices in the market. Equipment manufacturers have to undertake significant investments to ensure their devices are up-to-date with the latest technologies. These advances in technology have increased the complexity of the production process, consuming additional time while also increasing the probability of defects.

Companies Mentioned

ASM Pacific Technology, Kulicke& Soffa, Palomar Technologies, Besi, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, SHINKAWA Electric, Toray Engineering, and West Bond.

  • Executive summary
  • Scope of the report
  • Research Methodology
  • Introduction
    • Key market highlights
      • Table Comparison of wire bonding techniques
      • Table Comparison of the three types of wire bonds
  • Market landscape
    • Overview of semiconductor packaging and assembly equipment
      • Table Steps involved in back-end chip formation
    • Ecosystem of semiconductor IC packaging industry
      • Table Supply chain of traditional semiconductor IC packaging industry
      • Table Supply chain of new semiconductor IC packaging industry
    • Wire bonder market overview
      • Table Overview of global wire bonder equipment market
    • Market size and forecast
      • Table Global wire bonder equipment market 2016-2021 ($ millions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by product
    • Global wire bonder equipment market by product
      • Table Global wire bonder equipment market by product 2016-2021 (% share of revenue)
      • Table Revenue trend line of global wire bonder equipment market by product 2016-2021 ($ millions)
    • Ball bonders
      • Table Global ball bonder equipment market by ball bonders 2016-2021 ($ millions)
    • Stud-bump bonders
      • Table Global wire bonder equipment market by stud-bump bonders 2016-2021 ($ millions)
    • Wedge bonders
      • Table Global wedge bonder equipment market by wedge bonders 2016-2021 ($ millions)
  • Market segmentation by end-user
    • Global wire bonder equipment market by enduser
      • Table Global wire bonder equipment market by end-user 2016-2021 (% share of revenue)
      • Table Revenue trend line of the global wire bonder equipment market by end-user 2016- 2021 ($ millions)
    • OSATs
      • Table Global wire bonder equipment market by OSATs 2016-2021 ($ millions)
    • Market size and forecast
      • Table Global wire bonder equipment market by IDMs 2016-2021 ($ millions)
  • Geographical segmentation
    • Global wire bonder equipment market by geography
      • Table Global wire bonder equipment market by geography 2016-2021 (% share of revenue)
      • Table Global wire bonder equipment market by geography ($ millions)
    • APAC
      • Table Wire bonder equipment market in APAC 2016-2021 ($ millions)
    • Americas
      • Table Wire bonder equipment market in Americas 2016-2021 ($ millions)
    • EMEA
      • Table Wire bonder equipment market in EMEA 2016-2021 ($ millions)
  • Key leading countries
    • Key leading countries
      • Table Key leading countries
      • Table Percentage share of key leading countries 2016-2021
    • Taiwan
    • South Korea
    • Japan
    • China
  • Decision framework
  • Drivers and challenges
    • Market drivers
      • Table Forecast by application of semiconductor devices 2016 and 2021 (% share of unit shipments)
    • Impact of drivers on key customer segments
      • Table Impact of drivers
    • Market challenges
      • Table Global semiconductor market trend 1990-2016 ($ billions)
    • Impact of challenges on key customer segments
      • Table Impact of challenges
  • Market trends
    • Growing use of 3D chip packaging
    • Increase in number of OSAT vendors
    • Trend of M&A in the packaging and assembly market
    • Advent of FOWLP technology
    • Automation in automobiles
  • Vendor landscape
    • Competitive scenario
    • Key vendors
    • Other prominent vendors
      • Table Other prominent vendors
  • Appendix
    • List of abbreviations
  • Explore Technavio

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