Global Wafer-level Packaging Equipment Market 2015-2019
About Wafer-level Packaging Equipment
ICs are very delicate in nature, therefore, prone to contamination that can cause malfunctioning. To eliminate such issues, silicon chips or ICs are protected by using packaging materials. Wafer level packaging is one such type of packaging, which involves the packaging of individual ICs using best fit packaging processes conducted at wafer level manufacturing in semiconductor production process.
TechNavio's analysts forecast the Global Wafer-level Packaging Equipment market to grow at a CAGR of 0.1 percent over the period 2014-2019.
Covered in this Report
This report covers the present scenario and the growth prospects of the Global Wafer-level Packaging Equipment market for the period 2015-2019. This report considers 2014 as the base year and provides data for the trailing 12 months. To calculate the market size, the report considers revenue generated from the sales of wafer-level packaging equipment worldwide. However, the report does not take into consideration the following while calculating the market size:
TechNavio Announces the Publication of its Research Report – Global Wafer-level Packaging Equipment Market 2015-2019
TechNavio recognizes the following companies as the key players in the Global Wafer-level Packaging Equipment Market: Applied Materials Inc., Disco Corp., EV Group, Tokyo Electron Ltd. and Tokyo Seimitsu Co. Ltd.
Other Prominent Vendors in the market are: Rudolph Technologies, SEMES, Suss Microtec, Ultratech and ULVAC.
Commenting on the report, an analyst from TechNavio’s team said: “The short replacement cycle of portable electronic devices is one of the major trends witnessed in the market. The launch of new versions of portable electronic devices such as smartphones, phablets, and tablets has led consumers to replace their old devices with new advanced models.”
According to the report, the increased demand for smartphones and tablets worldwide, particularly in the emerging markets, is one of the major drivers in the market. This has led to the increased demand for semiconductor wafers and ICs, driving the growth of the Global Wafer-level Packaging Equipment market.
Further, the report states that the rapid changes in technology are one of the major challenges in the market. The semiconductor industry is evolving at a significant rate, leading to design complexities in ICs. To accommodate these advanced IC designs, wafer-level packaging equipment manufacturers incur huge costs in the production of advanced equipment.
Applied Materials, Disco , EV Group, Tokyo Electron , Tokyo Seimitsu , Rudolph Technologies , SEMES , Suss Microtec , Ultratech , ULVAC
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