Market Research Logo

Global Wafer-level Packaging Equipment Market 2015-2019

Global Wafer-level Packaging Equipment Market 2015-2019

About Wafer-level Packaging Equipment

ICs are very delicate in nature, therefore, prone to contamination that can cause malfunctioning. To eliminate such issues, silicon chips or ICs are protected by using packaging materials. Wafer level packaging is one such type of packaging, which involves the packaging of individual ICs using best fit packaging processes conducted at wafer level manufacturing in semiconductor production process.

TechNavio's analysts forecast the Global Wafer-level Packaging Equipment market to grow at a CAGR of 0.1 percent over the period 2014-2019.

Covered in this Report

This report covers the present scenario and the growth prospects of the Global Wafer-level Packaging Equipment market for the period 2015-2019. This report considers 2014 as the base year and provides data for the trailing 12 months. To calculate the market size, the report considers revenue generated from the sales of wafer-level packaging equipment worldwide. However, the report does not take into consideration the following while calculating the market size:

  • Support or maintenance services that are offered for/with wafer-level packaging equipment
  • Components that are used in the production of wafer-level packaging equipment
  • Aftermarket sales of wafer-level packaging equipment
Key Regions
  • Americas
  • APAC
  • EMEA
Key Vendors
  • Applied Materials
  • Disco
  • EV Group
  • Tokyo Electron
  • Tokyo Seimitsu
Other Prominent Vendors
  • Rudolph Technologies
  • SEMES
  • Suss Microtec
  • Ultratech
  • ULVAC
Market Driver
  • Increased Demand for Smartphones and Tablets
  • For a full, detailed list, view our report
Market Challenge
  • Rapid Changes in Technology
  • For a full, detailed list, view our report
Market Trend
  • Short Replacement Cycle of Portable Electronic Devices
  • For a full, detailed list, view our report
Key Questions Answered in this Report
  • What will the market size be in 2019 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

TechNavio Announces the Publication of its Research Report – Global Wafer-level Packaging Equipment Market 2015-2019

TechNavio recognizes the following companies as the key players in the Global Wafer-level Packaging Equipment Market: Applied Materials Inc., Disco Corp., EV Group, Tokyo Electron Ltd. and Tokyo Seimitsu Co. Ltd.

Other Prominent Vendors in the market are: Rudolph Technologies, SEMES, Suss Microtec, Ultratech and ULVAC.

Commenting on the report, an analyst from TechNavio’s team said: “The short replacement cycle of portable electronic devices is one of the major trends witnessed in the market. The launch of new versions of portable electronic devices such as smartphones, phablets, and tablets has led consumers to replace their old devices with new advanced models.”

According to the report, the increased demand for smartphones and tablets worldwide, particularly in the emerging markets, is one of the major drivers in the market. This has led to the increased demand for semiconductor wafers and ICs, driving the growth of the Global Wafer-level Packaging Equipment market.

Further, the report states that the rapid changes in technology are one of the major challenges in the market. The semiconductor industry is evolving at a significant rate, leading to design complexities in ICs. To accommodate these advanced IC designs, wafer-level packaging equipment manufacturers incur huge costs in the production of advanced equipment.

Companies Mentioned

Applied Materials, Disco , EV Group, Tokyo Electron , Tokyo Seimitsu , Rudolph Technologies , SEMES , Suss Microtec , Ultratech , ULVAC

  • Executive Summary
  • List of Abbreviations
  • Scope of the Report
    • Market Overview
    • Product Offerings
  • Market Research Methodology
    • Market Research Process
    • Research Methodology
      • Table Market Research Methodology
  • Introduction
  • Industry Overview
    • Semiconductor Industry Overview
      • Semiconductor Value Chain
        • Table Semiconductor Value Chain
        • Table Front-end Production Process
        • Table Back-end Production Process
    • Structure of Semiconductor Market
      • Table Structure of Semiconductor Market
    • Global Semiconductor Market Overview
      • Table Global Semiconductor Market 2014
      • Geographical Segmentation of Semiconductor Market 2005-2012
        • Table Global Semiconductor Market by Geographical Segmentation 2005-2012
  • Market Landscape
    • Market Size and Forecast
      • Table Global Wafer-level Packaging Equipment Market 2014-2019 (US$ million)
    • Five Forces Analysis
  • Geographical Segmentation
    • Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019
      • Table Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014
    • Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019
      • Table Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019
      • Table Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (US$ million)
    • Wafer-level Packaging Equipment Market in APAC Region
      • Market Size and Forecast
    • Wafer-level Packaging Equipment Market in Americas
      • Market Size and Forecast
    • Wafer-level Packaging Equipment Market in EMEA Region
      • Market Size and Forecast
        • Table Comparison of Geographies by CAGR 2014-2019
  • Key Leading Countries
    • Taiwan
      • Table Wafer-level Packaging Equipment Market in Taiwan 2014-2019 (US$ million)
    • South Korea
      • Table Wafer-level Packaging Equipment Market in South Korea 2014-2019 (US$ million)
    • US
      • Table Wafer-level Packaging Equipment Market in US 2014-2019 (US$ million)
      • Table CAGR Comparison between Key Leading Countries 2014-2019
  • Buying Criteria
  • Market Growth Drivers
    • Table Global Smartphone Market by Unit Shipments 2013-2019 (billion units)
    • Table Global Tablet Market by Unit Shipments 2013-2019 (million units)
  • Drivers and their Impact
  • Market Challenges
  • Impact of Drivers and Challenges
  • Market Trends
  • Trends and their Impact
  • Vendor Landscape
    • Competitive Scenario
    • Market Share Analysis 2014
      • Tokyo Seimitsu
      • Disco
      • Tokyo Electron
      • Applied Materials
      • EV Group
        • Table Vendor Ranking in Global Wafer-level Packaging Equipment Market 2014
    • Other Prominent Vendors
  • Key Vendor Analysis
    • Applied Materials
      • Key Facts
      • Business Overview
      • Business Segmentation by Revenue 2013
        • Table Applied Materials: Business Segmentation by Revenue 2013
      • Business Segmentation by Revenue 2012 and 2013
        • Table Applied Materials: Business Segmentation by Revenue 2012 and 2013 (US$ billion)
      • Geographical Segmentation by Revenue 2013
        • Table Applied Materials: Geographical Segmentation by Revenue 2013
      • Business Strategy
      • Recent Developments
      • SWOT Analysis
    • DISCO
      • Key Facts
      • Business Overview
      • Business Segmentation by Revenue 2014
        • Table DISCO: Business Segmentation by Revenue 2014
      • Geographical Segmentation by Revenue 2014
        • Table DISCO: Geographical Segmentation by Revenue 2014
      • SWOT Analysis
    • EV Group
      • Key Facts
      • Business Overview
      • Awards
      • Business Segmentation 2013
        • Table EV Group: Business Segmentation 2013
      • SWOT Analysis
    • Tokyo Electron
      • Key Facts
      • Business Overview
      • Business Segmentation by Revenue 2014
        • Table Tokyo Electron: Business Segmentation by Revenue 2014
      • Business Segmentation by Revenue 2014
        • Table Tokyo Electron: Business Segmentation by Revenue 2014 (US$ million)
      • Geographical Segmentation by Revenue 2014
        • Table Tokyo Electron: Geographical Segmentation by Revenue 2014
      • Business Strategy
      • Recent Developments
      • SWOT Analysis
    • Tokyo Seimitsu
      • Key Facts
      • Business Overview
      • Business Segmentation by Revenue 2014
        • Table Tokyo Seimitsu: Business Segmentation by Revenue 2014
      • Geographical Segmentation by Revenue 2014
        • Table Tokyo Seimitsu: Geographical Segmentation by Revenue 2014
      • SWOT Analysis
  • Market Summary
    • Growth Propellers
      • Expansion Plans
      • Replacement of Old Equipment
    • Growth Inhibitor
      • Cyclic Nature of Semiconductor Industry
      • Rapid Advances in Technology
    • Ongoing Trends
      • Increase in Innovations
      • Increased Penetration of Clean Energy Devices
      • Increased Focus on Improving Production Yield
      • Increased Adoption of Semiconductors in Automotive Sector
    • Market Attractiveness
  • Other Reports in this Series

Download our eBook: How to Succeed Using Market Research

Learn how to effectively navigate the market research process to help guide your organization on the journey to success.

Download eBook

Share this report