Global Wafer Dicing Saws Market 2017-2021
About Wafer Dicing Saws
A dicing saw is a saw that is used to dice, groove, or cut semiconductor wafers by using a high-speed spindle that has been fitted with a diamond blade. A dicing saw is a part of a dicing machine, which cuts these wafers into individual chips. Some of the materials that can be diced using this machine are silicon, silicon carbide, gallium nitride, gallium arsenide, ceramic, sapphire, and glass. Dicing blades of varying thickness are used to saw the wafers based on the material being sawed. Dicing equipment can be categorized into three types, namely sawing equipment, scribing equipment, and sawing accessories. Sawing accessories consist of breaking, mounting, and surface grinding.
Technavio’s analysts forecast the global wafer dicing saws market to grow at a CAGR of 6.35% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global wafer dicing saws market for 2017-2021. To calculate the market size, the report considers the revenues from major wafer dicing saws vendors..
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Wafer Dicing Saws Market 2017-2021
Technavio recognizes the following companies as the key players in the global wafer dicing saws market: DISCO Corporation, TOKYO SEIMITSU, Advanced Dicing Technology, Dynatex International, Loadpoint, and Micross Components.
Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is Growth of AI. AI is a technology that allows machines to perform tasks that require human intelligence. Machines that use AI mainly include computer systems. In 2016, many industry participants such as Amazon, Baidu, Google Facebook, IBM, NVIDIA, Tesla Motors, and Microsoft made investments in the field of AI. As of 2017, Google has acquired 16 startups related to AI. In 2017, Facebook announced plans to develop the best AI lab in the world. The company has already developed a personal assistant, dubbed M, which is powered by AI. In 2016, Google announced an investment of $4.5 million over three years to the Montreal Institute for Learning Algorithms, Canada to facilitate research on AI.”
According to the report, one of the major drivers for this market is Growing demand for IoT. IoT is an ecosystem wherein many devices are connected to the Internet. These devices include mobile phones, tablets, and other consumer electronic devices. The business possibilities are numerous with the advent of IoT. These devices are assigned an IP address; they can collect and receive data, eliminating the need for any manual operation of the device.
Further, the report states that one of the major factors hindering the growth of this market is Volatile nature of the semiconductor industry. The demand for wafer dicing saws depends on the overall demand for semiconductors. The current and anticipated demand for the semiconductor industry and products that use semiconductors is highly volatile due to a number of reasons. Products that use semiconductor include mobile devices, computers, consumer electronics, automotive goods, and telecommunication equipment. The fluctuating demand for these goods will impact the overall semiconductor market, thereby impacting the semiconductor equipment market. Significant market downturns can adversely affect such extended businesses.
DISCO Corporation, TOKYO SEIMITSU, Advanced Dicing Technology, Dynatex International, Loadpoint, and Micross Components
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