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Global Wafer Dicing Saws Market 2017-2021

Global Wafer Dicing Saws Market 2017-2021

About Wafer Dicing Saws

A dicing saw is a saw that is used to dice, groove, or cut semiconductor wafers by using a high-speed spindle that has been fitted with a diamond blade. A dicing saw is a part of a dicing machine, which cuts these wafers into individual chips. Some of the materials that can be diced using this machine are silicon, silicon carbide, gallium nitride, gallium arsenide, ceramic, sapphire, and glass. Dicing blades of varying thickness are used to saw the wafers based on the material being sawed. Dicing equipment can be categorized into three types, namely sawing equipment, scribing equipment, and sawing accessories. Sawing accessories consist of breaking, mounting, and surface grinding.

Technavio’s analysts forecast the global wafer dicing saws market to grow at a CAGR of 6.35% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global wafer dicing saws market for 2017-2021. To calculate the market size, the report considers the revenues from major wafer dicing saws vendors..

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Wafer Dicing Saws Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • DISCO Corporation
  • TOKYO SEIMITSU
  • Advanced Dicing Technology
  • Dynatex International
  • Loadpoint
  • Micross Components
Market driver
  • Growing demand for IoT
  • For a full, detailed list, view our report
Market challenge
  • Volatile nature of the semiconductor industry
  • For a full, detailed list, view our report
Market trend
  • Growth of AI
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – Global Wafer Dicing Saws Market 2017-2021

Technavio recognizes the following companies as the key players in the global wafer dicing saws market: DISCO Corporation, TOKYO SEIMITSU, Advanced Dicing Technology, Dynatex International, Loadpoint, and Micross Components.

Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is Growth of AI. AI is a technology that allows machines to perform tasks that require human intelligence. Machines that use AI mainly include computer systems. In 2016, many industry participants such as Amazon, Baidu, Google Facebook, IBM, NVIDIA, Tesla Motors, and Microsoft made investments in the field of AI. As of 2017, Google has acquired 16 startups related to AI. In 2017, Facebook announced plans to develop the best AI lab in the world. The company has already developed a personal assistant, dubbed M, which is powered by AI. In 2016, Google announced an investment of $4.5 million over three years to the Montreal Institute for Learning Algorithms, Canada to facilitate research on AI.”

According to the report, one of the major drivers for this market is Growing demand for IoT. IoT is an ecosystem wherein many devices are connected to the Internet. These devices include mobile phones, tablets, and other consumer electronic devices. The business possibilities are numerous with the advent of IoT. These devices are assigned an IP address; they can collect and receive data, eliminating the need for any manual operation of the device.

Further, the report states that one of the major factors hindering the growth of this market is Volatile nature of the semiconductor industry. The demand for wafer dicing saws depends on the overall demand for semiconductors. The current and anticipated demand for the semiconductor industry and products that use semiconductors is highly volatile due to a number of reasons. Products that use semiconductor include mobile devices, computers, consumer electronics, automotive goods, and telecommunication equipment. The fluctuating demand for these goods will impact the overall semiconductor market, thereby impacting the semiconductor equipment market. Significant market downturns can adversely affect such extended businesses.

Companies Mentioned

DISCO Corporation, TOKYO SEIMITSU, Advanced Dicing Technology, Dynatex International, Loadpoint, and Micross Components

  • Executive summary
  • Scope of the report
  • Research Methodology
  • Introduction
    • Market outline
    • Wafer dicing saws
      • Table Types of dicing equipment
  • Market landscape
    • Market overview
      • Table Global wafer dicing saws market: Overview
    • Market size and forecast
      • Table Global wafer dicing saws market 2016-2021 ($ millions)
  • Five forces analysis
    • Table Five forces analysis
  • Market segmentation by end-user
    • Table Global wafer dicing saws market by end user in 2016 (% share)
    • Table Global wafer dicing saws market by end user 2016-2021 ($ millions)
    • Pureplay foundries
      • Table Global wafer dicing saws market by pureplay foundries 2016-2021 ($ millions)
    • IDMs
      • Table Global wafer dicing saws market by IDMs ($ millions)
  • Market segmentation by packaging technology
    • Table Global wafer dicing saws market by technology in 2016 ($ millions)
    • Table Global wafer dicing saws market by technology 2016-2021 ($ millions)
    • BGA
      • Table Global wafer dicing saws market by BGA 2016-2021 ($ millions)
    • QFN
      • Table Global wafer dicing saws by QFN 2016-2021 ($ millions)
  • Geographical segmentation
    • Market overview
      • Table Global wafer dicing saws market: Segmentation by geography in 2016 (% share)
      • Table Global wafer dicing saws market by geography 2016-2021 ($ millions)
    • APAC
      • Table Wafer dicing saws market in APAC 2016-2021 ($ millions)
      • Table Major semiconductor foundries located in the APAC (% share)
    • Americas
      • Table Wafer dicing saws market in Americas 2016-2021 ($ millions)
    • EMEA
      • Table Wafer dicing saws market in EMEA 2016-2021 ($ millions)
  • Key leading countries
    • Table Key leading countries (% share)
    • Taiwan
    • China
  • Decision framework
  • Drivers and challenges
    • Market drivers
      • Table Basic criteria for selecting a dicing blade
    • Market challenges
      • Table Die strength comparison between mechanical blade dicing saw and laser dicing saw (Mpa)
  • Market trends
    • Growth of AI
    • Increase in wafer size
      • Table Timeline for increasing wafer size 1975-2017
    • Introduction of ultrasonic blade dicing
    • Growth of smart cities
      • Table Partner cities selected in EU and China under PDSF initiative
  • Vendor landscape
    • Competitive scenario
  • Key vendor analysis
    • DISCO Corporation
      • Table DISCO Corporation: Recent developments
    • TOKYO SEIMITSU
      • Table TOKYO SEIMITSU: Recent developments
    • Advanced Dicing Technology
    • Dynatex International
    • Loadpoint
    • Micross Components
      • Table Micross Components: Recent developments
  • Appendix
    • List of abbreviations
  • Explore Technavio

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