Global System-on-Chip (SoC) Market 2015-2019
System-on-chip technology (SoC) is the integration of several components that are useful in the working of a device onto a single silicon chip to form an electronic system. SoC can be considered as a small computer carrying all the essential components such as motherboard, processor, graphics processor, memory, and peripherals, all onto a single chip. With the demand for more efficient systems and with the trend moving towards compact and small devices, SoC technology has become an alternative for big processing units. In a network and data driven world and with semiconductors becoming more internet centric, data storage SoCs are expected to grow at a rapid pace.
Technavio's analysts forecast the global system-on-chip (SoC) market to grow at a CAGR of 11.4% over the period 2014-2019.
Covered in this Report
The report includes the present scenario and the growth prospects of the global system-on-chip (SoC) market for the period 2015-2019. The market can be segmented into five application areas:
Technavio's report, Global System-on-Chip (SoC) Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Americas, APAC, and EMEA; it also covers the landscape of the global system-on-chip (SoC) market and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.
Technavio Announces the Publication of its Research Report – Global System-on-Chip (SoC) Market 2015-2019
Technavio recognizes the following companies as the key players in the Global System-on-Chip (SoC) Market: Apple Inc., Intel Corp., MediaTek Inc., Qualcomm Inc. and Samsung Electronics Co. Ltd.
Other Prominent Vendors in the market are: ARM Holdings, Broadcom, Freescale Semiconductors, Infineon Technologies and Marvell Technology Group and Texas Instruments
Commenting on the report, an analyst from Technavio’s team said: “The need to differentiate so as to compete in the increasingly competitive printer market has led to the innovation of 3D printers. 3D printers are increasingly being adopted in key technology-driven markets such as aerospace, automotive, educational, healthcare, and manufacturing sectors.”
According to the report, with the increase in the number of functions per IC, ICs have become denser, which helps manufacturers to add more functionalities. Miniaturization also helps reduce the overall cost of a SoC.
Further, the report states that the market is facing a tough challenge because of the emergence of System-in-Package technology. SiP is the 3D packaging of many dies vertically, reducing the overall size as well as reducing the overall development cost. With the demand for miniaturized products, SiP is a great threat to the SoC market.
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