About Sensor Module Market for Mobile Devices
A sensor module consists of a substrate on which two or more sensors are mounted. These sensors are used for measuring motion, orientation, and environmental conditions as well as for collecting information constituting an image. These sensors capture data with precision and accuracy and use the data in multiple applications. Mobile devices generally use three types of sensors: Motion sensors, Position sensors, Environment sensors, Image sensors.
The smartphone segment contributed the highest revenue and is expected to continue its dominance during the forecast period. APAC has been the largest contributor to the market, it will continue to dominate during the forecast period. The main reason behind the high growth in APAC is the presence of a large number of consumer electronics manufacturers in countries such as China, Taiwan, and South Korea. APAC will be followed by the Americas and by Europe, the Middle East, and Africa (EMEA).
Technavio’s analysts forecast the global sensor module market for mobile devices to grow at a CAGR 9.26% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global sensor module market for mobile devices for the period 2016-2020. To calculate the market size, the report considers revenue generated from the sales of different types of sensor modules to manufacturers of smartphones, tablets, and wearables.
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Sensor Module Market for Mobile Devices 2016-2020
Technavio recognizes the following companies as the key players in the Global Sensor Module Market for Mobile Devices: Asahi Kasei Microdevices (AKM), Bosch Sensortec, InvenSense, STMicroelectronics and Texas Instruments.
Other Prominent Vendors in the market are: Alps Electric, Analog Devices, Freescale Semiconductor, Kionix and MEMSIC.
Commenting on the report, an analyst from Technavio’s team said: “The introduction of combo chips, combo sensors or sensor fusion, and the Internet of Things (IoT) is the emerging trend in the market. When data two or more sensors is combined together, it is known as sensor fusion. This helps enhance the efficiency and accuracy of sensors. A combo chip refers to an integrated chip with two or more subsystems that used to be embedded separately, such as Bluetooth and Wi-Fi. IoT sensors, on the other hand, collect data from the environment and transmit it to cloud storage, wherein the data is processed and sent to end-users.”
According to the report, the rapid influx of smartphones and tablets is driving the market for sensor modules. In addition, the falling cost of smartphones, increasing penetration of the Internet, and constantly changing technology motivate consumers to buy new mobile devices.
Further, the report states that rapid changes in sensor technology pose a challenge for vendors, as they continuously need to upgrade their products in order to support new technologies.
Asahi Kasei Microdevices (AKM), Bosch Sensortec, InvenSense, STMicroelectronics, Texas Instruments, Alps Electric, Analog Devices, Freescale Semiconductor, Kionix , MEMSIC.
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