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Global Semiconductor Wafer Polishing and Grinding Equipment Market 2017-2021

Global Semiconductor Wafer Polishing and Grinding Equipment Market 2017-2021

About Semiconductor Wafer Polishing and Grinding Equipment

Semiconductors form the building blocks of electronic devices. They are the crucial core of any electronic component. Semiconductor capital spending, essentially, refers to the capital investments by vendors in the semiconductor domain. The entire capital spending market is made up of capital equipment assets and other assets. Other assets include land, building, and other essential infrastructure, except the capital equipment required to create semiconductor manufacturing facilities. Capital spending in the semiconductor industry is estimated to grow significantly from 2017. 2016 was the year of the cyclical trend where investments declined substantially due to the oversupply of semiconductor devices.

Technavio’s analysts forecast the global semiconductor wafer polishing and grinding equipment market to grow at a CAGR of 7.10% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor wafer polishing and grinding equipment market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Semiconductor Wafer Polishing and Grinding Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Applied Materials
  • EBARA
  • Lapmaster
  • Logitech
Other prominent vendors
  • Entrepix
  • Revasum
  • TOKYO SEIMITSU
  • Logomatic
Market driver
  • Incentives and discounts for long-term customers
  • For a full, detailed list, view our report
Market challenge
  • High development costs
  • For a full, detailed list, view our report
Market trend
  • Use of NEMS
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?


Press Release

Technavio Announces the Publication of its Research Report – Global Semiconductor Wafer Polishing and Grinding Equipment Market 2017-2021

Technavio recognizes the following companies as the key players in the global semiconductor wafer polishing and grinding equipment market: Applied Materials, EBARA, Lapmaster, and Logitech.

Other Prominent Vendors in the market are: Entrepix, Revasum, TOKYO SEIMITSU, and Logomatic.

Commenting on the report, an analyst from Technavio’s team said: “One trend in the market is use of NEMS. NEMS are devices that integrate electro and mechanical systems at a nanoscale. NEMS have a wide range of features such as significantly lower power consumption and production costs, due to their relatively small size. This makes them suitable for devices such as ultrasensitive sensors and high-frequency resonators. NEMS can also be used in a number of devices such as energy harvesters, accelerometers, gyroscopes, drug delivery systems, and portable power generators.”

According to the report, one driver in the market is incentives and discounts for long-term customers. Semiconductor equipment manufacturers undertake relationship-based sales. The selling price of such equipment is usually in the range of $100,000-$1,000,000. Hence, manufacturers look to develop long-standing relations with customers purchasing their offerings. They develop such relations by offering discounts and incentives to clients for the future deals. Equipment manufacturers target customers that tend to procure equipment of a significant sum, accounting for around 5%-10% of their total sales. Semiconductor device manufacturers may consider repeat purchase in the future, attracted by these discounts and incentives.

Further, the report states that one challenge in the market is high development costs. One of the major challenges faced by the global semiconductor wafer polishing and grinding equipment market is the high development costs associated with the manufacturing of semiconductor equipment. Semiconductor wafer polishing and grinding equipment requires polishers, grinders, and rotating platens, which are expensive to procure. Also, since there are only a few suppliers of those components, vendors need to invest heavily in acquiring these products. The increasing costs of polishing and grinding consumables, such as slurries and pads, add to the overall cost. Each equipment costs around a million dollars, making the initial investment for various foundries considerably high. Such equipment will also have a high repair and maintenance cost, which further adds to the overall cost.

Companies Mentioned

Applied Materials, EBARA, Lapmaster, Logitech, Entrepix, Revasum, TOKYO SEIMITSU, and Logomatic.

  • Executive summary
  • Scope of the report
  • Research methodology
  • Introduction
    • Market outline
    • Semiconductor value chain
      • Table Semiconductor value chain
      • Table Description of the semiconductor value chain
  • Market Landscape
    • Market ecosystem
      • Table Parent market
      • Table Global semiconductor capital equipment market
    • Market characteristics
      • Table Market characteristics
    • Market segmentation analysis
      • Table Market segments
  • Market sizing
    • Market definition
      • Table Market definition - Inclusions and exclusions checklist
    • Market size and forecast 2016-2021
      • Table Global semiconductor wafer polishing and grinding equipment market: Market size and forecast 2016-2021 ($ mn)
      • Table Global semiconductor wafer polishing and grinding equipment market - Year-over-year growth 2017-2021 (%)
  • Five forces analysis
    • Table Five forces analysis
  • Market segmentation by application
    • Segmentation by application
      • Table Global semiconductor wafer polishing and grinding equipment market by application: Market share 2016-2021 (%)
    • Comparison by application
      • Table Comparison by application
    • 300 mm- Market size and forecast 2016-2021
      • Table 300 mm - Market size and forecast 2016-2021 ($ mn)
      • Table 300 mm - Year-over-year growth 2017-2021 (%)
    • 200 mm - Market size and forecast 2016-2021
      • Table 200 mm - Market size and forecast 2016-2021 ($ mn)
      • Table 200 mm - Year-over-year growth 2017-2021 (%)
    • 150 mm - Market size and forecast 2016-2021
      • Table 150 mm- Market size and forecast 2016-2021 ($ mn)
      • Table 150 mm - Year-over-year growth 2017-2021 (%)
    • Market opportunity by application
      • Table Market opportunity by application
  • Market segmentation by end-user
    • Segmentation by end-user
      • Table Global semiconductor wafer polishing and grinding equipment market by end-user: Market share 2016-2021 (%)
    • Comparison by end-user
      • Table Comparison by end-user
    • Foundries - Market size and forecast 2016-2021
      • Table Foundries - Market size and forecast 2016-2021 ($ mn)
      • Table Foundries - Year-over-year growth 2017-2021 (%)
    • Memory manufacturers - Market size and forecast 2016-2021
      • Table Memory manufacturers - Market size and forecast 2016-2021 ($ mn)
      • Table Global memory market 2016-2021 ($ bn)
      • Table Memory manufacturers - Year-over-year growth 2017-2021 (%)
    • IDMs - Market size and forecast 2016-2021
      • Table IDMs - Market size and forecast 2016-2021 ($ mn)
      • Table IDMs - Year-over-year growth 2017-2021 (%)
    • Market opportunity by end-user
      • Table Market opportunity by end-user
  • Regional landscape
    • Geographical segmentation
      • Table Global semiconductor wafer polishing and grinding equipment market - Market share 2016-2021 (%)
    • Regional comparison
      • Table Regional comparison
    • APAC - Market size and forecast 2016-2021
      • Table APAC - Market size and forecast 2016-2021 ($ mn)
      • Table Major foundries located in APAC
      • Table APAC - Year-over-year growth 2017-2021 (%)
    • Americas - Market size and forecast 2016-2021
      • Table Americas - Market size and forecast 2016-2021 ($ mn)
      • Table Americas - Year-over-year growth 2017-2021 (%)
    • EMEA - Market size and forecast 2016-2021
      • Table EMEA - Market size and forecast 2016-2021 ($ mn)
      • Table EMEA - Year-over-year growth 2017-2021 (%)
    • Key leading countries
      • Table Key leading countries
    • Taiwan
    • South Korea
    • Japan
    • China
    • Market opportunity
  • Decision framework
  • Drivers and challenges
    • Market drivers
      • Table Global consumer electronic device shipments 2016-2021 (units in billions)
    • Market challenges
      • Table Global semiconductor market trend 1990-2016 ($ bn)
  • Market trends
    • Use of NEMS
    • Growth of ULSI
    • Transition toward 3D structures
    • Increasing wafer sizes
      • Table Timeline of the wafer sizes
  • Vendor landscape
    • Competitive scenario
  • Vendor analysis
    • Vendor overview
    • Applied Materials
    • EBARA
    • Lapmaster
    • Logitech
    • Other prominent vendors
      • Table Other prominent vendors
  • Appendix
    • List of abbreviations
  • Explore Technavio

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