Global Semiconductor Thermal Evaporator Market 2017-2021
About Semiconductor Thermal Evaporator
Semiconductor evaporation is a process that involves depositing a thin layer of material on a wafer or the surface of a substrate. A thermal evaporator is used to deposit material on the substrate. It is one of the simplest methods to attain thin film deposition. It uses an electric resistance heater to melt the material. The vapor that is created is raised to reach the substrate in a vacuum chamber forms a thin film on the surface. Thermal evaporation is cheap and generates less substrate damage. It also offers a high purity of films. Thermal evaporated film coatings can range from angstroms to microns in terms of thickness range and can be of single or multiple layers of material.
Technavio’s analysts forecast the global semiconductor thermal evaporator market to grow at a CAGR of 7.53% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor thermal evaporator market for 2017-2021. To calculate the market size, the report considers the revenue generated from the shipment of semiconductor thermal evaporators.
The market is divided into the following segments based on geography:
Press Release
Technavio Announces the Publication of its Research Report – Global Semiconductor Thermal Evaporator Market 2017-2021
Technavio recognizes the following companies as the key players in the global semiconductor thermal evaporator market: AJA International, Blue Wave Semiconductors, PVD Products, Vergason Technology, Mustang Vacuum Systems, NANO-MASTER, and Semicore Equipment.
Other Prominent Vendors in the market are: Kurdex Corporation, Kurt J. Lesker Company, Mantis Deposition, Rocky Mountain Vacuum Tech, and China Guangdong PVD Metallizer Co.
Commenting on the report, an analyst from Technavio’s team said: “One trend in market is emergence of FinFET architecture and 3D ICs. The high demand of electronic product manufacturers for faster performance and less consumption of energy fosters the growth of 3D ICs. The demand for 3D smart and miniaturized electronics has led to the emergence of 3D ICs. A 3D chip is a three-dimensional integrated circuit that is manufactured by piling silicon wafers and interconnecting them with a through-silicon via (TSV).”
According to the report, one driver in market is increased use of electronic devices in various industries. Electronic circuits and devices are increasingly integrated into advanced devices such as smartphones, tablets, electric cars, wearable devices, and smart air conditioners and aircraft. There is an increased demand for semiconductor products due to the rise in digitization and IoT. Various sensors, actuators, and computing power devices are used to provide improved connectivity of information along with security. Many industrial applications of semiconductor devices include usage in Airborne Enhanced Vision Systems, spectrometry, fire detection, gas leak detection systems, and non-destructive testing systems.
Further, the report states that one challenges in market is low returns on capital investment. Capital intensive companies face challenges as most industries are already in the mature phase of their product life cycle. Established companies set up high entry barriers for new players in the market. At the same time, they face severe competition from other existing companies. The use of new technologies creates opportunities for new players and challenges the existing and established players in the market. Large competitors challenge capital intensive companies. Capital intensive companies have both pros and cons as the market maturity is a major advantage for established players, while the intense competition and use of new technologies pose many challenges. Established players have expanded their businesses due to M&A deals and heavy investments that help in strengthening their market position.
Companies Mentioned
AJA International, Blue Wave Semiconductors, PVD Products, Vergason Technology, Mustang Vacuum Systems, NANO-MASTER, Semicore Equipment, Kurdex Corporation, Kurt J. Lesker Company, Mantis Deposition, Rocky Mountain Vacuum Tech, and China Guangdong PVD Metallizer Co.
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