Global Semiconductor Packaging Materials Market 2017-2021
About Semiconductor Packaging Materials
Semiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling. These packaging materials safeguard and protect the die from the external mechanical impacts and corrosion, besides acting as an electrically conductive interconnection with excellent signal propagation properties. Excessive heat in the integrated circuit is dissipation through attached heat spreaders. Semiconductor packaging components vary in dimensions and functionality and are mainly organic substrates, bonding wires, encapsulation resins, lead frames, thermal interface materials, die attach materials, and solder balls. The key customers of these packaging materials are the electronics industry, automotive sector, fabless semiconductor companies, packaging material suppliers, and packaging subcontractors.
Technavio’s analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 5.27% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for 2017-2021. To calculate the market size, the report considers the revenue generated by vendors through the sales of semiconductor packaging materials which are organic substrates, lead frames, bonding wires, encapsulation resins, die attach materials, solder balls, thermal interface materials, and WLP dielectrics.
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Semiconductor Packaging Materials Market 2017-2021
Technavio recognizes the following companies as the key players in the global semiconductor packaging materials market: Amkor Technology, DuPont, Henkel, Honeywell, Kyocera, and Toppan Printing
Other Prominent Vendors in the market are: Hitachi Chemical, ASM Pacific Technology, BASF, and Beijing Kehua New Chemical Technology.
Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is Increase in adoption of flip-chip, Sip, lead-free packaging solutions. To meet certain international standards of compliance, the lead-free packaging is gaining popularity and is set to continue during the forecast period. The RoHS was adopted by the European Union to control the use of hazardous substances in the packaging of electrical and electronic devices. This has been done to address the issue of consumer electronics waste disposal. Companies have started opting for lead-free packaging. In lead frame packages, the post plate is built of matte tin and pre-plate with nickel-palladium-silver alloys as lead substitutes.”
According to the report, one of the major drivers for this market is Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT. There is an increasing drive toward the mobility of electronic devices, worldwide. To be portable and cost-effective, they need to be lightweight and small. This trend toward the adoption of smaller form factors has called for innovative developments in the semiconductor packaging materials. Packaging technologies such as SiP, PoP, Flip-chip, and WLP is driving the development of new material solutions. For instance, a conductive bump is soldered on top of the flipped chip in flip-chip packaging, that acts as an interconnect with the lead frame or substrate. It ensures high system density and improved performance in miniaturized packages. With increasing functionalities required from the small device, the SiP technology is employed as it packs in ICs of different functionalities along with other passive components such as connectors and filters.
Further, the report states that one of the major factors hindering the growth of this market is Capital-intensive market. In the microelectronics industry, the semiconductor fabrication plant, commonly called a fab or sometimes foundry, is a factory where devices such as ICs are manufactured. Since a number of expensive devices are in operation in the fabs house, the estimated cost of building a new fab is in the range of $2 billion to $10billion. For instance, TSMC invested more than $9 billion in its Fab15 300 mm wafer manufacturing facility in Taiwan.
Amkor Technology, DuPont, Henkel, Honeywell, Kyocera, Toppan Printing, Hitachi Chemical, ASM Pacific Technology, BASF, and Beijing Kehua New Chemical Technology.
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