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Global Semiconductor Packaging Materials Market 2017-2021

Global Semiconductor Packaging Materials Market 2017-2021

About Semiconductor Packaging Materials

Semiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling. These packaging materials safeguard and protect the die from the external mechanical impacts and corrosion, besides acting as an electrically conductive interconnection with excellent signal propagation properties. Excessive heat in the integrated circuit is dissipation through attached heat spreaders. Semiconductor packaging components vary in dimensions and functionality and are mainly organic substrates, bonding wires, encapsulation resins, lead frames, thermal interface materials, die attach materials, and solder balls. The key customers of these packaging materials are the electronics industry, automotive sector, fabless semiconductor companies, packaging material suppliers, and packaging subcontractors.

Technavio’s analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 5.27% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for 2017-2021. To calculate the market size, the report considers the revenue generated by vendors through the sales of semiconductor packaging materials which are organic substrates, lead frames, bonding wires, encapsulation resins, die attach materials, solder balls, thermal interface materials, and WLP dielectrics.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Semiconductor Packaging Materials Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Amkor Technology
  • DuPont
  • Henkel
  • Honeywell
  • Kyocera
  • Toppan Printing
Other prominent vendors
  • Hitachi Chemical
  • ASM Pacific Technology
  • BASF
  • Beijing Kehua New Chemical Technology
Market driver
  • Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT
  • For a full, detailed list, view our report
Market challenge
  • Capital-intensive market
  • For a full, detailed list, view our report
Market trend
  • Increase in adoption of flip-chip, Sip, lead-free packaging solutions
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?


Press Release

Technavio Announces the Publication of its Research Report – Global Semiconductor Packaging Materials Market 2017-2021

Technavio recognizes the following companies as the key players in the global semiconductor packaging materials market: Amkor Technology, DuPont, Henkel, Honeywell, Kyocera, and Toppan Printing

Other Prominent Vendors in the market are: Hitachi Chemical, ASM Pacific Technology, BASF, and Beijing Kehua New Chemical Technology.

Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is Increase in adoption of flip-chip, Sip, lead-free packaging solutions. To meet certain international standards of compliance, the lead-free packaging is gaining popularity and is set to continue during the forecast period. The RoHS was adopted by the European Union to control the use of hazardous substances in the packaging of electrical and electronic devices. This has been done to address the issue of consumer electronics waste disposal. Companies have started opting for lead-free packaging. In lead frame packages, the post plate is built of matte tin and pre-plate with nickel-palladium-silver alloys as lead substitutes.”

According to the report, one of the major drivers for this market is Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT. There is an increasing drive toward the mobility of electronic devices, worldwide. To be portable and cost-effective, they need to be lightweight and small. This trend toward the adoption of smaller form factors has called for innovative developments in the semiconductor packaging materials. Packaging technologies such as SiP, PoP, Flip-chip, and WLP is driving the development of new material solutions. For instance, a conductive bump is soldered on top of the flipped chip in flip-chip packaging, that acts as an interconnect with the lead frame or substrate. It ensures high system density and improved performance in miniaturized packages. With increasing functionalities required from the small device, the SiP technology is employed as it packs in ICs of different functionalities along with other passive components such as connectors and filters.

Further, the report states that one of the major factors hindering the growth of this market is Capital-intensive market. In the microelectronics industry, the semiconductor fabrication plant, commonly called a fab or sometimes foundry, is a factory where devices such as ICs are manufactured. Since a number of expensive devices are in operation in the fabs house, the estimated cost of building a new fab is in the range of $2 billion to $10billion. For instance, TSMC invested more than $9 billion in its Fab15 300 mm wafer manufacturing facility in Taiwan.

Companies Mentioned

Amkor Technology, DuPont, Henkel, Honeywell, Kyocera, Toppan Printing, Hitachi Chemical, ASM Pacific Technology, BASF, and Beijing Kehua New Chemical Technology.

  • Executive summary
  • Scope of the report
  • Research methodology
  • Introduction
    • Market outline
      • Table Steps in back-end chip formation
      • Table Roadmap of semiconductor packaging
      • Table Old supply chain of semiconductor IC packaging industry
      • Table New supply chain of semiconductor IC packaging industry
  • Market landscape
    • Market ecosystem
      • Table Related market
      • Table Semiconductor packaging materials technologies
      • Table Global semiconductor packaging materials market overview
    • Market characteristics
      • Table Market characteristics
    • Market segmentation analysis
      • Table Market segments
  • Market sizing
    • Market definition
      • Table Market definition - Inclusions and exclusions checklist
    • Market sizing 2016
      • Table Market size 2016
      • Table Validation techniques employed for market sizing 2016
    • Market size and forecast 2016-2021
      • Table Global semiconductor packaging materials - Market size and forecast 2016-2021 ($ billions)
      • Table Global semiconductor packaging materials market- Year-over-year growth 2017-2021 (%)
  • Five forces analysis
    • Table Five forces analysis 2016
    • Table Five forces analysis 2021
    • Bargaining power of buyers
      • Table Bargaining power of buyers
    • Bargaining power of suppliers
      • Table Bargaining power of suppliers
    • Threat of new entrants
      • Table Threat of new entrants
    • Threat of substitutes
      • Table Threat of substitutes
    • Threat of rivalry
      • Table Threat of rivalry
    • Market condition
      • Table Market condition in 2016 - Five forces
  • Customer landscape
    • Table Customer landscape
  • Market segmentation by material type
    • Segmentation by material type
      • Table Global semiconductor packaging materials by market type 2016-2021 (%)
      • Table Comparison by end-user
    • Organic substrates - Market size and forecast 2016-2021
      • Table Organic substrates - Market size and forecast 2016-2021 ($ billions)
      • Table Organic substrates - Year-over-year growth 2017-2021 (%)
    • Lead frames - Market size and forecast 2016- 2021
      • Table Lead frames - Market size and forecast 2016-2021 ($ billions)
      • Table Lead frames - Year-over-year growth 2017-2021 (%)
    • Bonding wires - Market size and forecast 2016- 2021
      • Table Bonding wires - Market size and forecast 2016-2021 ($ billions)
      • Table Bonding wires - Year over year growth 2017-2021 (%)
    • Others - Market size and forecast 2016-2021
      • Table Others - Market size and forecast 2016-2021 ($ billions)
      • Table Others - Year-over-year growth 2017-2021 (%)
    • Market opportunity by type of materials
      • Table Market opportunity by material type
  • Regional landscape
    • Geographical segmentation
      • Table Global semiconductor packaging materials market share by geography 2016-2021 (%)
      • Table Regional comparison
    • APAC - Market size and forecast 2016-2021
      • Table APAC - Market size and forecast 2016-2021 ($ billions)
      • Table APAC - Year-over-year growth 2017-2021 (%)
      • Table Top 3 countries in Americas
    • Americas - Market size and forecast 2016-2021
      • Table Americas - Market size and forecast 2016-2021 ($ billions)
      • Table Americas - Year-over-year growth 2017-2021 (%)
      • Table Top 3 countries in EMEA
    • EMEA - Market size and forecast 2016-2021
      • Table EMEA - Market size and forecast 2016-2021 ($ billions)
      • Table EMEA - Year-over-year growth 2017-2021 (%)
      • Table Top 3 countries in APAC
    • Market opportunity
  • Decision framework
  • Drivers and challenges
    • Market drivers
    • Market challenges
  • Market trends
    • Increase in adoption of flip-chip, Sip, lead-free packaging solutions
    • Growing preference of SMT (surface mount technology) over older through-hole technology and surge in popularity of redistributed chip packaging
    • Surge in adoption of semiconductor ICs for automobiles and shift toward copper as bonding wire material
  • Vendor landscape
    • Competitive scenario
  • Vendor analysis
    • Vendors covered
    • Vendor classification
      • Table Vendor classification
    • Market positioning of vendors
      • Table Market positioning of vendors
    • Amkor Technology
      • Table Amkor Technology overview
      • Table Amkor Technology - Business segments
      • Table Amkor Technology- Organizational developments
      • Table Amkor Technology- Geographic focus
      • Table Amkor Technology - Business segment focus
      • Table Amkor Technology - Key application packaging products
    • DuPont
      • Table DuPont overview
      • Table DuPont - Business segments
      • Table Dupont - Organizational developments
      • Table Dupont - Geographic focus
      • Table Dupont - Segment focus
      • Table Dupont - Key offerings
    • Henkel
      • Table Henkel overview
      • Table Henkel - Business segments
      • Table Henkel - Organizational developments
      • Table Henkel - Geographic focus
      • Table Henkel - Segment focus
      • Table Henkel - Key offerings
    • Honeywell
      • Table Honeywell overview
      • Table Honeywell - Business segments
      • Table Honeywell - Organizational developments
      • Table Honeywell - Geographic focus
      • Table Honeywell - Segment focus
      • Table Honeywell - Key offerings
    • Kyocera
      • Table Kyocera overview
      • Table Kyocera - Business segments
      • Table Kyocera - Organizational developments
      • Table Kyocera - Geographic focus
      • Table Kyocera - Segment focus
      • Table Kyocera - Key offerings
    • Toppan Printing
      • Table Toppan Printing overview
      • Table Toppan Printing - Business segments
      • Table Toppan Printing - Organizational developments
      • Table Toppan Printing - Geographic focus
      • Table Toppan Printing - Segment focus
      • Table Toppan Printing - Key offerings
  • Appendix
    • List of abbreviations
  • Explore Technavio

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