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Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

About Semiconductor Packaging and Assembly Equipment

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation. The increasing application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment.

Technavio’s analysts forecast the global semiconductor packaging and assembly equipment market to grow at a CAGR of 4.68% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor packaging and assembly equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sale of die-level and wafer-level packaging and assembly equipment to semiconductor manufacturers.

The market is divided into the following segments based on type:

  • Die- level packaging and assembly equipment
  • Wafer-level packaging and assembly equipment
Technavio's report, Global Semiconductor Packaging and Assembly Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Applied Materials
  • ASMPT
  • DISCO
  • EVG
  • Kulicke and Soffa Industries
  • TEL
  • Tokyo Seimitsu
Other prominent vendors
  • Rudolph Technologies
  • SEMES
  • Suss Microtec
  • Ultratech
  • Ulvac Technologies
Market driver
  • Rising demand for polymer adhesive wafer bonding equipment
  • For a full, detailed list, view our report
Market challenge
  • Fluctuating foreign exchange rates
  • For a full, detailed list, view our report
Market trend
  • Higher number of mergers and acquisitions (M&A)
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

Technavio recognizes the following companies as the key players in the Global Semiconductor Packaging and Assembly Equipment Market: Applied Materials, ASMPT, DISCO, EVG, Kulicke and Soffa Industries, TEL and Tokyo Seimitsu

Other Prominent Vendors in the market are: Rudolph Technologies, SEMES, Suss Microtec, Ultratech, and Ulvac Technologies.

Commenting on the report, an analyst from Technavio’s team said: “The global semiconductor packaging and assembly equipment market is observing an increase in the number of M&A. New entrants in the market are taking the M&A route to enter the already highly competitive market. Existing vendors are also turning to M&A to expand their market shares and help them enhance their market position.”

According to the report, the adoption of polymer adhesive wafer bonding equipment is increasing due to higher-quality packaging of vertically stacked and 3D ICs. Further, the boom in the IoT device market and increased adoption of ICs in automotive products will likely drive the demand for semiconductor ICs and their associated packaging and assembly equipment during the next few years.

Further, the report states that Fluctuations in foreign exchange rates will affect the rates of semiconductor packaging and assembly equipment.

Companies Mentioned

Applied Materials, ASMPT, DISCO, EVG, Kulicke and Soffa Industries, TEL, Tokyo Seimitsu, Rudolph Technologies, SEMES, Suss Microtec, Ultratech, Ulvac Technologies.

  • Executive summary
    • Highlights
  • Scope of the report
    • Market overview
      • Table Global semiconductor packaging and assembly equipment market segmentation
    • Top-vendor offerings
      • Table Product offerings
  • Market research methodology
    • Research methodology
    • Economic indicators
    • PEST analysis
  • Introduction
    • Key market highlights
    • Market perspective
  • Technology landscape
    • Back-end chip formation
      • Table Steps in back-end chip formation
    • Wafer-level versus die-level packaging and assembly
    • Roadmap of the semiconductor packaging industry
      • Table 2.5D IC block diagram
      • Table 3D IC block diagram
    • Ecosystem of semiconductor IC packaging industry
      • Table Old supply chain of semiconductor IC packaging industry
      • Table New supply chain of semiconductor IC packaging industry
  • Market landscape
    • Consumer perspective
    • Market size and forecast
      • Table Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by type
    • Market overview
      • Table Global semiconductor packaging and assembly equipment market 2015
    • Market size and forecast
      • Table Global semiconductor packaging and assembly equipment market 2015-2020 (% share)
      • Table Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
  • Geographical segmentation
    • Market overview
      • Table Global semiconductor packaging and assembly equipment market 2015
    • Global semiconductor packaging and assembly equipment market in APAC
      • Table Global semiconductor packaging and assembly equipment market in APAC ($ billions)
    • Global semiconductor packaging and assembly equipment market in North America
      • Table Global semiconductor packaging and assembly equipment market in North America ($ billions)
    • Global semiconductor packaging and assembly equipment market in Europe
      • Table Global semiconductor packaging and assembly equipment market in Europe ($ millions)
  • Market drivers and their impact
    • Table Impact of drivers on key customer segments
    • Rising demand for polymer adhesive wafer bonding equipment
    • Growing application of semiconductor ICs in the IoT
    • Growing demand for semiconductor ICs
    • Increasing complexity of semiconductor IC designs
    • Increasing miniaturization of electronic devices
      • Table Global MEMS market 2015-2020 ($ billions)
  • Market challenges
    • Fluctuating foreign exchange rates
    • Heavy investment required
    • Cyclical nature of the semiconductor industry
      • Table Global semiconductor market trend 1992-2014 ($ billions)
  • Impact of drivers and challenges
    • Table Impact of drivers and challenges
  • Market trends
    • Higher number of M&A
    • Rapid technological changes in the semiconductor industry
      • Table Global NAND flash market 2015-2020 (% share)
    • High adoption of semiconductor ICs in automobiles
      • Table Global car shipments 2015-2020 (shipment growth)
  • Vendor landscape
    • Competitive scenario
    • Key vendors
    • Other prominent vendors
  • Key vendor analysis
    • Applied Materials
      • Table Applied Materials: Geographical segmentation by revenue 2014
    • ASM Pacific Technology (ASMPT)
      • Table ASMPT: Geographical segmentation by revenue 2014
    • Disco
      • Table Disco: Geographical segmentation by revenue 2014
    • EV Group (EVG)
    • Kulicke and Soffa Industries
      • Table Kulicke and Soffa Industries: Geographical segmentation by revenue 2014
    • Tokyo Electron Ltd. (TEL)
      • Table TEL: Geographical segmentation by revenue 2015
      • Table TEL: Business performance by revenue 2012-2015
    • Tokyo Seimitsu
      • Table Tokyo Seimitsu: Geographical segmentation by revenue 2014
      • Table Tokyo Seimitsu: Business segmentation by revenue 2013-2015 ($ millions)
  • Key suggestions for investors/vendors
  • Appendix
    • List of abbreviations
  • Explore Technavio

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