About the Semiconductor Deposition Market
Semiconductor deposition is a process or technique of depositing a thin layer of a material on the surface area of a wafer or substrate. The added layer acts as a conductor, an insulator barrier, or a customized surface on which the semiconductor device pattern is etched. Materials that are used for the deposition are silicon, filaments, silicon dioxide, carbon nanotubes, tungsten, silicon carbide, silicon oxynitride, carbon fiber, silicon nitride, titanium nitride, silicon-germanium, and a number of high-k dielectrics. The thickness of the deposited layer usually ranges from a few to around 100 nm. Certain deposition techniques such as molecular beam epitaxy involve the deposition of a single layer of atom on the surface of wafers at a time. However, in CVD technology, the wafer is exposed to one or more volatile precursors, which react or decompose on the surface to give the desired deposit.
Technavio’s analysts forecast the global semiconductor deposition market to grow at a CAGR of 16.03% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor deposition market for 2016-2020. To calculate the market size, the report considers the sale of semiconductor deposition equipment to a number of global, regional, and local semiconductor device manufacturers.The report does not include the revenue generated from the resale and aftermarket service of deposition equipment as well as the sale of components that are used for repairs of such devices.
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Semiconductor Deposition market 2016-2020
Technavio recognizes the following companies as the key players in the global semiconductor deposition market: Applied Materials, ASM International, Hitachi Kokusai Electric, Lam Research, and Tokyo Electron.
Other Prominent Vendors in the market are: AIXTRON, CANON ANELVA, IHI, IQE, Plasma-Therm, and Veeco Instruments.
Commenting on the report, an analyst from Technavio’s team said: “A trend propelling market growth is the growing number of IoT applications. The IoT is one of the fastest-growing technologies in the world. A total of 30 billion devices are estimated to be connected through the IoT by 2020, generating a total of about 50 trillion GB of data. The IoT-connected devices use sensors and actuators to collect and transmit data to a centralized location on a real-time basis. This empowers the users to take informed decisions. As a result, the adoption of the IoT is increasing in a number of market segments such as consumer electronics, automotive, and medical.”
According to the report, a key growth driver is the miniaturization of semiconductor devices. The global semiconductor market is shifting toward miniaturization. Optimization in semiconductor device manufacturing technology along with the emergence of compact devices such as smartphones, tablets, compact notebooks, and slim and curved TVs has created massive demand for small-sized ICs. Sectors such as telecommunications, automotive, industrial manufacturing, and healthcare are also looking to utilize compact electronic devices. The advent of new technologies such as 3D ICs and microelectromechanical system (MEMS) has resulted in changes in IC designing such as finer patterning and etching in microfabrication.
Further, the report states that one challenge that could hamper market growth is the cyclical nature of the semiconductor industry.
Applied Materials, ASM International, Hitachi Kokusai Electric, Lam Research, Tokyo Electron, AIXTRON, CANON ANELVA, IHI, IQE, Plasma-Therm, Veeco Instruments.
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