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Global Semiconductor Chip Packaging Market 2017-2021

Global Semiconductor Chip Packaging Market 2017-2021

About Semiconductor Chip Packaging

The growth in the applications of semiconductor chips in industries such as the power, energy, medical, electric vehicles, automobiles, networking and telecommunications, consumer applications, military, aerospace and defense, motor control applications, and robotics is driving the market. Thus, the market for packaging equipment is expected to gain substantial ground during the forecast period, as packaged chips are used to improve functionality and performance of the devices in which they are applied.

Technavio’s analysts forecast the global semiconductor chip packaging market to grow at a CAGR of 31.1% during the period 2017-2021.Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor chip packaging market for 2017-2021. To calculate the market size, the report considers the revenue generated from semiconductor chip packaging.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Semiconductor Chip Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Applied Materials
  • ASM Pacific Technology
  • Kulicke & Soffa Industries
  • TEL
  • Tokyo Seimitsu
Market driver
  • Growing number of fabs
  • For a full, detailed list, view our report
Market challenge
  • Increasing complexity of semiconductor IC designs
  • For a full, detailed list, view our report
Market trend
  • Development of 3D chip packaging
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – Global Semiconductor Chip Packaging Market 2017-2021

Technavio recognizes the following companies as the key players in the global semiconductor chip packaging market: Applied Materials, ASM Pacific Technology, Kulicke & Soffa Industries, TEL, and Tokyo Seimitsu

Commenting on the report, an analyst from Technavio’s team said: “Foundries are using 3D packages to meet the demand from electronic product manufacturers, which are looking to reduce the space consumed by ICs in their devices. However, the reduction in the size of the ICs should not compromise the power-saving ability of the devices. 3D packaging involves the stacking of multiple chips into a single stack, thereby occupying less space in a device. The emergence of this chip packaging will provide semiconductor foundries with new business opportunities in the future, thereby propelling the growth of the semiconductor chip packaging market during the forecast period.”

According to the report, the demand for semiconductor chips and memory devices from consumer electronics is increasing due to the growing popularity of IoT-connected devices. Due to its cyclical nature, the semiconductor industry slowed down in 2016. The Chinese economy is also growing at a sluggish rate.

Further, the report states that the growing functionalities of consumer electronic devices have led to increased demand for multifunctional ICs. This has propelled semiconductor manufacturers to develop new and more complex architecture and design of semiconductor ICs. Based on these designs, the manufacturing process of semiconductor ICs is getting complex. This has created the demand for more sophisticated WLP solutions in the market.

Companies Mentioned

Applied Materials, ASM Pacific Technology, Kulicke & Soffa Industries, TEL, Tokyo Seimitsu.

  • Executive summary
  • Scope of the report
    • Market overview
      • Base year
    • Market reportage
    • Geographical coverage
      • Table List of countries in key regions
    • Vendor segmentation
    • Common currency conversion rates
      • Table Currency conversions
    • Top-vendor offerings
      • Table Product offerings
  • Market research methodology
    • Research methodology
    • Economic indicators
  • Introduction
    • Key market highlights
  • Technology landscape
    • Semiconductor IC manufacturing process
      • Table Semiconductor IC manufacturing process
      • Table Front-end chip formation steps
      • Table Back-end chip formation steps
    • WLP versus die-level packaging and assembly
    • Roadmap of semiconductor packaging industry
      • Table Semiconductor packaging industry
      • Table 2.5D IC block diagram
      • Table 3D IC block diagram
    • Ecosystem of semiconductor IC packaging industry
      • Table Old semiconductor IC packaging industry supply chain
      • Table New semiconductor IC packaging industry supply chain
  • Market landscape
    • Market overview
      • Table Global semiconductor chip packaging market segmentation
    • Market size and forecast
      • Table Global semiconductor chip packaging market 2016-2021 ($ billions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by OSATs and IDMs
    • Global semiconductor chip packaging market by OSATs and IDMs
      • Table Global semiconductor chip packaging market by OSATs and IDMs2016 (% share)
      • Table Global semiconductor chip packaging market by end-user 2021 (% share)
    • OSATs
    • IDMs
  • Market segmentation by packaging techniques
    • Table Global semiconductor chip packaging market segmentation by packaging techniques 2016-2021 (% share)
    • Table Global semiconductor chip packaging market segmentation by packaging techniques 2016-2021 ($ billions)
    • Flip-chip wafer bumping
      • Table Global semiconductor chip packaging market for flip-chip wafer bumping 2016-2021 ($ billions)
    • 2.5D interposers
      • Table Global semiconductor chip packaging market for 2.5D interposers 2016-2021 ($ billions)
    • Fan-in WL CSP
      • Table Global semiconductor chip packaging market for fan-in WL CSP 2016-2021 ($ billions)
    • 3D WLP
      • Table Global semiconductor chip packaging market by 3D WLP 2016-2020 ($ billions)
    • FO WLP/SiP
      • Table Global semiconductor chip packaging market for FO WLP/SiP 2016-2021 ($ billions)
    • 3D IC TSV stacks
      • Table Global semiconductor chip packaging market for 3DIC TSV stacks 2016-2021 ($ billions)
  • Geographical segmentation
    • Market overview
      • Table Global semiconductor chip packaging market by geography 2016-2021 (% share)
      • Table Global semiconductor chip packaging market by geography 2015-2021 ($ billions)
    • APAC
    • Americas
    • EMEA
  • Key leading countries
    • Table Key leading countries
    • USA
    • Taiwan
  • Market drivers
    • Growing number of fabs
      • Table Global semiconductor chip packaging market 2016-2021 (% share)
    • Increase in miniaturization of electronic devices
      • Table Global MEMS market 2016-2021 ($ billions)
    • High adoption of semiconductor ICs in automobiles
      • Table Cars shipment growth 2016-2021 (%)
    • Increase in number of fabless semiconductor companies
  • Impact of drivers
    • Table Impact of drivers
  • Market challenges
    • High initial investment
    • Increasing complexity of semiconductor IC designs
    • Rapid technological changes
  • Impact of drivers and challenges
    • Table Impact of drivers and challenges
  • Market trends
    • Development of 3D chip packaging
    • Growing popularity of FOWLP technology
    • Increase in wafer size
      • Table Timeline for semiconductor wafer size advances
  • Vendor landscape
    • Competitive scenario
    • Vendor landscape
      • Table Other vendors in global semiconductor chip packaging market
  • Appendix
    • List of abbreviations
  • Explore Technavio

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