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Global Semiconductor Capital Equipment Market 2019-2023

Global Semiconductor Capital Equipment Market 2019-2023

About this market

Owing to the rising need for semiconductor memory devices due to the rapidly advancing dynamics of consumer electronics, the semiconductor memory devices market demand is expected to rise throughout the forecast period. Technavio’s analysts have predicted that the semiconductor capital equipment market will register a CAGR of more than 6% by 2023.

Market Overview

Rising number of fabs

The increasing need for creating ICs for different applications is leading to the rising construction of fabs. Such rising construction of fabs will proliferate the semiconductor production capacity, in turn, leading to the continuous growth of the semiconductor capital equipment market in the forthcoming years.

Shortage of skilled and trained personnel

The lack of knowledge and skills in the fields of engineering and technology owing to the gradual decline in technical education programs across schools is hindering the growth of the semiconductor market, in turn, impacting the semiconductor capital equipment market adversely during the forecast period.

For the detailed list of factors that will drive and challenge the growth of the semiconductor capital equipment market during the 2019-2023, view our report.

Competitive Landscape

The market is quite fragmented and with the increasing presence of various regional players, the market competition is likely to become quite intense. As more and more vendors focus on increasing the production capacity, the competition will rise in the forthcoming years. The research report offers detailed insights about the market players which will help the clients in making strategic business decisions.


PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
2.1 Preface
2.2 Preface
2.3 Currency conversion rates for US$
PART 03: MARKET LANDSCAPE
Market ecosystem
Market characteristics
Market segmentation analysis
PART 04: MARKET SIZING
Market definition
Market sizing 2018
Market size and forecast 2018-2023
PART 05: FIVE FORCES ANALYSIS
Bargaining power of buyers
Bargaining power of suppliers
Threat of new entrants
Threat of substitutes
Threat of rivalry
Market condition
PART 06: MARKET SEGMENTATION BY TYPE
Market segmentation by type
Comparison by type
Wafer-level manufacturing equipment - Market size and forecast 2018-2023
Packaging and assembly equipment - Market size and forecast 2018-2023
Automated test equipment - Market size and forecast 2018-2023
Market opportunity by type
PART 07: CUSTOMER LANDSCAPE
PART 08: GEOGRAPHIC LANDSCAPE
Geographic segmentation
Geographic comparison
APAC - Market size and forecast 2018-2023
Americas - Market size and forecast 2018-2023
EMEA - Market size and forecast 2018-2023
Key leading countries
Market opportunity
PART 09: DECISION FRAMEWORK
PART 10: DRIVERS AND CHALLENGES
Market drivers
Market challenges
PART 11: MARKET TRENDS
Advances in wafer size
Growing demand for 14-nm/16-nm FinFET technology
Increased need for semiconductor memory devices
PART 12: VENDOR LANDSCAPE
Overview
Landscape disruption
PART 13: VENDOR ANALYSIS
Vendors covered
Vendor classification
Market positioning of vendors
Applied Materials
ASML
Hitachi High-Technologies
LAM RESEARCH
Tokyo Electron
PART 14: APPENDIX
Research methodology
List of abbreviations
PART 15: EXPLORE TECHNAVIO
Exhibit 01: Years in consideration
Exhibit 02: Global semiconductor capital spending market
Exhibit 03: Segments of global semiconductor capital spending market
Exhibit 04: Market characteristics
Exhibit 05: Market segments
Exhibit 06: Market definition - Inclusions and exclusions checklist
Exhibit 07: Market size 2018
Exhibit 08: Global market: Size and forecast 2018-2023 ($ billions)
Exhibit 09: Global market: Year-over-year growth 2019-2023 (%)
Exhibit 10: Five forces analysis 2018
Exhibit 11: Five forces analysis 2023
Exhibit 12: Bargaining power of buyers
Exhibit 13: Bargaining power of suppliers
Exhibit 14: Threat of new entrants
Exhibit 15: Threat of substitutes
Exhibit 16: Threat of rivalry
Exhibit 17: Market condition - Five forces 2018
Exhibit 18: Type - Market share 2018-2023 (%)
Exhibit 19: Comparison by type
Exhibit 20: Wafer-level manufacturing equipment - Market size and forecast 2018-2023 ($ billions)
Exhibit 21: Wafer-level manufacturing equipment - Year-over-year growth 2019-2023 (%)
Exhibit 22: Packaging and assembly equipment - Market size and forecast 2018-2023 ($ billions)
Exhibit 23: Packaging and assembly equipment - Year-over-year growth 2019-2023 (%)
Exhibit 24: Automated test equipment - Market size and forecast 2018-2023 ($ billions)
Exhibit 25: Automated test equipment - Year-over-year growth 2019-2023 (%)
Exhibit 26: Market opportunity by type
Exhibit 27: Customer landscape
Exhibit 28: Market share by geography 2018-2023 (%)
Exhibit 29: Geographic comparison
Exhibit 30: APAC - Market size and forecast 2018-2023 ($ billions)
Exhibit 31: APAC - Year-over-year growth 2019-2023 (%)
Exhibit 32: Americas - Market size and forecast 2018-2023 ($ billions)
Exhibit 33: Americas - Year-over-year growth 2019-2023 (%)
Exhibit 34: EMEA - Market size and forecast 2018-2023 ($ billions)
Exhibit 35: Foundries in EMEA
Exhibit 36: EMEA - Year-over-year growth 2019-2023 (%)
Exhibit 37: Key leading countries
Exhibit 38: Market opportunity
Exhibit 39: Decision framework
Exhibit 40: Impact of drivers and challenges
Exhibit 41: Timeline of changes in semiconductor wafer sizes
Exhibit 42: Vendor landscape
Exhibit 43: Landscape disruption
Exhibit 44: Vendors covered
Exhibit 45: Vendor_analysis1
Exhibit 46: Vendor classification
Exhibit 47: Market positioning of vendors
Exhibit 48: Applied Materials - Vendor overview
Exhibit 49: Applied Materials - Business segments
Exhibit 50: Applied Materials - Organizational developments
Exhibit 51: Applied Materials - Geographic focus
Exhibit 52: Applied Materials - Segment focus
Exhibit 53: Applied Materials - Key offerings
Exhibit 54: ASML - Vendor overview
Exhibit 55: ASML - Organizational developments
Exhibit 56: ASML - Geographic focus
Exhibit 57: ASML - Key offerings
Exhibit 58: Hitachi High-Technologies - Vendor overview
Exhibit 59: Hitachi High-Technologies - Business segments
Exhibit 60: Hitachi High-Technologies - Organizational developments
Exhibit 61: Hitachi High-Technologies - Geographic focus
Exhibit 62: Hitachi High-Technologies - Segment focus
Exhibit 63: Hitachi High-Technologies - Key offerings
Exhibit 64: LAM RESEARCH - Vendor overview
Exhibit 65: LAM RESEARCH - Geographic focus
Exhibit 66: LAM RESEARCH - Key offerings
Exhibit 67: Tokyo Electron - Vendor overview
Exhibit 68: Tokyo Electron - Business segments
Exhibit 69: Tokyo Electron - Organizational developments
Exhibit 70: Tokyo Electron - Geographic focus
Exhibit 71: Tokyo Electron - Segment focus
Exhibit 72: Tokyo Electron - Key offerings
Exhibit 73: Research framework
Exhibit 74: Validation techniques employed for market sizing
Exhibit 75: Information sources
Exhibit 76: List of abbreviations

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