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Global Semiconductor Assembly and Testing Services Market 2017-2021

Global Semiconductor Assembly and Testing Services Market 2017-2021

About Semiconductor Assembly and Testing Services

The number of electronic devices we use in our day-to-day life has been increasing in the past few decades. These devices range from simple media players, smartphones, laptops, and TVs to wearable smart watches and Internet of Things (IoT) devices such as connected thermostats, automated lighting, and remote health monitoring equipment. Semiconductor assembly and testing services (SATS) or outsourced semiconductor assembly and testing (OSAT) refers to the outsourcing of integrated circuit packaging and final product testing to third-party service providers.

Technavio’s analysts forecast the global semiconductor assembly and testing services market to grow at a CAGR of 5.68% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor assembly and testing services market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Semiconductor Assembly and Testing Services Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Amkor Technology
  • ASE Group
  • Jiangsu Changjiang Electronics Technology (JCET)
  • Powertech Technology
  • Siliconware Precision Industries (SPIL)
Other prominent vendors
  • Chipbond Technology
  • ChipMOS TECHNOLOGIES
  • FormFactor
  • Formosa Advanced Technologies
  • King Yuan ELECTRONICS
  • Lingsen Precision Industries
  • PSi Technologies
  • SIGNETICS
  • Tessolve Semiconductor
  • Tianshui Huatian Technology
  • Unisem
  • UTAC
Market driver
  • Growth of cloud-based servers and big data services
  • For a full, detailed list, view our report
Market challenge
  • Highly cyclic nature of electronics industry
  • For a full, detailed list, view our report
Market trend
  • Growth of advanced system in package (SiP) modules
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?


Press Release

Technavio Announces the Publication of its Research Report – Global Semiconductor Assembly and Testing Services Market 2017-2021

Technavio recognizes the following companies as the key players in the global semiconductor assembly and testing services market: Amkor Technology, ASE Group, Jiangsu Changjiang Electronics Technology (JCET), Powertech Technology, and Siliconware Precision Industries (SPIL).

Other Prominent Vendors in the market are: Chipbond Technology, ChipMOS TECHNOLOGIES, FormFactor, Formosa Advanced Technologies, King Yuan ELECTRONICS, Lingsen Precision Industries, PSi Technologies, SIGNETICS, Tessolve Semiconductor, Tianshui Huatian Technology, Unisem, and UTAC.

Commenting on the report, an analyst from Technavio’s team said: “One trend in the market is growth of advanced system in package (SiP) modules. A system in a package refers to the technology that enables the integration of several integrated circuits (ICs) within a single package. These packages combine many of the functions performed by different ICs into a single module, which can perform all these operations single-handedly.”

According to the report, one driver in the market is growth of cloud-based servers and big data services. Cloud computing is an Internet-based computing technology that allows devices with limited processing or storage capabilities to store and process data and resources on remote servers; the processed information is delivered back to the original device in real time. With the information collected by various devices becoming increasingly large and complex, the demand for cloud computing applications is growing exponentially.

Further, the report states that one challenge in the market is highly cyclic nature of electronics industry. The sale of electronic goods and equipment is highly cyclic in nature and their demand varies greatly with the economic situation; this leads to wide fluctuations in unit demand for the services of the SATS industry. SATS companies have low per unit sale margins and are heavily dependent on high volume demand to maintain their growth. Since the cycle of technology and seasonal demand are largely unpredictable, it becomes a challenge for many SATS companies to adjust rapidly to the changes in the market conditions.

Companies Mentioned

Amkor Technology, ASE Group, Jiangsu Changjiang Electronics Technology (JCET), Powertech Technology, Siliconware Precision Industries (SPIL), Chipbond Technology, ChipMOS TECHNOLOGIES, FormFactor, Formosa Advanced Technologies, King Yuan ELECTRONICS, Lingsen Precision Industries, PSi Technologies, SIGNETICS, Tessolve Semiconductor, Tianshui Huatian Technology, Unisem, and UTAC.

  • Executive summary
  • Scope of the report
  • Research Methodology
  • Introduction
    • Market outline
      • Table Major semiconductor chip end-users
      • Table Integrated chipset manufacturing process
  • Market landscape
    • Market overview
      • Table Global semiconductor assembly and testing services market overview
    • Market size and forecast
      • Table Global semiconductor assembly and testing services market 2017-2021 ($ billions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by service
    • Market overview
      • Table Global semiconductor assembly and testing services market by service type 2016-2021 (%)
      • Table Global semiconductor assembly and testing services market by service type 2016-2021 ($ billions)
    • Assembly services
      • Table Global semiconductor assembly and testing services market by assembly service2016-2021 ($ billions)
      • Table Annual decline in global smartphone ASP (2012-2019)
    • Testing services
      • Table Global semiconductor assembly and testing services market by testing services2016-2021 ($ billions)
  • Geographical segmentation
    • Market overview
      • Table Global semiconductor assembly and testing services market by geography 2016and 2021 (%)
      • Table Global semiconductor assembly and testing services market by geography 2016-2021 ($ billions)
    • Semiconductor assembly and testing services market in APAC
      • Table Semiconductor assembly and testing services market in APAC 2017-2021($ billions)
      • Table Per capita GDP growth of selected Asian countries 2010-2015 ($)
    • Semiconductor assembly and testing services market in Americas
      • Table Semiconductor assembly and testing services market in Americas ($ billions)
    • Semiconductor assembly and testing services market in EMEA
      • Table Semiconductor assembly and testing services market in EMEA ($ billions)
  • Decision framework
  • Drivers and challenges
    • Market drivers
      • Table Global vehicle sales growth 2011-2016
    • Market challenges
  • Market trends
    • Growth of advanced system in package (SiP) modules
    • Increasing focus of semiconductor suppliers on core competencies
    • Growing demand for FOWLP solutions
  • Vendor landscape
    • Competitive scenario
      • Table Key vendors 2016
    • Other prominent vendors
      • Table Other prominent vendors
  • Key vendor analysis
    • Amkor Technology
      • Table Amkor Technology: Product portfolio
      • Table Amkor Technology: Key news
    • ASE Group
      • Table ASE Group: Product portfolio
      • Table ASE Group: Key news
    • Jiangsu Changjiang Electronics Technology (JCET)
      • Table Jiangsu Changjiang Electronics Technology: Product portfolio
      • Table Jiangsu Changjiang Electronics Technology: Key news
    • Powertech Technology
      • Table Powertech technology: Product portfolio
      • Table Powertech Technology: Key news
    • Siliconware Precision Industries (SPIL)
      • Table Silicon Precision Industries: Product portfolio
      • Table Siliconware Precision Industries: Key news
  • Appendix
    • List of abbreviations
  • Explore Technavio

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