Market Research Logo

Global Semiconductor Assembly Equipment Market 2017-2021

Global Semiconductor Assembly Equipment Market 2017-2021

About Semiconductor Assembly Equipment

Semiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the back-end process of chip formation. Chip assembly basically involves attaching or joining two or more semiconductor wafers or semiconductor devices to increase the functionality of chips. Machinery is used for making interconnects between an IC or any other semiconductor device during assembly. This connection ensures the flow of electricity in the semiconductor device.

Technavio’s analysts forecast the global semiconductor assembly equipment market to grow at a CAGR of 3.57% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor assembly equipment market for 2017-2021. To calculate the market size, the report considers the sales of assembly equipment to end-users.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Semiconductor Assembly Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • ASM Pacific Technology
  • Kulicke & Soffa Industries
  • Palomar Technologies
  • Tokyo Electron
  • Tokyo Seimitsu
Other prominent vendors
  • Besi
  • ChipMOS TECHNOLOGIES
  • DIAS Automation
  • Greatek Electronics
  • Hesse Mechatronics
  • Hybond
  • Shinkawa
  • Toray Engineering
  • West
  • Bond
Market driver
  • Incentives and discounts for long-term customers
  • For a full, detailed list, view our report
Market challenge
  • High-investment market
  • For a full, detailed list, view our report
Market trend
  • Growing use of 3D packaging technology
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – Global Semiconductor Assembly Equipment Market 2017-2021
Technavio recognizes the following companies as the key players in the global semiconductor assembly equipment market: ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron, and Tokyo Seimitsu.
Other Prominent Vendors in the market are: Besi, ChipMOS TECHNOLOGIES, DIAS Automation, Greatek Electronics, Hesse Mechatronics, Hybond, Shinkawa, Toray Engineering, and West Bond.
Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is growing use of 3D packaging technology. Foundries are using 3D packaging technology to meet the demands of electronic device manufacturers. These manufacturers are focusing on reducing the space occupied by ICs in their devices without compromising on power-saving capabilities. 3D packaging involves the stacking of multiple chips in a single stack, thereby utilizing the least possible space in a device.”
According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is defined by relationship-based sales. The selling price of assembly equipment is usually in the range of $100,000-1,000,000. Therefore, manufacturers look to develop long-standing relations with customers that buy their products. The aim of such relations is to convince their customers to procure equipment from them.

Further, the report states that one of the major factors hindering the growth of this market is high-investment market. The increase in the demand for compact ICs and emergence of new 3D packaging solutions such as stacked packaging, microelectromechanical system packaging, and flip-chip packaging have compelled manufacturers to modify their production processes. Thus, manufacturers have to make significant investments to produce compact, efficient, and reliable ICs.


Companies Mentioned

ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron, Tokyo Seimitsu, Besi, ChipMOS TECHNOLOGIES, DIAS Automation, Greatek Electronics, Hesse Mechatronics, Hybond, Shinkawa, Toray Engineering, and West Bond.

  • Executive summary
  • Scope of the report
  • Research Methodology
  • Introduction
    • Key market highlights
  • Technology overview
    • Overview of semiconductor assembly equipment
      • Table Steps in back-end chip formation
  • Market landscape
    • Semiconductor assembly equipment market:Overview
      • Table Supply chain in traditional semiconductor IC packaging industry
      • Table Supply chain in new semiconductor IC packaging industry
      • Table Global semiconductor assembly equipment market: Overview
    • Market size and forecast
      • Table Global semiconductor assembly equipment market 2016-2021 ($ billions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by type
    • Global semiconductor assembly equipment market by type
      • Table Global semiconductor assembly equipment market by type 2016-2021 (% share)
      • Table Global semiconductor assembly equipment market by type: Revenue trend line 2016-2021 ($ billions)
    • Global semiconductor assembly equipment market by die bonding equipment
      • Table Global semiconductor assembly equipment market by die bonding equipment 2016-2021 ($ billions)
    • Global semiconductor assembly equipment market by inspection and dicing equipment
      • Table Global semiconductor assembly equipment market by inspection and dicing equipment 2016-2021 ($ billions)
    • Global semiconductor assembly equipment market by packaging equipment
      • Table Global semiconductor assembly equipment market by packaging equipment 2016-2021 ($ billions)
    • Global semiconductor assembly equipment market by wire bonding equipment
      • Table Global semiconductor assembly equipment market by wire bonding equipment 2016-2021 ($ billions)
    • Global semiconductor assembly equipment market by plating equipment
      • Table Global semiconductor assembly equipment market plating equipment 2016-2021 ($ billions)
  • Market segmentation by end-user
    • Global semiconductor assembly equipment market by end-user
      • Table Global semiconductor assembly equipment market by end-user 2016-2021 (% share)
      • Table Global semiconductor assembly equipment market by end-user: Revenue trend line 2016-2021 ($ billions)
    • Global semiconductor assembly equipment market by OSATs
      • Table Global semiconductor assembly equipment market by OSATs 2016-2021 ($ billions)
    • Global semiconductor assembly equipment market by IDMs
      • Table Global semiconductor assembly equipment market by IDMs 2016-2021 ($ billions)
  • Geographical segmentation
    • Global semiconductor assembly equipment market by geography
      • Table Global semiconductor assembly equipment by geography 2016-2021 (% share)
      • Table Global semiconductor assembly equipment market by geography: Revenue trend line 2016-2021 ($ billions)
    • Semiconductor assembly equipment market in APAC
      • Table Semiconductor assembly equipment market in APAC 2016-2021 ($ billions)
    • Semiconductor assembly equipment market in Americas
      • Table Semiconductor assembly equipment market in Americas 2016-2021 ($ billions)
    • Semiconductor assembly equipment market in EMEA
      • Table Semiconductor assembly equipment market in EMEA 2016-2021 ($ millions)
  • Key leading countries
    • Global semiconductor assembly market: Key leading countries
      • Table Key leading countries
      • Table Global semiconductor assembly market: Key leading countries 2016-2021
    • Taiwan
    • South Korea
    • Japan
    • China
  • Decision framework
  • Drivers and challenges
    • Market drivers
      • Table Semiconductor devices by application 2016 and 2021 (% share)
    • Impact of drivers on key customer segments
      • Table Impact of drivers
    • Market challenges
      • Table Global semiconductor market trend 1992-2016 ($ billions)
    • Impact of challenges on key customer segments
      • Table Impact of challenges
  • Market trends
    • Growing use of 3D packaging technology
    • Increase in number of OSAT vendors
    • M&A in packaging and assembly market
    • Advent of FOWLP technology
    • Automation in automobiles
    • Increased need for semiconductor memory devices
      • Table CAGR of 3D NAND and DRAM 2016-2021
  • Vendor landscape
    • Competitive scenario
    • Major vendors
    • Other prominent vendors
      • Table Global semiconductor assembly equipment market: Other prominent vendors
  • Appendix
    • List of abbreviations
  • Explore Technavio

Download our eBook: How to Succeed Using Market Research

Learn how to effectively navigate the market research process to help guide your organization on the journey to success.

Download eBook

Share this report