Global Semiconductor Assembly Equipment Market 2017-2021
About Semiconductor Assembly Equipment
Semiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the back-end process of chip formation. Chip assembly basically involves attaching or joining two or more semiconductor wafers or semiconductor devices to increase the functionality of chips. Machinery is used for making interconnects between an IC or any other semiconductor device during assembly. This connection ensures the flow of electricity in the semiconductor device.
Technavio’s analysts forecast the global semiconductor assembly equipment market to grow at a CAGR of 3.57% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor assembly equipment market for 2017-2021. To calculate the market size, the report considers the sales of assembly equipment to end-users.
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Semiconductor Assembly Equipment Market 2017-2021
Technavio recognizes the following companies as the key players in the global semiconductor assembly equipment market: ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron, and Tokyo Seimitsu.
Other Prominent Vendors in the market are: Besi, ChipMOS TECHNOLOGIES, DIAS Automation, Greatek Electronics, Hesse Mechatronics, Hybond, Shinkawa, Toray Engineering, and West Bond.
Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is growing use of 3D packaging technology. Foundries are using 3D packaging technology to meet the demands of electronic device manufacturers. These manufacturers are focusing on reducing the space occupied by ICs in their devices without compromising on power-saving capabilities. 3D packaging involves the stacking of multiple chips in a single stack, thereby utilizing the least possible space in a device.”
According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is defined by relationship-based sales. The selling price of assembly equipment is usually in the range of $100,000-1,000,000. Therefore, manufacturers look to develop long-standing relations with customers that buy their products. The aim of such relations is to convince their customers to procure equipment from them.
Further, the report states that one of the major factors hindering the growth of this market is high-investment market. The increase in the demand for compact ICs and emergence of new 3D packaging solutions such as stacked packaging, microelectromechanical system packaging, and flip-chip packaging have compelled manufacturers to modify their production processes. Thus, manufacturers have to make significant investments to produce compact, efficient, and reliable ICs.
ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron, Tokyo Seimitsu, Besi, ChipMOS TECHNOLOGIES, DIAS Automation, Greatek Electronics, Hesse Mechatronics, Hybond, Shinkawa, Toray Engineering, and West Bond.
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