Global Polymer Based Thermal Interface Materials (TIM) Market 2015-2019
About Polymer-based TIM
TIM are materials used for supporting heat sink to remove heat from the heat sources in various equipment. They are generally used in the form of a secondary thermally conductive material to replace the thermally insulating air between the two surfaces. Besides helping in the efficient transfer of heat, TIM also act as adhesives and strengthen the mechanical link between surfaces. Polymer-based TIM are the most commonly used TIM, and owing to their superior conductive and adhesive properties, they find extensive usage for thermal management applications in various industrial sectors, including electrical and electronics, telecom, and automotive.
Technavio's analysts forecast the global polymer-based TIM market to grow at a CAGR of 11.19% over the period 2014-2019.
Covered in this Report
The major end-users of the global polymer-based TIM market are the following: computers, electrical and electronics, telecom, and automotive sectors.
Technavio's report, the Global Polymer-based TIM Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Americas, APAC and EMEA; it also covers the global polymer-based TIM market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.Key Regions
Technavio Announces the Publication of its Research Report – Global Polymer Based Thermal Interface Materials Market 2015-2019
Technavio recognizes the following companies as the key players in the Global Polymer Based Thermal Interface Materials Market: Cookson Electronics Assembly Materials, Dow Corning, Henkel, Honeywell International, Laird and Zalman Tech
Other Prominent Vendors in the market are: 3M, Aavid Thermalloy, AI Technology, Akasa Group, AMETEK Specialty Metal Products, AOS Thermal Compounds, Arctic Silver, Bergquist, Cast-Coat, Chomerics, Cool Polymers, Epoxies, Indium, Innovation Cooling, LORD, Master Bond, Materion, MG Chemicals, Momentive, NuSil Technology, ROGERS, Rubbercraft, Seal King Industrial, Shenzhen, Western Hemisphere Technology, Shin-Etsu Chemical, Stockwell Elastomerics, T-Global Technology, Thermal Transfer Composites, Timtronics, Universal Science, Vanguard products and Wakefield-Vette
Commenting on the report, an analyst from Technavio’s team said: “Although polymer-based TIM, since their advent, have been an integral part of the automotive industry, owing to the growing thermal management needs of new lightweight and high-speed consumer vehicles, their usage in this industry has significantly increased in recent years. This increased demand is expected to hugely benefit the growth of the market during the forecast period. In addition, the global demand for automobiles has increased in the last decade, especially from developing countries, because of an increase in per capita income and economic development. Therefore, with the global automobile market expected to witness constant growth during the forecast period, this trend is expected to continue in the coming years and is expected to drive the growth of the market.”
According to the report, growing demand for TIM products from the computers industry is one of the major drivers of market growth. TIM are globally used to provide efficient thermal management in PCs, laptops, and tablets. They are used to increase the thermal conductivity between the heat sink and the heat source in the computer's CPU by replacing the air between them with TIM. Along with being a better thermal conductor, TIM also act as adhesives, imparting mechanical strength to the link between the two surfaces. With the combined global demand for laptops, computers, and tablets expected to increase in the near future, the market is sure to gain.
Further, the report states that although polymer-based TIM accounted for the majority of consumption in the global TIM market in 2014, owing to the increasing popularity of PCTIM, CMC, and MMC for thermal management applications, their consumption in various industrial and commercial industries has declined in recent years.
Cookson Electronics Assembly Materials, Dow Corning, Henkel, Honeywell International, Laird, Zalman Tech, 3M, Aavid Thermalloy, AI Technology, Akasa Group, AMETEK Specialty Metal Products, AOS Thermal Compounds, Arctic Silver, Bergquist, Cast-Coat, Chomerics, Cool Polymers, Epoxies, Indium, Innovation Cooling, LORD, Master Bond, Materion, MG Chemicals, Momentive, NuSil Technology, ROGERS, Rubbercraft, Seal King Industrial, Shenzhen, Western Hemisphere Technology, Shin-Etsu Chemical, Stockwell Elastomerics, T-Global Technology, Thermal Transfer Composites, Timtronics, Universal Science, Vanguard products, Wakefield-Vette
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