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Global Organic Substrate Packaging Material Market 2015-2019

About organic substrate packaging materials

Organic substrates are the base layers of individual semiconductor devices and ICs on which other layers are deposited to complete a circuit. As these materials are part of the circuit, it is imperative that they are efficient conductors of electricity, and preferably thinner core materials are used to surround them in demanding system applications. A small die (block of semiconducting material made of silicon or gallium arsenide with a fabricated circuit) is mounted on the substrate, which connects the input and output terminals from the die to a PCB.

Organic substrates are surrounded by low-loss and ultra-thin materials that have a dielectric base. A thin film layer used to protect the semiconductors on the substrate is made of polyamide and polyester films. These materials are mainly used in area array packages such as BGA and PGA.

Technavio's analysts forecast the global organic substrate packaging materials market to grow at a CAGR of 5.41% over the period 2014-2019.

Covered in this report

This report covers the present scenario and the growth prospects of the global organic substrate packaging materials market for the period 2015-2019. The report provides the vendor landscape and a corresponding detailed analysis of the top six vendors in the market. The market segmentation is done based on the following:

  • Packaging technology
  • Geography
  • Technavio's report, Global Organic Substrate Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts.

    Key regions
    • APAC
    • Europe
    • North America
    • ROW
    Key vendors
    • AJINOMOTO
    • AMKOR
    • ASE Kaohsiung
    • Mitsubishi Gas Chemical
    • SPIL
    • STATS ChipPAC
    Market driver
    • Demand for wireless devices
    • For a full, detailed list, view our report
    Market challenge
    • Dependency on semiconductor equipment industry performance
    • For a full, detailed list, view our report
    Market trend
    • Popularity of redistributed chip packaging
    • For a full, detailed list, view our report
    Key questions answered in this report
    • What will the market size be in 2019 and what will the growth rate be?
    • What are the key market trends?
    • What is driving this market?
    • What are the challenges to market growth?
    • Who are the key vendors in this market space?
    • What are the market opportunities and threats faced by the key vendors?
    • What are the strengths and weaknesses of the key vendors?


    Press Release

    Technavio Announces the Publication of its Research Report – Global Organic Substrate Packaging Material Market 2015-2019
    Technavio recognizes the following companies as the key players in the Global Organic Substrate Packaging Material Market: ASE Kaohsiung, AMKOR, SPIL, STATS ChipPAC, Mitsubishi and AJINOMOTO
    Commenting on the report, an analyst from Technavio’s team said: “The growing demand for system integration, cost benefits, and complete system configuration will propel the growth of SiP during the forecast period. SiP dies can be stacked either vertically or horizontally, and they are connected to bonding wires and solder bumps. Apart from multiple ICs of different functionalities, it can contain passive components such as MEMS, mechanical parts, filters, and connectors in a single package. This ensures that the package functions as a motherboard, a sub-system in itself. They are implemented in RF and wireless devices like cellular phones, Bluetooth devices, and modems.”
    According to the report, LTE 4G network requires base station system on chip (SoC), which doubles the performance of LTE and reduces power consumption. SoC integrates all the components of a circuit on a single chip. It uses IC substrate chips as the base on which the circuit is built. It is available in ball grid packages. SoC has low manufacturing costs because of the presence of fewer packages than multichip systems, and the packaging is simple. Base stations can handle the immense amount of traffic in 4G network only with the use of SoC. Thus, the use of SoC in LTE network is increasing the demand for IC substrate chips, thereby driving the growth of the market.
    Further, the report states that the market is dependent on performance of global semiconductor equipment industry.

    Companies Mentioned

    ASE Kaohsiung, AMKOR, SPIL, STATS ChipPAC, Mitsubishi, AJINOMOTO

    • Executive summary
      • Highlights
    • Scope of the report
      • Market overview
        • Table Segmentation of global organic substrate packaging material market
      • Top vendor offerings
        • Table Product offerings
    • Market research methodology
      • Research methodology
      • Economic indicators
    • Introduction
      • Key market highlights
    • Market landscape
      • Market overview
        • Table Global organic substrate packaging material market
        • Table Geographical segmentation of global organic substrate packaging material market
        • Table Global organic substrate packaging material market by packaging technology
      • Market size and forecast
        • Table Global organic substrate packaging material market 2014-2019 ($ billions)
      • Five forces analysis
        • Table Five forces analysis
    • Market segmentation by packaging technology
      • Market segmentation by packaging technology
      • Global SO packaging technology overview
      • Global GA packaging technology overview
      • Global flat no-leads packaging technology overview
      • Global QFP packaging technology overview
      • Global DIP packaging technology overview
      • Global other packaging technologies overview
    • Geographical segmentation
      • Geographical segmentation of global organic substrate packaging material market 2014-2019
        • Table Geographical segmentation of global organic substrate packaging material market 2014
      • Organic substrate packaging material market in APAC
        • Table Organic substrate packaging material market in APAC 2014
      • Organic substrate packaging material market in Taiwan
        • Table Organic substrate packaging material market in Taiwan 2014-2019 ($ billions)
      • Organic substrate packaging material market in Japan
        • Table Organic substrate packaging material market in Japan 2014-2019 ($ billions)
      • Organic substrate packaging material market in South Korea
        • Table Organic substrate packaging material market in South Korea 2014-2019 ($ billions)
      • Organic substrate packaging material market in China
        • Table Organic substrate packaging material market in China 2014-2019 ($ billions)
      • Organic substrate packaging material market in North America
        • Table Organic substrate packaging material market in North America 2014-2019 ($ billions)
      • Organic substrate packaging material market in Europe
        • Table Organic substrate packaging material market in Europe 2014-2019 ($ billions)
    • Key leading countries
      • Taiwan
      • South Korea
      • China
    • Market drivers
      • Growth drivers
    • Impact of drivers
      • Table Impact of drivers
    • Market challenges
    • Impact of drivers and challenges
      • Table Impact of drivers and challenges
    • Market trends
    • Vendor landscape
      • Competitive scenario
      • Key market vendors 2014
        • Table Key market vendors 2014
    • Key vendor analysis
      • Ajinomoto
        • Table Ajinomoto: Business segmentation by revenue 2014
        • Table Ajinomoto: Geographical segmentation 2014
      • Amkor Technology
        • Table Amkor Technology: Product segmentation by revenue 2014
        • Table Amkor Technology: Product segmentation comparison by revenue 2013 and 2014 ($ billions)
        • Table Amkor Technology: Geographical segmentation by revenue 2014
      • ASE Kaohsiung
      • Mitsubishi Gas Chemical Company
        • Table Mitsubishi Gas Chemical Company: Business segmentation 2014
        • Table Mitsubishi Gas Chemical Company: Product segmentation by revenue 2014
        • Table Mitsubishi Gas Chemical Company: Geographical segmentation by revenue 2014
      • Siliconware Precision Industries
        • Table Siliconware Precision Industries: Business segmentation by revenue 2014
        • Table Siliconware Precision Industries: Business segmentation by revenue 2013 and 2014 ($ billions)
        • Table Siliconware Precision Industries: Geographical segmentation by revenue 2014
      • STATS ChipPAC
        • Table STATS ChipPAC: Product segmentation by revenue 2014
        • Table STATS ChipPAC: Geographical segmentation by revenue 2013
    • Appendix
      • List of abbreviation
    • Explore Technavio

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