Global I/O Modules Market in Process Industries 2016-2020
About I/O Modules in Process Industries
An I/O module acts as a mediator between the controller (PLC, DCS, and industrial PC) and an I/O device. It controls the information exchange between the peripheral devices. The physical media by which an I/O module is connected varies by application and bus/network.
Technavio’s analysts forecast the global I/O modules in process industries market to grow at a CAGR of 4.68% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global I/O modules in process industries market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales and aftermarket services of I/O modules in automotive, electronics and semiconductor manufacturing, industrial machinery manufacturing, and aerospace and defense industries.The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global I/O Modules Market in Process Industries 2016-2020
Technavio recognizes the following companies as the key players in the global I/O modules market in process industries: ABB, Rockwell Automation, Siemens, and Emerson Electric
Other Prominent Vendors in the market are: Acromag, Advantech, B&R, Beckhoff Automation, Festo, GE, Hitachi, IDEC, Mitsubishi Electric, Moeller, National Instruments, Omron, Parsec Automation, Pepperl+Fuchs, RS Component, TURCK India Automation, Wago, Yamatake Control Products, and Yokogawa
Commenting on the report, an analyst from Technavio’s team said: “Ethernet has become a major network protocol for data transfer in industries due to its low cost and ease of integration. Ethernet is increasingly used as the physical layer in the fieldbus I/O. This is due to the ability of the automation industry to industrialize consumer-driven commodity products for fieldbus implementation, thereby driving down development costs. An estimated 52.5% of the nodes networked or under evaluation for Ethernet based networking are I/O related.”
According to the report, distributed I/O modules installed in a communication network in discrete industries enable I/O data to be spread across the machine and outside of the cabinet, thereby lowering the overall hardware costs of the system. End-users are showing interest in distributed modular I/O technology because it lowers the cost per point of the control designs and reduces the total time of integration. By using modular I/O modules, the I/O slices can be separated from the communication network and are designed for mounting on the machines in small pockets of distributed I/O.
Further, the report states that the I/O modules market is marked by multiple local, regional, and international vendors offering similar products at competitive prices. This has created intense competition among vendors, wherein they are compelled to differentiate their products by providing additional support and services to end-users. Low-cost I/O modules are offered by manufacturers in developing countries such as India and China to gain larger market shares. Thus, the European and the US manufacturers dominating the market are feeling the heat and have been forced to adopt vertical integration.
ABB, Rockwell Automation, Siemens, Emerson Electric, Acromag, Advantech, B&R, Beckhoff Automation, Festo, GE, Hitachi, IDEC, Mitsubishi Electric, Moeller, National Instruments, Omron, Parsec Automation, Pepperl+Fuchs, RS Component, TURCK India Automation, Wago, Yamatake Control Products, Yokogawa
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