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Global High-bandwidth Memory Market 2018-2022

Global High-bandwidth Memory Market 2018-2022

About High-bandwidth Memory

High-bandwidth memory (HBM) is a dynamic random-access memory (DRAM) technology approved by the Joint Electron Device Engineering Council (JEDEC) as an industry standard. The technology uses through-silicon vias (TSVs) and a silicon interposer technology to interconnect stacked DRAM dies.

Technavio’s analysts forecast the global high-bandwidth memory market to grow at a CAGR of 32.09% during the period 2018-2022.

Covered in this report

The report covers the present scenario and the growth prospects of the global high-bandwidth memory market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global High-bandwidth Memory Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Advanced Micro Devices
  • Intel
  • SAMSUNG
  • SK HYNIX
  • XILINX
Market driver
  • Increasing demand for HPC
  • For a full, detailed list, view our report
Market challenge
  • Exorbitant costs
  • For a full, detailed list, view our report
Market trend
  • Growth of AI
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?


  • Executive summary
  • Scope of the report
  • Research methodology
  • Market landscape
    • Market ecosystem
      • Table Parent market
      • Table Global memory module market
    • Market characteristics
      • Table Market characteristics
    • Market segmentation analysis
      • Table Market segments
  • Market sizing
    • Market definition
      • Table Market definition - Inclusions and exclusions checklist
    • Market sizing 2017
      • Table Market size 2017
      • Table Validation techniques employed for market sizing 2017
    • Market size and forecast 2017-2022
      • Table Global – Market size and forecast 2017-2022 ($ mn)
      • Table Global – Year-over-year growth 2018-2022 (%)
  • Five forces analysis
    • Table Five forces analysis 2017
    • Table Five forces analysis 2022
    • Bargaining power of buyers
      • Table Bargaining power of buyers
    • Bargaining power of suppliers
      • Table Bargaining power of suppliers
    • Threat of new entrants
      • Table Threat of new entrants
    • Threat of substitutes
      • Table Threat of substitutes
    • Threat of rivalry
      • Table Threat of rivalry
    • Market condition
      • Table Market condition - Five forces 2017
  • Market segmentation by application
    • Segmentation by application
      • Table Application – Market share 2017-2022 (%)
    • Comparison by application
      • Table Comparison by application
    • HPC – Market size and forecast 2017-2022
      • Table HPC – Market size and forecast 2017-2022 ($ mn)
      • Table HPC – Year-over-year growth 2018-2022 (%)
    • Graphics – Market size and forecast 2017-2022
      • Table Graphics – Market size and forecast 2017-2022 ($ mn)
      • Table Graphics – Year-over-year growth 2018-2022 (%)
    • Others – Market size and forecast 2017-2022
      • Table Others – Market size and forecast 2017-2022 ($ mn)
      • Table Others – Year-over-year growth 2018-2022 (%)
    • Market opportunity by application
      • Table Market opportunity by application
  • Market segmentation by product
    • Segmentation by product
    • GPU – Market analysis
    • CPU – Market analysis
    • APU – Market analysis
    • ASIC – Market analysis
    • FPGA – Market analysis
  • Customer landscape
    • Table Customer landscape
  • Regional landscape
    • Geographical segmentation
      • Table Global – Market share by geography 2017-2022 (%)
    • Regional comparison
      • Table Comparison by region
    • Americas – Market size and forecast 2017-2022
      • Table Americas – Market size and forecast 2017-2022 ($ mn)
      • Table Americas – Year-over-year growth 2018-2022 (%)
    • APAC – Market size and forecast 2017-2022
      • Table APAC – Market size and forecast 2017-2022 ($ mn)
      • Table APAC – Year-over-year growth 2018-2022 (%)
    • EMEA – Market size and forecast 2017-2022
      • Table EMEA – Market size and forecast 2017-2022 ($ mn)
      • Table EMEA – Year-over-year growth 2018-2022 (%)
    • Key leading countries
      • Table Key leading countries
    • Market opportunity
      • Table Market opportunity
  • Decision framework
  • Drivers and challenges
    • Market drivers
    • Market challenges
  • Market trends
    • Growth of AI
    • Increasing interest in HMC
    • Increasing interest in quantum computing
  • Vendor landscape
    • Overview
      • Table Vendor landscape
    • Landscape disruption
      • Table Landscape disruption
    • Competitive scenario
  • Vendor analysis
    • Vendors covered
      • Table Vendors covered
    • Vendor classification
      • Table Vendor classification
    • Market positioning of vendors
      • Table Market positioning of vendors
    • Advanced Micro Devices
      • Table Vendor overview
      • Table Advanced Micro Devices – Business segments
      • Table Advanced Micro Devices – Organizational developments
      • Table Advanced Micro Devices – Geographic focus
      • Table Advanced Micro Devices – Segment focus
      • Table Advanced Micro Devices – Key offerings
    • Intel
      • Table Intel: Overview
      • Table Intel – Business segments
      • Table Intel – Organizational developments
      • Table Intel – Geographic focus
      • Table Intel– Segment focus
      • Table Intel– Key offerings
    • SAMSUNG
      • Table SAMSUNG: Overview
      • Table SAMSUNG – Business segments
      • Table SAMSUNG – Organizational developments
      • Table SAMSUNG – Geographic focus
      • Table SAMSUNG – Segment focus
      • Table SAMSUNG – Key offerings
    • SK HYNIX
      • Table SK HYNIX: Overview
      • Table SK HYNIX – Business segments
      • Table SK HYNIX – Organizational developments
      • Table SK HYNIX – Geographic focus
      • Table SK HYNIX – Segment focus
      • Table SK HYNIX – Key offerings
    • XILINX
      • Table XILINX: Overview
      • Table XILINX – Business segments
      • Table XILINX – Organizational developments
      • Table XILINX – Geographic focus
      • Table XILINX– Key offerings
  • Appendix
    • List of abbreviations
  • Explore Technavio

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