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Global Flip Chip Packages Market 2018-2022

Global Flip Chip Packages Market 2018-2022

About Flip Chip Packaging

Flip chip is a packaging technology that interconnects chips and package carriers or substrates with conductive bumps. The use of the technology in semiconductor chip packaging ensures a direct electrical connection of face-down electronic dies with organic or ceramic circuit boards using conductive bumps on the chip bond pads.

Technavio’s analysts forecast the global flip chip packages market to grow at a CAGR of 6.35% during the period 2018-2022.

Covered in this report

The report covers the present scenario and the growth prospects of the global flip chip packages market for 2018-2022. To calculate the market size, the report considers the sales of semiconductor devices based on flip chip packaging technology to end-user sectors including communication, computing and networking, industrial, and automotive.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Flip Chip Packages Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Advanced Semiconductor Engineering
  • Chipbond Technology
  • Intel
  • Siliconware Precision Industries
  • Taiwan Semiconductor Manufacturing Company
Market driver
  • Rise in use of 3D chip packaging
  • For a full, detailed list, view our report
Market challenge
  • Need for high initial capital investments
  • For a full, detailed list, view our report
Market trend
  • Growing number of OSAT companies in APAC
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?


  • Executive summary
  • Scope of the report
  • Research methodology
  • Market landscape
    • Market ecosystem
      • Table Parent market
      • Table Global semiconductor advanced packaging market: Segments
    • Market characteristics
      • Table Market characteristics
    • Market segmentation analysis
      • Table Global flip chip packages market: Segments
  • Market sizing
    • Market definition
      • Table Market definition: Inclusions and exclusions checklist
    • Market sizing 2017
      • Table Market size 2017
      • Table Validation techniques employed for market sizing 2017
    • Market size and forecast 2017-2022
      • Table Global flip chip packages market: Market size and forecast 2017-2022 ($ bn)
      • Table Global flip chip packages market: Year-over-year growth 2018-2022 (%)
  • Five forces analysis
    • Table Five forces analysis 2017
    • Table Five forces analysis 2022
    • Bargaining power of buyers
      • Table Bargaining power of buyers
    • Bargaining power of suppliers
      • Table Bargaining power of suppliers
    • Threat of new entrants
      • Table Threat of new entrants
    • Threat of substitutes
      • Table Threat of substitutes
    • Threat of rivalry
      • Table Threat of rivalry
    • Market condition
      • Table Market condition: Five forces 2017
  • Market segmentation by bumping technology
    • Overview
      • Table Segmentation by bumping technology: Market share 2017-2022 (%)
    • Copper pillar bumping
    • ECD Solder bumping
    • Gold bumping
  • Customer landscape
    • Table Customer landscape
  • Market segmentation by end-user
    • Overview
      • Table Segmentation by end-user: Market share 2017-2022 (%)
    • Comparison by end-user
      • Table Comparison by end-user
    • Communication sector - Market size and forecast 2017-2022
      • Table Communication sector: Market size and forecast 2017-2022 ($ bn)
      • Table Communication sector: Year-over-year growth 2018-2022 (%)
    • Computing and networking sector - Market size and forecast 2017-2022
      • Table Computing and networking sector: Market size and forecast 2017-2022 ($ bn)
      • Table Computing and networking sector: Year-over-year growth 2018-2022 (%)
    • Industrial sector- Market size and forecast 2017-2022
      • Table Industrial sector: Market size and forecast 2017-2022 ($ bn)
      • Table Industrial sector: Year-over-year growth 2018-2022 (%)
    • Automotive sector - Market size and forecast 2017-2022
      • Table Automotive sector: Market size and forecast 2017-2022 ($ bn)
      • Table Automotive sector: Year-over-year growth 2018-2022 (%)
    • Others - Market size and forecast 2017-2022
      • Table Others: Market size and forecast 2017-2022 ($ bn)
      • Table Others: Year-over-year growth 2018-2022 (%)
    • Market opportunity by end-user
      • Table Market opportunity by end-user
  • Regional landscape
    • Geographical segmentation
      • Table Segmentation by geography: Market share 2017-2022 (%)
    • Regional comparison
      • Table Regional comparison
    • APAC - Market size and forecast 2017-2022
      • Table APAC: Market size and forecast 2017-2022 ($ bn)
      • Table APAC: Year-over-year growth 2018-2022 (%)
    • Americas - Market size and forecast 2017-2022
      • Table Americas: Market size and forecast 2017-2022 ($ bn)
      • Table Americas: Year-over-year growth 2018-2022 (%)
    • EMEA - Market size and forecast 2017-2022
      • Table EMEA: Market size and forecast 2017-2022 ($ bn)
      • Table EMEA: Year-over-year growth 2018-2022 (%)
    • Key leading countries
      • Table Key leading countries
    • Market opportunity
      • Table Market opportunity
  • Decision framework
  • Drivers and challenges
    • Market drivers
    • Market challenges
      • Table Timeline for semiconductor wafer size advances
      • Table Global semiconductor market trend 1992-2017 ($ billions)
  • Market trends
    • Integration of semiconductor components in automobiles
      • Table Forecasted car shipments 2017-2022 (million units)
    • Short lifecycle of mobile devices
    • Growing number of OSAT companies in APAC
    • M&A in semiconductor packaging industry
  • Vendor landscape
    • Overview
      • Table Vendor landscape
    • Landscape disruption
      • Table Landscape disruption
    • Competitive scenario
  • Vendor analysis
    • Vendors covered
      • Table Vendors covered
    • Vendor classification
      • Table Vendor classification
    • Market positioning of vendors
      • Table Market positioning of vendors
    • Advanced Semiconductor Engineering
      • Table Advanced Semiconductor Engineering: Overview
      • Table Advanced Semiconductor Engineering: Business segments
      • Table Advanced Semiconductor Engineering: Organizational developments
      • Table Advanced Semiconductor Engineering: Geographic focus
      • Table Advanced Semiconductor Engineering: Segment focus
      • Table Advanced Semiconductor Engineering: Key offerings
    • Chipbond Technology
      • Table Chipbond Technology: Overview
      • Table Chipbond Technology: Business segments
      • Table Chipbond Technology: Geographic focus
      • Table Chipbond Technology: Key offerings
    • Intel
      • Table Intel: Overview
      • Table Intel: Business segments
      • Table Intel: Organizational developments
      • Table Intel: Geographic focus
      • Table Intel: Segment focus
      • Table Intel: Key offerings
    • Siliconware Precision Industries
      • Table Siliconware Precision Industries: Overview
      • Table Siliconware Precision Industries: Business segments
      • Table Siliconware Precision Industries: Organizational developments
      • Table Siliconware Precision Industries: Geographic focus
      • Table Siliconware Precision Industries: Key offerings
    • Taiwan Semiconductor Manufacturing Company
      • Table Taiwan Semiconductor Manufacturing Company: Overview
      • Table Taiwan Semiconductor Manufacturing Company: Business segments
      • Table Taiwan Semiconductor Manufacturing Company: Organizational developments
      • Table Taiwan Semiconductor Manufacturing Company: Geographic focus
      • Table Taiwan Semiconductor Manufacturing Company: Key offerings
  • Appendix
    • List of abbreviations
  • Explore Technavio

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