Global Fan-out Wafer Level Packaging Market 2021-2025

Global Fan-out Wafer Level Packaging Market 2021-2025

Technavio has been monitoring the fan-out wafer level packaging market and it is poised to grow by $ 1.60 bn during 2021-2025, decelerating at a CAGR of 14.29% during the forecast period. Our report on the fan-out wafer level packaging market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the increased demand for compactly designed electronics and the growing use of semiconductor ICs in IoT. In addition, the increased demand for compactly designed electronics is anticipated to boost the growth of the market as well.

The fan-out wafer level packaging market analysis includes the technology segment and geographic landscape.

Technavio's fan-out wafer level packaging market is segmented as below:

By Technology

  • High density
  • Standard density
By Geographical Landscape
  • APAC
  • North America
  • Europe
  • South America
  • MEA
This study identifies the rapid adoption of FinFET technologyas one of the prime reasons driving the fan-out wafer level packaging market growth during the next few years.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our report on fan-out wafer level packaging market covers the following areas:
  • Fan-out wafer level packaging market sizing
  • Fan-out wafer level packaging market forecast
  • Fan-out wafer level packaging market industry analysis
Technavio's robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading fan-out wafer level packaging market vendors that include Amkor Technology Inc., ASE Technology Holding Co. Ltd., Cypress Semiconductor Corp., Infineon Technologies AG, JCET Group Co. Ltd., NXP Semiconductors NV, Renesas Electronics Corp., Samsung Electronics Co. Ltd., Siliconware Precision Industries Co. Ltd., and Taiwan Semiconductor Manufacturing Co. Ltd. Also, the fan-out wafer level packaging market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. Technavio's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.


  • Executive Summary
  • Market Landscape
    • Market ecosystem
      • Table Parent market
      • Table Market characteristics
    • Value chain analysis
      • Table Value chain analysis: Electronic Components
      • Inputs
      • Inbound logistics
      • Operations
      • Outbound logistics
      • Marketing and sales
      • Service
      • Support activities
      • Innovations
  • Market Sizing
    • Market definition
      • Table Offerings of vendors included in the market definition
    • Market segment analysis
      • Table Market segments
    • Market size 2020
    • Market outlook: Forecast for 2020 - 2025
      • Estimating growth rates for emerging and high-growth markets
      • Estimating growth rates for mature markets
        • Table Global - Market size and forecast 2020 - 2025 ($ million)
      • Rapid adoption of high-density FOWLP
      • Formation of Institute of Microelectronics (IME) consortium
      • Gaining market through new applications
      • Impact of COVID-19
        • Table Global market: Year-over-year growth 2020 - 2025 (%)
  • Five Forces Analysis
    • Five forces summary
      • Table Five forces analysis 2020 & 2025
    • Bargaining power of buyers
      • Table Bargaining power of buyers
    • Bargaining power of suppliers
      • Table Bargaining power of suppliers
    • Threat of new entrants
      • Table Threat of new entrants
    • Threat of substitutes
      • Table Threat of substitutes
    • Threat of rivalry
      • Table Threat of rivalry
    • Market condition
      • Table Market condition - Five forces 2020
  • Market Segmentation by Technology
    • Market segments
      • Table Technology - Market share 2020-2025 (%)
    • Comparison by Technology
      • Table Comparison by Technology
    • High density - Market size and forecast 2020-2025
      • Table High density - Market size and forecast 2020-2025 ($ million)
      • Table High density - Year-over-year growth 2020-2025 (%)
    • Standard density - Market size and forecast 2020-2025
      • Table Standard density - Market size and forecast 2020-2025 ($ million)
      • Table Standard density - Year-over-year growth 2020-2025 (%)
    • Market opportunity by Technology
      • Table Market opportunity by Technology
  • Customer landscape
    • Table Customer landscape
  • Geographic Landscape
    • Geographic segmentation
      • Table Market share by geography 2020-2025 (%)
    • Geographic comparison
      • Table Geographic comparison
    • APAC - Market size and forecast 2020-2025
      • Table APAC - Market size and forecast 2020-2025 ($ million)
      • Table APAC - Year-over-year growth 2020-2025 (%)
    • North America - Market size and forecast 2020-2025
      • Table North America - Market size and forecast 2020-2025 ($ million)
      • Table North America - Year-over-year growth 2020-2025 (%)
    • Europe - Market size and forecast 2020-2025
      • Table Europe - Market size and forecast 2020-2025 ($ million)
      • Table Europe - Year-over-year growth 2020-2025 (%)
    • South America - Market size and forecast 2020-2025
      • Table South America - Market size and forecast 2020-2025 ($ million)
      • Table South America - Year-over-year growth 2020-2025 (%)
    • MEA - Market size and forecast 2020-2025
      • Table MEA - Market size and forecast 2020-2025 ($ million)
      • Table MEA - Year-over-year growth 2020-2025 (%)
    • Key leading countries
      • Table Key leading countries
    • Market opportunity by geography
      • Table Market opportunity by geography ($ million)
  • Drivers, Challenges, and Trends
    • Market drivers
      • Increased demand for compactly designed electronics
      • Growing use of semiconductor ICs in IoT
      • Rapid adoption of FinFET technology
    • Market challenges
      • Increased production costs because of warpage
      • Cyclical nature of the semiconductor industry
      • Highly complex design of ICs
        • Table Impact of drivers and challenges
    • Market trends
      • Increasing adoption of semiconductor ICs in automobiles
      • Rising panel-level packaging
      • Incorporation of more functionalities in smartphones
  • Vendor Landscape
    • Overview
      • Table Vendor landscape
    • Landscape disruption
      • Table Landscape disruption
      • Table Industry risks
  • Vendor Analysis
    • Vendors covered
      • Table Vendors covered
    • Market positioning of vendors
      • Table Market positioning of vendors
    • Amkor Technology Inc.
      • Table Amkor Technology Inc. - Overview
      • Table Amkor Technology Inc. - Business segments
      • Table Amkor Technology Inc.- Key news
      • Table Amkor Technology Inc. - Key offerings
      • Table Amkor Technology Inc. - Segment focus
    • ASE Technology Holding Co. Ltd.
      • Table ASE Technology Holding Co. Ltd. - Overview
      • Table ASE Technology Holding Co. Ltd. - Business segments
      • Table ASE Technology Holding Co. Ltd.-Key news
      • Table ASE Technology Holding Co. Ltd. - Key offerings
      • Table ASE Technology Holding Co. Ltd. - Segment focus
    • Cypress Semiconductor Corp.
      • Table Cypress Semiconductor Corp. - Overview
      • Table Cypress Semiconductor Corp. - Business segments
      • Table Cypress Semiconductor Corp. - Key offerings
      • Table Cypress Semiconductor Corp. - Segment focus
    • Infineon Technologies AG
      • Table Infineon Technologies AG - Overview
      • Table Infineon Technologies AG - Business segments
      • Table Infineon Technologies AG - Key offerings
      • Table Infineon Technologies AG - Segment focus
    • JCET Group Co. Ltd.
      • Table JCET Group Co. Ltd. - Overview
      • Table JCET Group Co. Ltd. - Product and service
      • Table JCET Group Co. Ltd. - Key offerings
    • NXP Semiconductors NV
      • Table NXP Semiconductors NV - Overview
      • Table NXP Semiconductors NV - Business segments
      • Table NXP Semiconductors NV - Key offerings
      • Table NXP Semiconductors NV - Segment focus
    • Renesas Electronics Corp.
      • Table Renesas Electronics Corp. - Overview
      • Table Renesas Electronics Corp. - Business segments
      • Table Renesas Electronics Corp. - Key offerings
      • Table Renesas Electronics Corp. - Segment focus
    • Samsung Electronics Co. Ltd.
      • Table Samsung Electronics Co. Ltd. - Overview
      • Table Samsung Electronics Co. Ltd. - Business segments
      • Table Samsung Electronics Co. Ltd. - Key offerings
      • Table Samsung Electronics Co. Ltd. - Segment focus
    • Siliconware Precision Industries Co. Ltd.
      • Table Siliconware Precision Industries Co. Ltd. - Overview
      • Table Siliconware Precision Industries Co. Ltd. - Business segments
      • Table Siliconware Precision Industries Co. Ltd. - Key offerings
      • Table Siliconware Precision Industries Co. Ltd. - Segment focus
    • Taiwan Semiconductor Manufacturing Co. Ltd.
      • Table Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
      • Table Taiwan Semiconductor Manufacturing Co. Ltd. - Business segments
      • Table Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings
      • Table Taiwan Semiconductor Manufacturing Co. Ltd. - Segment focus
  • Appendix
    • Scope of the report
      • Market Definition
      • Objectives
      • Notes and caveats
    • Currency conversion rates for US$
      • Table Currency conversion rates for US$
    • Research methodology
      • Table Research Methodology
      • Table Validation techniques employed for market sizing
      • Table Information sources
    • List of abbreviations
      • Table List of abbreviations

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