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Global Fan-out Wafer Level Packaging Market 2017-2021

Global Fan-out Wafer Level Packaging Market 2017-2021

About Fan-Out Wafer Level Packaging

FOWLP is a chip packaging technology that is used to package an IC, while the IC is still part of the wafer. The technology has a smaller form factor, thinner flip-chip packages, supports I/O density, and allows the use of wafer level packaging with improved semiconductor technology nodes and multi-die package. Wafer-level packages have advantages, in terms of cost and form, in comparison to substrate-based flip-chip packages. The WLP can assemble small to medium pin count ICs in the thinnest and smallest possible footprint at low cost. This is driving its market demand.

Technavio’s analysts forecast the global fan-out wafer level packaging market to grow at a CAGR of 47.76% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global fan-out wafer level packaging market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Fan-Out Wafer Level Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • STATS ChipPAC
  • TSMC
  • Texas Instruments
Other prominent vendors
  • Rudolph Technologies
  • SEMES
  • SUSS MicroTec
  • STMicroelectronics
  • Ultratech
Market driver
  • Growing application of semiconductor ICs in IoT.
  • For a full, detailed list, view our report
Market challenge
  • Rapid technological changes in wafer processing.
  • For a full, detailed list, view our report
Market trend
  • High adoption of semiconductor ICs in automobiles.
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


  • Executive summary
  • Scope of the report
  • Research Methodology
  • Introduction
    • Key market highlights
  • Technology landscape
    • Semiconductor IC manufacturing process
      • Table Semiconductor IC manufacturing process
      • Table Front-end chip formation steps
      • Table Back-end chip formation steps
    • WLP versus die-level packaging and assembly
    • Roadmap of semiconductor packaging industry
      • Table Semiconductor packaging industry
      • Table 2.5D IC block diagram
      • Table 3D IC block diagram
    • Ecosystem of semiconductor IC packaging industry
      • Table Old semiconductor IC packaging industry supply chain
      • Table New semiconductor IC packaging industry supply chain
  • Market landscape
    • Market size and forecast
      • Table Global FOWLP market 2016-2021 ($ millions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by application
    • Global FOWLP market by application
      • Table Global FOWLP market by application 2016-2021 (% share)
      • Table Global FOWLP market by application 2016-2021 ($ millions)
    • Analog and mixed IC
      • Table Global analog and mixed IC market 2016-2021 ($ millions)
    • Wireless connectivity
      • Table Global wireless connectivity market 2016-2021 ($ millions)
    • Logic and memory IC
      • Table Global logic and memory IC market 2016-2021 ($ millions)
    • MEMS and sensors
      • Table Global MEMS and sensors market 2016-2021 ($ millions)
    • CMOS image sensors
      • Table Global CMOS image sensor market 2016-2021 ($ billions)
  • Geographical segmentation
    • Table Global FOWLP market forecast by geography 2016-2021 (% share)
    • Table Global FOWLP market forecast by geography 2016-2021 ($ millions)
    • APAC
      • Table FOWLP market in APAC 2016-2021 ($ millions)
    • Americas
      • Table FOWLP market in Americas 2016-2021 ($ millions)
    • Europe
      • Table FOWLP market in Europe 2016-2021 ($ millions)
  • Decision framework
  • Drivers and challenges
    • Market drivers
      • Table Global MEMS market 2015-2020 ($ billions)
      • Table Global smartphone shipment forecast 2016-2021 (millions of units)
    • Impact of drivers on key customer segments
      • Table Impact of drivers
    • Market challenges
    • Impact of challenges on key customer segments
      • Table Impact of challenges
  • Market trends
    • Increase in wafer size
      • Table Timeline for semiconductor wafer size advances
    • High adoption of semiconductor ICs in automobiles
      • Table Growth of car shipments 2015-2020 (%)
    • Short replacement cycle of mobile devices
  • Vendor landscape
    • Competitive scenario
    • Key vendors
    • Other prominent vendors
  • Appendix
    • List of abbreviations
  • Explore Technavio

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