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Global Fan-in Wafer Level Packaging Market 2016-2020

  • Executive summary
    • Highlights
  • Scope of the report
    • Market coverage
    • Base year and forecast period
    • Vendor segmentation
    • Market segmentation
      • Table Global fan-in WLP market segmentation 2015
    • Geographical segmentation
      • Table Key regions
  • Market research methodology
    • Research methodology
    • Economic indicators
    • PEST analysis
      • Table PEST analysis
  • Introduction
    • Key market highlights
  • Technology landscape
    • Semiconductor IC manufacturing process
      • Table Semiconductor IC manufacturing process
      • Table Front-end chip formation steps
      • Table Back-end chip formation steps
    • WLP versus die-level packaging and assembly
    • Roadmap of semiconductor packaging industry
      • Table Roadmap of semiconductor packaging industry
      • Table 2.5D IC block diagram
      • Table 3D IC block diagram
    • Ecosystem of semiconductor IC packaging industry
      • Table Old semiconductor IC packaging industry supply chain
      • Table New semiconductor IC packaging industry supply chain
  • Market landscape
    • Market size and forecast
      • Table Global fan-in WLP market 2015-2020 ($ billions)
      • Table Global fan-in WLP market 2015-2020 (billions of units)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by application
    • Global fan-in WLP market by application
      • Table Global fan-in WLP market by application 2015-2020 (% share of shipments)
      • Table Global fan-in WLP market by application 2015-2020 (billions of units)
    • Analog and mixed ICs
      • Table Global fan-in WLP market by analog and mixed IC 2015-2020 (billions of units)
    • Wireless connectivity
      • Table Global fan-in WLP market by wireless connectivity 2015-2020 (billions of units)
    • Logic and memory ICs
      • Table Global fan-in WLP market by logic and memory IC 2015-2020 (billions of units)
    • MEMS and sensors
      • Table Global fan-in WLP market by MEMS and sensors 2015-2020 (billions of units)
    • CMOS image sensors
      • Table Global fan-in WLP market by CMOS image sensor 2015-2020 (billions of units)
  • Geographical segmentation
    • Global fan-in WLP market by geography 2015-2020
      • Table Global fan-in WLP market by geography 2015-2020 (% share of shipment)
      • Table Global fan-in WLP market by geography 2015-2020 (billions of units)
    • APAC
      • Table Fan-in WLP market in APAC 2015-2020 (billions of units)
    • North America
      • Table Fan-in WLP market in North America 2015-2020 (billions of units)
    • Europe
      • Table Fan-in WLP market in Europe 2015-2020 (billions of units)
  • Market drivers
    • High demand for miniaturized electronics
      • Table Global MEMS market 2015-2020 ($ billions)
    • Growing application of semiconductor ICs in IoT
      • Table Global smartphone shipment forecast 2015-2020 (millions of units)
    • Increasing complexity of semiconductor IC designs
    • Surging demand for semiconductor wafers
  • Impact of drivers
    • Table Impact of drivers
  • Market challenges
    • Cyclical nature of semiconductor industry
      • Table Global semiconductor market trend 1992-2014 ($ billions)
    • Rapid technological changes in wafer processing
  • Impact of drivers and challenges
    • Table Impact of drivers and challenges
  • Market trends
    • Increase in wafer size
      • Table Timeline for semiconductor wafer-size advances
    • High adoption of semiconductor ICs in automobiles
      • Table Growth of car shipments 2015-2020
    • Short replacement cycle of mobile devices
  • Vendor landscape
    • Competitive scenario
    • Key vendors
    • Other prominent vendors
      • Table Other prominent vendors in market
  • Market summary
    • Table Market snapshot of global fan-in WLP market 2015-2020
    • Table CAGR comparison: Application segments
    • Table CAGR comparison: Geographical segments
  • Appendix
    • List of abbreviations
  • Explore Technavio

Global Fan-in Wafer Level Packaging Market 2016-2020

About Fan-in WLP

Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from application-specific integrated circuits (ASICs) and microprocessors to electrically erasable programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP and is gaining popularity among fabless and foundry companies globally.

Technavio’s analysts forecast the global fan-in WLP market to grow at a CAGR of 9.63% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global fan-in WLP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of packaged fan-in WLPs in various application segments such as analog and mixed IC, wireless connectivity, logic and memory IC, micro-electro-mechanical systems (MEMS) and sensors, and complementary metal-oxide-semiconductor (CMOS) image sensorThe market is divided into the following segments based on geography:

  • APAC
  • North America
  • Europe
Technavio's report, Global Fan-in WLP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • STATS ChipPAC
  • STMicroelectronics
  • TSMC
  • Texas Instruments
Other prominent vendors
  • Rudolph Technologies
  • SEMES
  • SUSS MicroTec
  • Ultratech
  • FlipChip International
Market driver
  • High demand for miniaturized electronics
  • For a full, detailed list, view our report
Market challenge
  • Cyclical nature of semiconductor industry
  • For a full, detailed list, view our report
Market trend
  • Increase in wafer size
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – Global Fan-in WLP Market 2016-2020

Technavio recognizes the following companies as the key players in the global fan-in WLP market: STATS ChipPAC, STMicroelectronics, TSMC, and Texas Instruments.

Other Prominent Vendors in the market are: Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, and FlipChip International.

Commenting on the report, an analyst from Technavio’s team said: “One trend gaining popularity in this market is increase in wafer size. The global semiconductor industry witnessed an increase in the size of silicon wafers, from 100 mm to 300 mm, during the last four decades. The shift to larger diameter wafers reduces the cost of manufacturing semiconductor ICs by 20%-25%. At present, the industry predominantly uses 300-mm wafers to manufacture ICs. This trend is expected to maintain its momentum during the forecast period”

According to the report, the surging demand for compact electronic devices in sectors such as telecommunications, automotive, industrial manufacturing, and healthcare has generated the need for miniaturized semiconductor ICs. With the emergence of products such as 3D ICs and MEMS devices, the electronic equipment is becoming compact and user-friendly, which involves changes in IC designing such as finer patterning.

Further, the report states that rapid technological advances in wafer processing is a major challenge for vendors in the global fan-in WLP market. The transitions such as miniaturization of nodes and an increase in wafer sizes in ultra-large scale integration (ULSI) fabrication technology in the global semiconductor industry instigate semiconductor manufacturers to increase the development and adoption of new technologies, especially in packaging solutions.

Companies Mentioned

STATS ChipPAC, STMicroelectronics, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, FlipChip International.

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