Global Fan-in Wafer Level Packaging Market 2016-2020
About Fan-in WLP
Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from application-specific integrated circuits (ASICs) and microprocessors to electrically erasable programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP and is gaining popularity among fabless and foundry companies globally.
Technavio’s analysts forecast the global fan-in WLP market to grow at a CAGR of 9.63% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global fan-in WLP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of packaged fan-in WLPs in various application segments such as analog and mixed IC, wireless connectivity, logic and memory IC, micro-electro-mechanical systems (MEMS) and sensors, and complementary metal-oxide-semiconductor (CMOS) image sensorThe market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Fan-in WLP Market 2016-2020
Technavio recognizes the following companies as the key players in the global fan-in WLP market: STATS ChipPAC, STMicroelectronics, TSMC, and Texas Instruments.
Other Prominent Vendors in the market are: Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, and FlipChip International.
Commenting on the report, an analyst from Technavio’s team said: “One trend gaining popularity in this market is increase in wafer size. The global semiconductor industry witnessed an increase in the size of silicon wafers, from 100 mm to 300 mm, during the last four decades. The shift to larger diameter wafers reduces the cost of manufacturing semiconductor ICs by 20%-25%. At present, the industry predominantly uses 300-mm wafers to manufacture ICs. This trend is expected to maintain its momentum during the forecast period”
According to the report, the surging demand for compact electronic devices in sectors such as telecommunications, automotive, industrial manufacturing, and healthcare has generated the need for miniaturized semiconductor ICs. With the emergence of products such as 3D ICs and MEMS devices, the electronic equipment is becoming compact and user-friendly, which involves changes in IC designing such as finer patterning.
Further, the report states that rapid technological advances in wafer processing is a major challenge for vendors in the global fan-in WLP market. The transitions such as miniaturization of nodes and an increase in wafer sizes in ultra-large scale integration (ULSI) fabrication technology in the global semiconductor industry instigate semiconductor manufacturers to increase the development and adoption of new technologies, especially in packaging solutions.
STATS ChipPAC, STMicroelectronics, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, FlipChip International.
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