Global Electronic Packaging Market 2015-2019
About Electronic Packaging
Electronic packaging involves the use of engineering and other technologies to incorporate in-built security and protective features in the packaging of products. The use of electronics in packaging is gaining importance as it reduces wastage and enhances safety and security, product differentiation, convenience, brand enhancement, and quality assurance. Printed electronics is the primary technology used, which is expected to reduce the cost of electronic packaging dramatically. Overall, the popularity of electronic packaging is increasing with growing awareness among manufacturers.
TechNavio's analysts forecast the revenue and volume of the Global Electronic Packaging market to grow at a CAGR of 47.02 percent and 46.26 percent, respectively, over the period 2014-2019.
Covered in this Report
This report covers the present scenario and the growth prospects of the Global Electronic Packaging market for the period 2015-2019. To calculate the market size, the report has taken into consideration the revenue generated by electronic packaging used in the packaging of a number of products. The report includes market segmentation based on type of function and technology used.The primary functional categories of electronic packaging are:
TechNavio Announces the Publication of its Research Report – Global Electronic Packaging Market 2015-2019
TechNavio recognizes the following companies as the key players in the Global Electronic Packaging Market: BASF SE, Enfucell Ltd., MeadWestvaco Corp., Soligie Inc. and T-Ink Inc.
Other Prominent Vendors in the market are: Blue Spark Technologies, Canatu, Cap-XX, Cymbet, Excellatron Solid State, Fraunhofer Institute for Electronic Nano Systems, Front Edge Technology, Holst Centre, Infinite Power Solutions, Infratab, Kovio, NEC, Novalia, Plastic Logic, PragmatIC Printing, Printechnologics, PST Sensors, Solarmer Energy and Thin Film Electronics ASA.
Commenting on the report, an analyst from TechNavio’s team said: “The rise in number of technological innovations is a major trend which is expected to make a positive influence on the market. Vendors are launching new technological and packaging innovations, which will impact the demand for electronics in packaging.”
According to the report, the increase in the amount of theft of products and counterfeiting is a major driver that is expected to boost the Global Electronic Packaging Market in the coming years. Because of rising theft and smuggling, huge losses are incurred by manufacturers, mainly for high-value products and electronic packaging is seen by consumer goods companies as a solution to reduce and eliminate this problem.
Further, the report states that the intense competition among the vendors is a major challenge faced in the market. Manufacturers and vendors compete in terms of price for various technologies or solutions used, thus adversely affecting the revenue.
BASF, Enfucell, MeadWestvaco, Soligie, T-Ink, Blue Spark Technologies, Canatu, Cap-XX, Cymbet, Excellatron Solid State, Fraunhofer Institute for Electronic Nano Systems, Front Edge Technology, Holst Centre , Infinite Power Solutions, Infratab,Kovio, NEC, Novalia, Plastic Logic, PragmatIC Printing, Printechnologics, PST Sensors, Solarmer Energy, Thin Film Electronics ASA
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