Global ESD Packaging Market 2017-2021

Global ESD Packaging Market 2017-2021

About ESD Packaging

ESD packaging is used for devices or products that can be damaged by electrostatic discharge (ESD). ESD is the sudden flow of electricity between two electrically charged objects. This flow of electricity may result in the damage of devices. ESD packaging is commonly used for packaging printed circuit boards (PCBs) and semiconductors. PCBs are mostly used in industries such as electronics and automotive and are extremely prone to ESD.

Technavio’s analysts forecast the global ESD packaging market to grow at a CAGR of 8.23% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global ESD packaging market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

• Americas
• APAC
• EMEA

Technavio's report, Global ESD Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of operating in this market.

Key vendors

• BASF
• Desco Industries
• Dow Chemical
• PPG Industries

Other prominent vendors

• AkzoNobel
• DaklaPack Group
• Dou Yee
• GWP Group
• Kao-Chia Plastics
• Miller Supply
• Polyplus Packaging
• TIP Corporation
• Uline

Market driver

• Growing global demand for smartphones and smart devices.
• For a full, detailed list, view our report

Market challenge

• Strict material requirement specifications.
• For a full, detailed list, view our report

Market trend

• High adoption of technology in automobiles.
• For a full, detailed list, view our report

Key questions answered in this report

• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are in this market space?
• What are the market opportunities and threats faced by the key vendors??
• What are the strengths and weaknesses of the key vendors??

Press Release

Technavio Announces the Publication of its Research Report – Global ESD Packaging Market 2017-2021

Technavio recognizes the following companies as the key players in the global ESD packaging market: BASF, Desco Industries, Dow Chemical, and PPG Industries.

Other Prominent Vendors in the market are: AkzoNobel, DaklaPack Group, Dou Yee, GWP Group, Kao-Chia Plastics, Miller Supply, Polyplus Packaging, TIP Corporation, and Uline.

Commenting on the report, an analyst from Technavio’s team said: “One trend in market is high adoption of technology in automobiles. The electrification and automation of automobiles have increased the demand for semiconductor wafers. Multiple types of semiconductor integrated circuits (ICs) are used in automobiles for airbag control, global positioning systems, anti-lock braking systems, car navigation and display, power doors and windows, infotainment, automated driving, and collision detection technology. The emergence of new technologies, such as artificial intelligence will lead to the emergence of self-driving cars in future. Companies such as Intel, Google, Uber, and Tesla are already investing and focusing on self-driving vehicles. In November 2016, for example, Intel announced its new division, Automated Driving Group, which will focus on autonomous driving. Intel has also tied up with automotive firms such as BMW for the division.”

According to the report, one driver in market is increasing miniaturization of electronic devices. There has been an increase in the demand for mobility in electronic devices worldwide. To be portable and cost-effective, devices need to be lightweight and small. Thus, the increased demand for mobility has translated into a trend toward the adoption of smaller devices. The popularity of smaller devices in multiple sectors such as telecommunications and automotive has, in turn, led to the miniaturization of semiconductor ICs. With the advances in technology, such as 3D ICs and micro-electromechanical systems (MEMS), as well as the changes in the designs of ICs such as finer patterning, electronic devices are becoming more compact and user-friendly. However, smaller and densely-built semiconductors, ICs, and PCBs have more chances of tribocharging, and thus require anti-static packaging.

Further, the report states that one challenge in market is high dependence on electronics industry. The ESD packaging market is heavily dependent on the global performance of the electronics industry. In the case of a global economic meltdown, the sales of electronic products are impacted adversely because these products are capital intensive. The ripple effect is felt in the semiconductor equipment market as semiconductors comprise major components in electronic products. As semiconductor sales go down, the sales of semiconductor packaging materials also go down. The global recession of 2009, for example, was one of the most harrowing periods for companies across the semiconductor value chain because of the global economic meltdown. At present, the slow growth of China is a concern for the global electronics market. China's growth rate fell from 9.6% in 2011 to 6.9% in 2015. It has reduced further during the first three quarters of 2016 to around 6.7%. China consumes and produces more than 50% of the raw materials, such as semiconductors.

Companies Mentioned

BASF, Desco Industries, Dow Chemical, PPG Industries, AkzoNobel, DaklaPack Group, Dou Yee, GWP Group, Kao-Chia Plastics, Miller Supply, Polyplus Packaging, TIP Corporation, and Uline.