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Global Die-level Packaging Equipment Market 2015-2019

Global Die-level Packaging Equipment Market 2015-2019

About Die-level Packaging

ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials. Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.

Technavio's analysts forecast the global die-level packaging equipment market to grow at a CAGR of 1.24% during 2014-2019.

Covered in this Report

This report covers the present scenario and growth prospects of the global die-level packaging equipment market for 2015-2019. To calculate the market size, the report considers revenue generated from the sales of die-level packaging equipment worldwide. However, the report does not consider the following while calculating the market size:

  • Support or maintenance services offered for/with die-level packaging equipment
  • Components used in the production of die-level packaging equipment
  • Aftermarket sales of die-level packaging equipment
Technavio's report, Global Die-level Packaging Equipment Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.Key Regions
  • Americas
  • APAC
  • EMEA
Key Vendors
  • ASM International
  • BE Semiconductor Industries
  • DISCO
  • Kulicke & Soffa Industries
Other Prominent Vendors
  • Advantest
  • Cohu
  • Hitachi High-Technologies
  • Shinkawa
  • TOWA
Market Driver
  • Rise in Demand for Smartphones and Tablets
  • For a full, detailed list, view our report
Market Challenge
  • Rapid Changes in Technology
  • For a full, detailed list, view our report
Market Trend
  • Short Replacement Cycle of Portable Electronic Devices
  • For a full, detailed list, view our report
Key Questions Answered in this Report
  • What will the market size be in 2019 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – Global Die-Level Packaging Equipment Market 2015-2019

Technavio recognizes the following companies as the key players in the Global Die-Level Packaging Equipment Market: ASM International NV, BE Semiconductor Industries N.V. (Besi), DISCO Corp., and Kulicke & Soffa Industries Inc.

Other Prominent Vendors in the market are: Cohu, TOWA, Shinkawa, Advantest, and Hitachi High-Technologies.

Commenting on the report, an analyst from Technavio’s team said: “The short replacement cycle of portable electronic devices is a key trend observed in this market. Frequent launches of next-version models render the current portable devices obsolete within a short period of time. This short lifespan will augment the demand for semiconductor wafers during the forecast period.”

According to the report, steady growth of semiconductor wafer industry is a major driver that promotes growth in this market. The demand for semiconductor wafers is continually increasing owing to the augmented demand for portable electronic devices globally. Steady growth of semiconductor wafer industry

Further, the report states that the increasing dependency on few key suppliers is a major challenge faced by this market. Inability of the raw material suppliers to provide resources on time negatively affects the business of semiconductor die-level packaging equipment manufacturers.

  • Executive Summary
  • List of Abbreviations
  • Scope of the Report
    • Market Overview
    • Product Offerings
  • Market Research Methodology
    • Market Research Process
    • Research Methodology
      • Table Market Research Methodology
  • Introduction
    • Table Workflow of Semiconductor IC Production and Packaging
  • Industry Overview
    • Semiconductor Industry Overview
      • Semiconductor Value Chain
        • Table Semiconductor Value Chain
    • Global Semiconductor Market
      • Table Global Semiconductor Market
  • Market Landscape
    • Market Overview
    • Factors Influencing Demand for Semiconductors
    • Market Size and Forecast
      • Table Global Die-level Packaging Equipment Market 2014-2019 ($ billions)
    • Five Forces Analysis
  • Geographical Segmentation
    • Global Die-level Packaging Equipment Market by Geography 2014-2019
      • Table Global Die-level Packaging Equipment Market by Geography 2014
      • Table Global Die-level Packaging Equipment Market by Geography 2014-2019 (percentage share)
      • Table Global Die-level Packaging Equipment Market by Geography 2014-2019 ($ millions)
    • Die-level Packaging Equipment Market in APAC
      • Market Size and Forecast
    • Die-level Packaging Equipment Market in Americas
      • Market Size and Forecast
    • Die-level Packaging Equipment Market in EMEA
      • Market Size and Forecast
  • Buying Criteria
  • Market Growth Drivers
  • Drivers and Their Impact
  • Market Challenges
  • Impact of Drivers and Challenges
  • Market Trends
  • Trends and Their Impact
  • Vendor Landscape
    • Competitive Scenario
    • Key Vendors
      • ASM International
      • BE Semiconductor Industries (Besi)
      • DISCO
      • Kulicke & Soffa Industries
    • Other Prominent Vendors
      • Cohu
      • TOWA
      • Shinkawa
      • Advantest
      • Hitachi High-Technologies
  • Key Vendor Analysis
    • ASM International
      • Key Facts
      • Business Overview
      • Product Portfolio
        • Table ASM International: Product Portfolio
      • Geographical Segmentation by Revenue 2013
        • Table ASM International: Geographical Segmentation by Revenue 2013
      • Business Strategy
      • SWOT Analysis
    • Besi
      • Key facts
      • Business overview
      • Geographical segmentation by revenue 2014
        • Table Besi: Geographical segmentation by revenue 2014
      • Recent developments
      • SWOT analysis
    • DISCO
      • Key Facts
      • Business Overview
      • Business Segmentation by Revenue 2014
        • Table DISCO: Business Segmentation by Revenue 2014
      • Geographical Segmentation by Revenue 2014
        • Table DISCO: Geographical Segmentation by Revenue 2014
      • SWOT Analysis
    • Kulicke & Soffa
      • Key Facts
      • Business Overview
      • Business Segmentation by Revenue 2014
        • Table Kulicke & Soffa: Business Segmentation by Revenue 2014
      • Business Segmentation by Revenue 2013 and 2014
        • Table Kulicke & Soffa: Business Segmentation by Revenue 2013 and 2014 ($ millions)
      • Geographical Segmentation by Revenue 2014
        • Table Kulicke & Soffa: Geographical Segmentation by Revenue 2014
      • Business Strategy
      • Recent Developments
      • SWOT Analysis
  • Other Reports in this Series

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