Market Research Logo

Global Die Bonder Equipment Market 2017-2021

Global Die Bonder Equipment Market 2017-2021

About Die Bonder Equipment

Die bonder equipment are a type of semiconductor packaging and assembly equipment in which wafers are cut into dies, and the functional dies are separated from the defective ones, which are already marked before this step. bonder equipment are a type of semiconductor packaging and assembly equipment in which wafers are cut into dies, and the functional dies are separated from the defective ones, which are already marked before this step.

Technavio’s analysts forecast the global die bonder equipment market to grow at a CAGR of 2.28% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global die bonder equipment market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Die Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of operating in this market.

Key vendors
  • ASM Pacific Technology (ASMPT)
  • Kulicke & Soffa
  • Palomar Technologies
Other prominent vendors
  • Besi
  • DIAS Automation
  • Hesse
  • Hybond
  • SHINKAWA
  • Toray Engineering
  • West-Bond
Market driver
  • Demand for high-quality semiconductor ICs for wireless devices and IoT applications.
  • For a full, detailed list, view our report
Market challenge
  • High demand for polymer adhesive wafer bonding equipment.
  • For a full, detailed list, view our report
Market trend
  • Increase in M&A in the semiconductor packaging and assembly market.
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are in this market space?
  • What are the market opportunities and threats faced by the key vendors??
  • What are the strengths and weaknesses of the key vendors??


Press Release

Technavio Announces the Publication of its Research Report – Global Die Bonder Equipment Market 2017-2021

Technavio recognizes the following companies as the key players in the global die bonder equipment market: ASM Pacific Technology (ASMPT), Kulicke & Soffa, and Palomar Technologies.

Other Prominent Vendors in the market are: Besi, DIAS Automation, Hesse, Hybond, SHINKAWA, Toray Engineering, and West-Bond.

Commenting on the report, an analyst from Technavio’s team said: “One trend in market is increase in number of OSAT vendors. The number of OSATs in APAC, especially China, is growing at a considerable pace since these companies have a strong liquidity and financial backing. This enables OSATs to have adequate funds for R&D and capacity expansion. Moreover, governmental support toward the development of the semiconductor industry from major APAC countries, such as South Korea, China, and Japan, is propelling the growth of these facilities. The easy availability of capital is likely to boost the development of these companies while ensuring scale and technical competence through acquisitions. The increase in the number of OSATS signifies that most companies in the semiconductor market are resorting to the fabless model. This is to increase the orders received for packaging by these OSATs who must increase their production capacities. This is expected to generate a significant demand for the die bonder equipment in the market during the forecast period.”

According to the report, one driver in market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is defined by relationship-based sales. The selling price of such equipment is usually in the range of $100,000 to $1,000,000. Therefore, manufacturers develop long-standing relations with customers for buying their products. The main aim of such relations is to convince their customers to procure the necessary equipment from them by offering incentives and discounts for future purchases. Equipment manufacturers mostly target those customers who tend to procure equipment for a significant sum, thereby accounting for more than 5%-10% of their global sales. Semiconductor device manufacturers and packaging houses may consider repeated purchase in the future as they get attracted by the discounts and incentives. Thus, equipment vendors offer price discounts to have a sustaining customer base.

Further, the report states that one challenge in market is cyclical nature of semiconductor industry. The cyclical nature of the semiconductor equipment industry affects the operating results of the equipment vendors due to severe downturns. The equipment manufacturers face risks such as overcapacity, low demand, and high price competition. Changes in customer requirements due to new manufacturing capacity and advances in technology affect equipment manufacturers considerably. The capital expenditure of semiconductor device manufacturers affects the semiconductor manufacturing equipment vendors. During the period of overcapacity, device manufacturers reduce their capital expenditure and demand for semiconductor manufacturing equipment. This results in underutilization of vendor factories. During this cyclical period, customers reduce purchases, delay delivery of ordered products, or cancel orders. This results in reduced net sales and backlog, delays in revenue recognition, and excess inventory for the vendors, which act as a major challenge for the vendors. In addition, high price competition due to low demand in the market affects their gross margins.

Companies Mentioned

ASM Pacific Technology (ASMPT), Kulicke & Soffa, Palomar Technologies, Besi, DIAS Automation, Hesse, Hybond, SHINKAWA, Toray Engineering, and West-Bond.

  • Executive summary
  • Scope of the report
  • Research Methodology
  • Introduction
    • Key market highlights
  • Market landscape
    • Overview of semiconductor packaging and assembly equipment
      • Table Steps involved in back-end chip formation
    • Ecosystem of semiconductor IC packaging industry
      • Table Supply chain in traditional semiconductor IC packaging industry
      • Table Supply chain in new semiconductor IC packaging industry
    • Market overview
      • Table Global die bonder market
    • Market size and forecast
      • Table Global die bonder equipment market 2016-2021 ($ millions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by end-user
    • Market overview
      • Table Global die bonder equipment market: Segmentation by end-user 2016-2021 (% share)
      • Table Global die bonder equipment market: Segmentation by end-user 2016-2021 ($ million)
    • OSATs
      • Table Global die bonder equipment market by OSATs 2016-2021 ($ millions)
    • IDMs
      • Table Global die bonder equipment market by IDMs 2016-2021 ($ millions)
  • Geographical segmentation
    • Table Global die bonder equipment market: Segmentation by geography 2016-2021 (% share)
    • Table Global die bonder equipment market: Segmentation by region-wise revenue trendline 2016-2021 ($ millions)
    • Die bonder equipment market in APAC
      • Table Die bonder equipment market in APAC 2016-2021 ($ millions)
    • Die bonder equipment market in Americas
      • Table Die bonder equipment market in Americas 2016-2021 ($ millions)
    • Die bonder equipment market in EMEA
      • Table Die bonder equipment market in EMEA 2016-2021 ($ millions)
  • Key leading countries
    • Table Key leading countries
    • Table Percentage share of key leading countries over the forecast period (2016-2021)
    • Taiwan
    • South Korea
    • Japan
    • China
  • Decision framework
  • Drivers and challenges
    • Market drivers
    • Impact of drivers on key customer segments
      • Table Impact of drivers
    • Market challenges
      • Table Global semiconductor market trend 1992-2016 ($ billions)
    • Impact of challenges on key customer segments
      • Table Impact of challenges
  • Market trends
    • Growing use of 3D chip packaging
    • Increase in number of OSAT vendors
    • Increase in M&A in the semiconductor packaging and assembly market
    • Advent of FOWLP technology
    • Automation in automobiles
      • Table Global automobile unit production 2016-2021 (Million units)
  • Vendor landscape
    • Competitive scenario
    • Major vendors
    • Other prominent vendors
      • Table Other vendors in the global die bonder equipment market
  • Appendix
    • List of abbreviations
  • Explore Technavio

Download our eBook: How to Succeed Using Market Research

Learn how to effectively navigate the market research process to help guide your organization on the journey to success.

Download eBook

Share this report