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Global Chip-on-flex (COF) Market 2017-2021

  • Executive summary
  • Scope of the report
  • Research Methodology
    • Economic Indicators
  • Introduction
    • Market outline
  • COB technology overview
    • COB manufacturing process flow
      • Table COB manufacturing process flow
    • Advantages of COB LED technology
      • Table Advantages of COB LED
  • Outlook
    • Market overview
    • Market size and forecast
      • Table Global COF market 2016-2021 ($ millions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by type
    • Global COF market by type 2016-2021
      • Table Global COF market by type 2016-2021 (%)
      • Table Global COF market by type 2016-2021 ($ millions)
    • Single-sided COF
      • Table Global single-sided COF market 2016-2021 ($ millions)
    • Others
      • Table Global other COF market 2016-2021 ($ millions)
  • Geographical segmentation
    • Global COF market by geography 2016-2021
      • Table Global COF market by geography 2016-2021 (%)
      • Table Global COF market by geography 2016-2021 ($ millions)
    • APAC
      • Table COF market in APAC 2016-2021 ($ millions)
    • Americas
      • Table COF market in Americas 2016-2021 ($ millions)
    • EMEA
      • Table COF market in EMEA 2016-2021 ($ millions)
  • Decision framework
  • Drivers and challenges
    • Market drivers
    • Market challenges
  • Market trends
    • Increasing vertical integration
    • Increasing popularity of rechargeable printed batteries
    • Growth of innovative applications
    • Increased availability of flexible devices
    • Proliferation of printed electronics
      • Table Printed electronics products of 2016
  • Vendor landscape
    • Competitive scenario
      • Table Ansoff Matrix
  • Key vendors
    • Other prominent vendors
  • Appendix
    • List of abbreviations
  • Explore Technavio

Global Chip-on-flex (COF) Market 2017-2021

About Chip-on-flex

COF is a type of chip-on-board (COB) process technology. The fundamentals of the COB process involve attaching die or a chip in place and wire bonding it directly to the substrate metallization, alongside other surface mount devices (SMD) attached by standard surface mount technology (SMT) processes. The process significantly improves lead time, footprint efficiency, and is affordable.

Technavio’s analysts forecast the global chip-on-flex market to grow at a CAGR of 4.42% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global chip-on-flex market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Chip-on-flex Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • FLEXCEED Co., Ltd.
  • Finetech
  • SHENZHEN DANBOND TECHNOLOGY CO., LTD.
  • AKM Industrial
Other prominent vendors
  • Compunetix
  • Stars Microelectronics
  • Compass Technology
Market driver
  • Increased R&D investments in flexible displays market
  • For a full, detailed list, view our report
Market challenge
  • Lag in mass production of flexible OLED displays
  • For a full, detailed list, view our report
Market trend
  • Increasing vertical integration
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?


Press Release

Technavio Announces the Publication of its Research Report – Global Chip-on-flex (COF) Market 2017-2021

Technavio recognizes the following companies as the key players in the global chip-on-flex market: FLEXCEED Co., Ltd., Finetech, SHENZHEN DANBOND TECHNOLOGY CO., LTD., and AKM Industrial.

Other Prominent Vendors in the market are: Compunetix, Stars Microelectronics, and Compass Technology.

Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is Increasing vertical integration. Rapid innovations in flexible displays have led to dynamic manufacturing plants. As flexible displays are yet to be completely commercialized, different modular pieces of manufacturing lines are being integrated so that any modification can be easily controlled and modified to suit the demand for flexible display manufacturing. OLEDs have led to a high level of optimized manufacturing plants. A high level of vertical integration leads to an agile production line and faster development or production of flexible displays. This, in turn, leads to reduced cost of the final product and rapid commercialization of the innovation.”

According to the report, one of the major drivers for this market is Increased R&D investments in flexible displays market. Most of the market revenue comes from the R&D divisions of the end-users, as the technology is yet to be commercialized on a large scale and is still in the development stages. Due to extensive developments in the smart devices market from 2014, corporations have been investing in R&D of hardware devices to come up with screens or displays that are more durable, of better quality, and cost efficient.

Further, the report states that one of the major factors hindering the growth of this market is Lag in mass production of flexible OLED displays. There is a lack of mass production plants that can churn out products at the rate at which the innovation continues, as the flexible display market is still in its nascent stage. This leads to a lack in the commercialization of products and thereby constraints in achieving economies of scale for vendors. APAC usually holds mass production plants whereas most of the R&D or university partnerships are in the North American market. This leads to a lag in prototype to product stage.

Companies Mentioned

FLEXCEED Co., Ltd., Finetech, SHENZHEN DANBOND TECHNOLOGY CO., LTD., AKM Industrial, Compunetix, Stars Microelectronics, and Compass Technology.

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