Global Chip Mounter Market 2016-2020
About the Chip Mounter Market
The chip mounting technology has progressed significantly over the last two decades in terms of a practical solution for achieving higher densities related to packaging systems. It started with the conventional through hole technology (THT), then resurfaced as surface mount technology (SMT) and fine pitch technology (FPT). Most manufacturers are using both SMT and THT to produce chips mounted on substrates. The dynamic semiconductor packaging technology has evolved with the help of THT (with component steers through 2.54 mm hole). Then comes SMT, which leads on 1.27 mm hole with minimal sized centers. The FPT leads on 0.63 mm as well as 0.50 mm centers. The component package mainly consists of a silicon-based die or integrated circuits chips, which got reduced to a large extent within the last two decades. Thus, the chip mounting technology has moved from a big diameter to a small diameter of space.
Technavio’s analysts forecast the global chip mounter market to grow at a CAGR of 8.05% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global chip mounter market for 2016-2020. To calculate the market size, the report considers revenue from the sales of chip mounter equipment. The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Chip Mounter Market 2016-2020
Technavio recognizes the following companies as the key players in the global chip mounter market: Hitachi, Juki Corporation, Nitto Denko Corporation, Panasonic, and Yamaha Corporation.
Other Prominent Vendors in the market are: ASM Pacific Technology, Canon, Essemtec, Ohashi Engineering, Nordson, Samsung Techwin, Sony, Sun Electric Industries, and TOA.
Commenting on the report, an analyst from Technavio’s team said: “A trend which is expected to have a big impact on the market is the emergence of wearable technology. Wearable technology is a form of communication technology that can be attached to the body and can be used to monitor daily activities as well as to use smartphone functionalities. It includes smart watches, smart glasses, smart fabrics, heart rate monitors, and fitness tracking gadgets such as FitBit Surge and Garmin Vivoactive. IC manufacturers such as Toshiba have started developing specialized ICs to fulfill the requirements of wearable technology.”
According to the report, a key growth driver is the growing use of communication related electronic gadgets. The consumer electronics market has seen massive transformations in the last two decades. Smartphones replaced feature phones and laptops replaced PCs. Now, tablets are replacing laptops, and LEDs and Smart TVs are replacing CRT TVs. Household electronics such as coffee makers and washing machines are becoming fully automated. Such advanced transformations require constant upgrades in consumer offerings in terms of design, processing power, power consumption, and user interface.
Further, the report states that one challenge that could dampen market growth is uncertain global economic conditions. Capital investments and the risk involved in terms of the performance of new chip mounting technologies such as SMT are high in the semiconductor market. Therefore, end-products such as miniaturized ICs and their revenue-generation capability in the future need to be robust.
Hitachi, Juki Corporation, Nitto Denko Corporation, Panasonic, Yamaha Corporation, ASM Pacific Technology, Canon, Essemtec, Ohashi Engineering, Nordson, Samsung Techwin, Sony, Sun Electric Industries, TOA.