About the Bonding Wire Packaging Material Market
Bonding wires can be made up of gold, copper, silver, and aluminum. The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Bonding wires made of gold dominated the bonding wire packaging material market for decades. However, the industry is shifting toward the use of copper and other materials, which include silver as the new addition since 2010. The market share of gold in terms of volume used for bonding wire was more than 95% in 2007 and dropped to 40% in 2015 due to rising prices of gold. The remaining volume was replaced by copper and silver in 2015.
Technavio’s analysts forecast the global bonding wire packaging material market will generate revenues of USD 2.9 billion in 2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global bonding wire packaging material market for 2016-2020. To calculate the market size, the report considers revenue generated from the consumption of bonding wires for packaging materials.
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Bonding Wire Packaging Material Market 2016-2020
Technavio recognizes the following companies as the key players in the global bonding wire packaging material market: TANAKA Precious Metals, Heraeus Deutschland, California Fine Wire, and MK Electron.
Other Prominent Vendors in the market are: AMETEK, EMMTECH, Inseto, Palomar Technologies, RED Micro Wire, SHINKAWA, Sumitomo Metal Mining, and Tatsuta Electric Wire & Cable.
Commenting on the report, an analyst from Technavio’s team said: “One trend which will boost market growth is the migration to smaller diameter wires. The semiconductor industry is constantly evolving amid rapid advances in technology and miniaturization, which will lead to bonding wires with smaller diameters. Reduction in wire diameter is an effective way to reduce costs in the bonding wire packaging material market, as gold content accounts for the majority of bonding wire expense.”
According to the report, a key growth driver is the rising need for miniaturization. The increasing demand for miniaturization in the semiconductor industry has made bonding wires an important part of electronic assemblies. Fine and ultrafine bonding wires of gold, aluminum, copper, and palladium are used for the production of bonding wires. The uniformity of the wires with quality is in high demand. Vendors need to constantly upgrade their offerings with more advanced and compact packaging materials, such as bonding wires with smaller diameters, to cater to consumer requirements.
Further, the report states that one challenge that could impact market growth is the migration to flip chip packaging technology. A flip chip eliminates the primary technical limitations of wire bonding by providing an area-array interconnect and reducing interconnect inductance, which helps in higher frequency performance.
TANAKA Precious Metals, Heraeus Deutschland, California Fine Wire, MK Electron, AMETEK, EMMTECH, Inseto, Palomar Technologies, RED Micro Wire, SHINKAWA, Sumitomo Metal Mining, Tatsuta Electric Wire & Cable.
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