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Global Bonding Wire packaging material market 2016-2020

  • Executive summary
    • Highlights
  • Scope of the report
    • Definition
    • Source year and forecast period
    • Market coverage
    • Market size computation
    • Market segmentation
      • Table Segmentation of global bonding wire packaging material market
    • Geographical coverage
      • Table Key regions
    • Vendor segmentation
    • Common currency conversion rates
      • Table Common currency conversion rates
    • Top vendor offerings
      • Table Product offerings
  • Market research methodology
    • Research methodology
    • Economic indicators
  • Introduction
    • Key market highlights
      • Table Chemical composition of semiconductor materials
  • Market landscape
    • Global semiconductor market overview
      • Table Top ten semiconductor vendors 2015
      • Table Global semiconductor market structure 2015
      • Table Global semiconductor market trend 1990-2015 ($ billions)
      • Table Semiconductor IC manufacturing process
      • Table Front-end chip formation steps
      • Table Back-end chip formation steps
    • Wafer-level manufacturing equipment categories
      • Table Wafer-level manufacturing equipment categories
      • Table Requirements of manufacturing equipment
      • Table Semiconductor industry value chain
    • Market overview
    • Market size and forecast
      • Table Global bonding wire packaging material market 2015-2020 ($ billions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by material type
    • Global bonding wire packaging material market by material type 2015
      • Table Global bonding wire packaging material market by material type 2015
    • Global bonding wire packaging material market by material type 2020
      • Table Global bonding wire packaging material market by material type in 2020
    • Global bonding wire packaging material market by gold
      • Table Global bonding wire packaging material market by gold ($ millions)
    • Global bonding wire packaging material market by PCC
      • Table Global bonding wire packaging material market by PCC ($ billions)
    • Global bonding wire packaging material market by copper
      • Table Global bonding wire packaging material market by copper ($ millions)
    • Global bonding wire packaging material market by silver
      • Table Global bonding wire packaging material market by silver ($ millions)
      • Table Segmentation of silver wire application
  • Geographical segmentation
    • Global bonding wire packaging material market by geography 2015
      • Table Global bonding wire packaging material market by geography 2015
    • Global bonding wire packaging material market by geography 2020
      • Table Global bonding wire packaging material market by geography 2020
    • APAC
      • Table Bonding wire packaging material market in APAC 2015-2020 ($ billions)
    • North America
      • Table Bonding wire packaging material market in North America 2015-2020 ($ millions)
    • Europe
      • Table Bonding wire packaging material market in Europe 2015-2020 ($ millions)
    • ROW
      • Table Bonding wire packaging material market in ROW 2015-2020 ($ millions)
  • Key leading countries
    • Key leading countries in global bonding wire packaging material market
      • Table Key leading countries in global bonding wire packaging material market 2015
      • Table Key leading countries in global bonding wire packaging material market 2020
  • Summary of key figures
    • Table Material-type segments: Year-over-year revenue comparison ($ millions)
    • Table Geographical segments: Year-over-year revenue comparison ($ millions)
  • Market drivers
    • Growing transition to copper wire
    • Rising need for miniaturized semiconductor devices
  • Impact of drivers
    • Table Impact of drivers
  • Market challenges
    • Limitations of copper wire
    • Migration to flip chip packaging technology
  • Impact of drivers and challenges
    • Table Impact of drivers and challenges
  • Market trends
    • Silver bonding wire as upcoming alternative
    • Migration to smaller diameter wires
  • Vendor landscape
    • Competitive scenario
    • Other prominent vendors
      • Table Other prominent vendors
  • Appendix
    • List of abbreviations
  • Explore Technavio

About the Bonding Wire Packaging Material Market

Bonding wires can be made up of gold, copper, silver, and aluminum. The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Bonding wires made of gold dominated the bonding wire packaging material market for decades. However, the industry is shifting toward the use of copper and other materials, which include silver as the new addition since 2010. The market share of gold in terms of volume used for bonding wire was more than 95% in 2007 and dropped to 40% in 2015 due to rising prices of gold. The remaining volume was replaced by copper and silver in 2015.

Technavio’s analysts forecast the global bonding wire packaging material market will generate revenues of USD 2.9 billion in 2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global bonding wire packaging material market for 2016-2020. To calculate the market size, the report considers revenue generated from the consumption of bonding wires for packaging materials.

The market is divided into the following segments based on geography:

  • APAC
  • Europe
  • North America
  • ROW
Technavio's report, Global Bonding Wire Packaging Material Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • TANAKA Precious Metals
  • Heraeus Deutschland
  • California Fine Wire
  • MK Electron
Other prominent vendors
  • AMETEK
  • EMMTECH
  • Inseto
  • Palomar Technologies
  • RED Micro Wire
  • SHINKAWA
  • Sumitomo Metal Mining
  • Tatsuta Electric Wire & Cable
Market driver
  • Rising need for miniaturization
  • For a full, detailed list, view our report
Market challenge
  • Migration to flip chip packaging technology
  • For a full, detailed list, view our report
Market trend
  • Migration to smaller diameter wires
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – Global Bonding Wire Packaging Material Market 2016-2020

Technavio recognizes the following companies as the key players in the global bonding wire packaging material market: TANAKA Precious Metals, Heraeus Deutschland, California Fine Wire, and MK Electron.

Other Prominent Vendors in the market are: AMETEK, EMMTECH, Inseto, Palomar Technologies, RED Micro Wire, SHINKAWA, Sumitomo Metal Mining, and Tatsuta Electric Wire & Cable.

Commenting on the report, an analyst from Technavio’s team said: “One trend which will boost market growth is the migration to smaller diameter wires. The semiconductor industry is constantly evolving amid rapid advances in technology and miniaturization, which will lead to bonding wires with smaller diameters. Reduction in wire diameter is an effective way to reduce costs in the bonding wire packaging material market, as gold content accounts for the majority of bonding wire expense.”

According to the report, a key growth driver is the rising need for miniaturization. The increasing demand for miniaturization in the semiconductor industry has made bonding wires an important part of electronic assemblies. Fine and ultrafine bonding wires of gold, aluminum, copper, and palladium are used for the production of bonding wires. The uniformity of the wires with quality is in high demand. Vendors need to constantly upgrade their offerings with more advanced and compact packaging materials, such as bonding wires with smaller diameters, to cater to consumer requirements.

Further, the report states that one challenge that could impact market growth is the migration to flip chip packaging technology. A flip chip eliminates the primary technical limitations of wire bonding by providing an area-array interconnect and reducing interconnect inductance, which helps in higher frequency performance.



Companies Mentioned

TANAKA Precious Metals, Heraeus Deutschland, California Fine Wire, MK Electron, AMETEK, EMMTECH, Inseto, Palomar Technologies, RED Micro Wire, SHINKAWA, Sumitomo Metal Mining, Tatsuta Electric Wire & Cable.

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