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Global Back End of the Line Semiconductor Equipment Market 2016-2020

Global Back End of the Line Semiconductor Equipment Market 2016-2020

About Semiconductor Equipment Industry

The semiconductor equipment industry is an important part of the overall semiconductor market, with semiconductor chip makers investing 20% of their sales toward obtaining manufacturing equipment. The equipment manufacturing companies are leading the development of most core process technologies in the semiconductor market. The semiconductor production equipment industry is divided into front-end and back-end process equipment.

Technavio’s analysts forecast the global back end of the line semiconductor equipment market to grow at a CAGR of 1.41% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global back end of the line semiconductor equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of BEOL semiconductor equipment.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global Back End of the Line Semiconductor Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • TEL
Other prominent vendors
  • Dainippon Screen Manufacturing
  • Hitachi High-Technologies
  • Hitachi Kokusai Electric
  • Nikon
Market driver
  • Rising demand for flip chip and advanced packaging technologies
  • For a full, detailed list, view our report
Market challenge
  • Dependency on few key suppliers
  • For a full, detailed list, view our report
Market trend
  • Increased need for semiconductor memory devices
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – Global Back End of the Line Semiconductor Equipment Market 2016-2020

Technavio recognizes the following companies as the key players in the global back end of the line semiconductor equipment market: Applied Materials, ASML, KLA-Tencor, Lam Research, and TEL.

Other Prominent Vendors in the market are: Dainippon Screen Manufacturing, Hitachi High-Technologies, Hitachi Kokusai Electric, and Nikon.

Commenting on the report, an analyst from Technavio’s team said: “Increase in the number of fabless semiconductor companies will be a key trend for market growth. Semiconductor companies are going fabless in order to minimize overhead costs related to operations and maintenance of foundries. The majority of semiconductor companies are more intent on the design and development of their solutions, thereby outsourcing fabrication and other foundry-related activities to companies specializing in manufacturing, assembly, and testing of semiconductor ICs. This has affected the ratio of foundries and fabless companies, which stood at 1:11 in 2015 in the global semiconductor market. The rising number of fabless manufacturers will lead to an increase in the net aggregate demand for semiconductor ICs, thus generating demand for BEOL semiconductor equipment.”

According to the report, advanced transformation requires constant upgrades in consumer offerings. Capital investments play a key role in ensuring that R&D activities never suffer a cash crunch. Therefore, the proliferation of advanced consumer electronics will only induce more capital investments and hence is a key driver.

Further, the report states that high investment will be a challenge for the market. The increase in demand for compact ICs and the emergence of new 3D packaging solutions like TSV, stacked packaging, flip chip packaging, and MEMS packaging have led to a change in the manufacturing process of semiconductor ICs. Manufacturers are required to invest heavily in manufacturing equipment to produce compact ICs. Furthermore, the manufacturing process is complex, requires more time, and have a high probability of defects, thereby increasing the cost of manufacturing. The rapid technological changes in the semiconductor industry compel vendors to upgrade and maintain their equipment, which increases the cost of ownership of the equipment. Therefore, companies are going fabless, which is reducing the number of potential customers for semiconductor BEOL semiconductor equipment vendors.

Companies Mentioned

Applied Materials, ASML, KLA-Tencor, Lam Research, TEL, Dainippon Screen Manufacturing, Hitachi High-Technologies, Hitachi Kokusai Electric, and Nikon.

  • Executive summary
    • Highlights
  • Scope of the report
    • Market overview
    • Definition
    • Base year
    • Product segmentation
    • End-user segmentation
    • Geographical segmentation
      • Table List of major countries considered
    • Vendor selection
    • Common currency conversion rates
      • Table Common currency conversion rates
    • Top-vendor offerings
      • Table Product offerings
  • Market research methodology
    • Research methodology
    • Economic indicators
  • Introduction
    • Key market highlights
      • Table Semiconductor production equipment
  • Market landscape
    • Technology landscape of wafer fab equipment
      • Table Semiconductor IC manufacturing process
      • Table Front-end chip formation steps
      • Table Back-end chip formation steps
    • Wafer-level manufacturing equipment categories
      • Table Wafer-level manufacturing equipment categories
      • Table Requirements of a manufacturing equipment
    • Key customers
    • Market size and forecast
      • Table Global BEOL semiconductor equipment market ($ billions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by product
    • Market overview
    • Market size and forecast
      • Table Global BEOL semiconductor equipment market by product 2015-2020 (% share)
      • Table Global BEOL semiconductor equipment market by product 2015-2020 ($ billions)
    • Stepper
      • Table Global BEOL semiconductor equipment market by stepper segment 2015-2020 ($ billions)
    • CVD equipment
      • Table Global BEOL semiconductor equipment market by CVD equipment segment 2015-2020 ($ billions)
    • Coater developer
      • Table Global BEOL semiconductor equipment market by coater developer segment 2015-2020 ($ billions)
    • Wet station
      • Table Global BEOL semiconductor equipment market by wet station segment 2015-2020 ($ billions)
    • PVD equipment
      • Table Global BEOL semiconductor equipment market by PVD equipment segment 2015-2020 ($ billions)
    • CMP equipment
      • Table Global BEOL semiconductor equipment market by CMP equipment segment 2015-2020 ($ billions)
    • Metal etching equipment
      • Table Global BEOL semiconductor equipment market by metal etching equipment segment 2015-2020 ($ billions)
  • Market segmentation by end user
    • Market overview
    • Market size and forecast
      • Table Global BEOL semiconductor equipment market by end-user 2015-2020 (% share)
      • Table Global BEOL semiconductor equipment market by end-user 2015-2020 ($ billions)
    • Foundry
      • Table Global BEOL semiconductor equipment market by foundry segment 2015-2020 ($ billions)
    • Memory
      • Table Global BEOL semiconductor equipment market by memory segment 2015-2020 ($ billions)
    • IDM
      • Table Global BEOL semiconductor equipment market by IDM segment 2015-2020 ($ billions)
  • Geographical segmentation
    • Market size and forecast
      • Table Segmentation of global BEOL semiconductor equipment market by geography 2015-2020 (% share)
      • Table Segmentation of global BEOL semiconductor equipment market by geography 2015-2020 ($ millions)
    • APAC
      • Table BEOL semiconductor equipment market in APAC ($ billions)
    • Americas
      • Table BEOL semiconductor equipment market in Americas ($ billions)
    • EMEA
      • Table BEOL semiconductor equipment market in EMEA ($ billions)
  • Key leading countries
  • Market drivers
    • Increase in number of fabs
      • Table Global NAND flash market 2015-2020 (% share)
    • Miniaturization of electronic devices
    • Proliferation of advanced consumer electronic products
    • Rising demand for flip chip and advanced packaging technologies
    • High requirement of SoC technology
  • Impact of drivers
    • Table Impact of drivers
  • Market challenges
    • Dependency on few key suppliers
    • High investment market
    • Fluctuations in the semiconductor industry
  • Impact of drivers and challenges
    • Table Impact of drivers and challenges
  • Market trends
    • Increase in the number of fabless semiconductor companies
    • Increased need for semiconductor memory devices
      • Table CAGR of 3D NAND and DRAM 2015-2020
    • Growing application of IoT
    • Vehicle automation
      • Table Cars shipment growth forecast 2015-2020 (% growth)
  • Vendor landscape
    • Competitive landscape
      • Table Key vendors
      • Table ASML customers by end-user segment
    • Other prominent vendors
      • Table Other prominent vendors
  • Explore Technavio

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