About Automotive Body Control Module
The body control module (BCM) monitors the various driver switches and controls power to corresponding loads in a vehicle. A vehicle could have single or multiple BCMs to monitor and control the switches, sensors, and automatic reactions. BCM plays a crucial role in controlling interior electronics. The increasing use of electronic components in automotive will increase the use of BCMs. With the increase in the number of electronic components in automobiles, the control becomes complicated. Therefore, there is an increased need for a separate control module for the automotive parts to organize the electronic content effectively. The increasing need for safety and comfort is one of the main reasons for the increase in electronic content. The interior electronics have a major part in ECU, which is controlled by the BCM. The use of the electronics in automotive which needs BCMs for controlling would be more. The need for the BCM increases with the increase in the electronic content related to BCM.
Technavio’s analysts forecast the global automotive body control module market to grow at a CAGR of 2.06% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global automotive body control module market for 2017-2021. To calculate the market size, the report considers the new installations of BCM in the passenger vehicles and commercial vehicles, and it excludes the aftermarket BCMs.
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Automotive Body Control Module Market 2017-2021
Technavio recognizes the following companies as the key players in the global automotive body control module market: Bosch, Continental, Delphi, DENSO, and HELLA
Other Prominent Vendors in the market are: HYUNDAI MOBIS, ZF Friedrichshafen, Hitachi Automotive Systems, Renesas Electronics, Texas Instruments, Infineon Technologies, FEV, Samvardhana Motherson Group, Lear, and OMRON.
Commenting on the report, an analyst from Technavio’s team said: “The latest trend gaining momentum in the market is Increasing demand for small and reliable BCM. The automotive BCM has become increasingly complex in its design. Although multiple BCMs are used to compensate for the increasing electronic content in the vehicle, the need for smaller BCMs remains. With the continuous improvement and innovation in the market, the BCM manufacturers have started manufacturing small and reliable BCMs for automotive. For instance, Delphi has manufactured BCMs that enable inputs and output to be linked through powerful microprocessor by using ASIC and SMD to ensure that the body electronic components are small and reliable. This BCM can perform many body, security, and convenience functions. The continuous innovation and the increase in demand for the small and reliable modules would impact the global automotive BCM market in future.”
According to the report, one of the major drivers for this market is Multiple scalable BCM for different vehicle categories. The number of functions controlled by BCMs is increasing. Innovations in design to include more number of control functions in a single BCM would drive the global automotive BCM market during the forecast period. The manufacturers make multiple scalable BCM for different vehicles categories. There are different types BCMs, such as central BCM, high feature BCM, and low-cost BCM, with a high level of integration and scalability. The central BCM can accommodate growing number of functions, such as exterior and interior lighting, relay control, and multiple comfort functions, within a compact module. This supports a high level of integration and scalability. The semiconductor functions require a high level of integration and scalability in a smaller board space, which is provided by high feature BCM. The low-cost BCMs are made for satisfying the high demand of cost-effectiveness where the products are tailored to various electronic sub-functions with high scalability. These scalable, BCMs which are designed and produced for various vehicle categories, would drive the automotive BCM market.
Further, the report states that one of the major factors hindering the growth of this market is Increasing cost pressure. In the automotive industry value chain, the OEMs were absorbing the liability for most of the warranty costs and price pressure from the demand side in the past. However, this situation has changed over the past 5-6 years; the OEMs have pushed liabilities on tier-1 suppliers that, in return, push the cost pressure on component manufacturers. This has led to cost optimization across the industry to maintain profitability. One such means was to outsource manufacturing activities to low-cost countries, such as China, Taiwan, South Korea, and India. These countries are the largest manufacturers of automotive electronics in the world. The high concentration of PCB manufacturers in these countries is attributed to the availability of cheap labor, established raw material supply chain, and easy availability of raw materials.
Bosch, Continental, Delphi, DENSO, and HELLA, HYUNDAI MOBIS, ZF Friedrichshafen, Hitachi Automotive Systems, Renesas Electronics, Texas Instruments, Infineon Technologies, FEV, Samvardhana Motherson Group, Lear, and OMRON.
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