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Global 3D Semiconductor Packaging Market 2016-2020

Global 3D Semiconductor Packaging Market 2016-2020

About the 3D Semiconductor Packaging Market

Recent technology advances along with improved durability, reduced energy consumption, superior performance, enhanced quality, and highly efficient features of 3D semiconductor packaging equipment are making this equipment attractive packaging proposition in the semiconductor industry, especially in the consumer electronics industry. The increasing demand for consumer electronics is expected to increase the revenue of the global 3D semiconductor packaging market during the forecast period.

Technavio’s analysts forecast the global 3D semiconductor packaging market to grow at a CAGR of 16.27% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global 3D semiconductor packaging market for 2016-2020. To calculate the market size, the report considers revenue generated from the sales of 3D semiconductor packaging equipment to semiconductor component manufacturers. The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global 3D Semiconductor Packaging Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Amkor Technology
  • SUSS Microtek
  • EV Group
  • Tokyo Electron
Other prominent vendors
  • ACCRETECH Tokyo Seimitsu
  • Rudolph Technologies
  • SEMES
  • Ultratech
  • ULVAC
Market driver
  • Need to control chip design costs
  • For a full, detailed list, view our report
Market challenge
  • High capital investment in 3D semiconductor packaging
  • For a full, detailed list, view our report
Market trend
  • Short replacement cycle of portable electronic devices
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – Global 3D Semiconductor Packaging Market 2016-2020

Technavio recognizes the following companies as the key players in the global 3D semiconductor packaging market: Amkor Technology, SUSS Microtek, EV Group, and Tokyo Electron

Other Prominent Vendors in the market are: ACCRETECH Tokyo Seimitsu, Rudolph Technologies, SEMES, Ultratech, and ULVAC.

Commenting on the report, an analyst from Technavio’s team said: “One trend which is impacting market growth positively is the short replacement cycle of portable electronic devices. At present times, mobile devices such as tablets and smartphones have a tendency to become obsolete in a short period. Manufacturers launch subsequent models of their devices in every 12 months, cannibalizing the existing mobile device market. With the replacement period of product reduced to 8-12 months, the demand for semiconductor wafers that are used in electronic devices is expected to rise drastically.”

According to the report, a key growth driver is the need to control chip design costs. The increasing complexity of designing electronic devices that are required to implement technologies such as the Internet of Things (IoT) is causing a rapid rise in their designing costs. High designing costs are restricting semiconductor device manufacturers from adopting aggressive pricing strategies. In order to control their design costs and to ensure effective manufacturing of designs on the drawing board, companies such as Samsung are increasingly adopting 3D semiconductor packaging.

Further, the report states that one challenge that could restrict market growth is the high capital investment in 3D semiconductor packaging. The superior technology in the niche global 3D semiconductor packaging market demands huge capital investment from the players seeking to enter this market. As a result, the market is controlled by leading manufacturers that already have control over the global 3D semiconductor packaging market.

Companies Mentioned

Amkor Technology, SUSS Microtek, EV Group, Tokyo Electron, ACCRETECH Tokyo Seimitsu, Rudolph Technologies, SEMES, Ultratech, ULVAC.

  • Executive summary
    • Highlights
  • Scope of the report
    • Definition
    • Report overview
      • Table Global 3D semiconductor packaging market 2015
    • Base year and forecast period
    • Geographical segmentation
    • Common currency conversion rates
    • Vendor offerings
      • Table Product offerings
  • Market research methodology
    • Research methodology
    • Economic indicators
  • Introduction
    • Key market highlights
    • Technology landscape
      • Table 3D semiconductor packaging technology using TSVs
    • Industry overview
      • Table Evolution of semiconductor IC packaging
      • Table Color code indicating starting period of each packaging solutions
      • Table 2.5 D IC packaging technology using TSVs and silicon interposer
    • Global semiconductor industry value chain
      • Table Semiconductor value chain
      • Table Front-end processes
      • Table Back-end processes
  • Market landscape
    • Market overview
    • Market size and forecast
      • Table Global 3D semiconductor packaging market 2015-2020 ($ billions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by application
    • Global 3D semiconductor packaging market by application 2015-2020
      • Table Global 3D semiconductor packaging market by application 2015
      • Table Global 3D semiconductor packaging market by application 2020
    • Consumer electronics
      • Table Consumer electronics segment in global 3D semiconductor packaging market ($ billions)
    • Others
      • Table Global 3D semiconductor packaging market by others segment ($ millions)
  • Geographical segmentation
    • Table Revenue generation in 2015
    • Table Revenue generation in 2020
    • 3D semiconductor packaging market in APAC
      • Table 3D semiconductor packaging market in APAC 2015-2020 ($ billions)
    • 3D semiconductor packaging market in EMEA
      • Table 3D semiconductor packaging market in EMEA 2015-2020 ($ billions)
    • The Americas
      • Table 3D semiconductor packaging market in Americas 2015-2020 ($ millions)
  • Market drivers
    • Table Global smartphone shipment forecast 2015-2020 (millions of units)
    • Table Global tablet shipments forecast 2015-2020 (millions of units)
  • Impact of drivers
    • Table Impact of drivers
  • Market challenges
  • Impact of drivers and challenges
    • Table Impact of drivers and challenges
  • Market trends
    • Table Global MEMS market 2015-2020 ($ billions)
  • Vendor landscape
    • Competitive scenario
      • Table Principle parameters of competition
      • Table Comparison of leading vendors in global 3D semiconductor packaging market 2015
      • Table Amkor Technology: Revenue comparison from top application segments
    • Other prominent vendors
      • Table Other prominent vendors in global 3D semiconductor packaging market
  • Market summary
    • Table Market summary of 3D semiconductor packaging market 2015-2020
    • Table Application segments: Year-over-year revenue comparison ($ billions)
    • Table Geographical segments: Year-over-year revenue comparison ($ billions)
    • Table Application segments: Year-over-year revenue comparison (%)
    • Table Geographical segments: Year-over-year revenue comparison (%)
  • Appendix
    • List of abbreviations
  • Explore Technavio

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