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Global 3D IC Market 2015-2019

Global 3D IC Market 2015-2019

Market outlook of the 3D IC market

Technavio’s research analyst predicts the global 3D IC market to grow at a CAGR above 79% during the forecast period. The demand for compact and high-performance ICs in smartphones, tablet PCs, smart TVs, automotive products, and heavy equipment is the primary growth driver for this market. In comparison to 2D ICs, they have better performance and high bandwidth. Moreover, 3D ICs have a lesser number of interconnections between the packages, consumes less power, and require less space on electronic boards.

The high proliferation of IoT devices is expected to boost the market growth during the forecast period. Vendors in IoT market are constantly innovating in designing, manufacturing, and packaging. This enables them to come up with new IoT products in different verticals such as consumer electronics, healthcare, and manufacturing. 3D MEMS and sensors are used to capture data in a real-time scenario, which helps the company in increasing the returns by streamlining the process, increasing productivity, and enabling predictive maintenance. They also reduce the maintenance cost and the possibility of a sudden stop of work due to machinery failure.

Product segmentation and analysis of the 3D IC market

  • Memories
  • Sensors
  • MEMS
  • LEDs
The memory product segment dominated the market during 2014, with a market share of over 62%. Technological advances such as high storage capacity and less power consumption are increasing the adoption of 3D NAND and DDR4 DRAM in smartphones, tablet PCs, consumer electronics, and automotive products, thereby driving the growth of the 3D memory chips.

Geographical segmentation and analysis of the 3D IC market
  • Americas
  • APAC
  • EMEA
APAC accounted for 52% of the market share during 2014 and is expected to grow at a CAGR of 86% during the forecast period. The high growth in memory product segment and presence of several prominent manufacturers in the mobile and consumer electronics market such as Xiaomi, Samsung, LG, HTC, ZTE, Huawei, Lenovo, and Sony is expected to create a high demand for 3D ICs in the region during the forecast period.

Competitive landscape and key vendors

The global 3D IC market is at the nascent stage and manufacturers are aiming for the first mover advantage by making an early entry into the market. The vendors in the market compete on the basis of price, quality, innovation, and technology. Collaborations between OSAT, IDMs, and OEMs is expected to bring down the cost of 3D ICs in the coming years.

The leading vendors in the market are -
  • Advanced Semiconductor Engineering (ASE)
  • Samsung
  • STMicroelectronics
  • Taiwan Semiconductors Manufacturing (TSMC)
  • Toshiba
Other prominent vendors in the market include Intel, Micron, SanDisk, SK Hynix, STATS ChipPAC, United Microelectronics, and Xilinx.

Key questions answered in the report include
  • What will the market size and the growth rate be in 2019?
  • What are the key factors driving the global 3D IC market?
  • What are the key market trends impacting the growth of the 3D IC market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the vendors in the global 3D IC market?
  • Trending factors influencing the market shares of the Americas, APAC, and EMEA?
  • What are the key outcomes of the five forces analysis of the 3D IC market?
Technavio also offers customization on reports based on specific client requirement.

Related reports:
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  • Global Application Processor Market 2015-2019
  • Global Embedded Processors Market 2015-2019
  • Global Smart Card IC Market 2015-2019
  • Global System-on-Chip (SoC) Market 2015-2019


Press Release

Technavio Announces the Publication of its Research Report – Global 3D IC Market 2015-2019
Technavio recognizes the following companies as the key players in the Global 3D IC Market: Advanced Semiconductor Engineering (ASE), Samsung, STMicroelectronics, Taiwan Semiconductors Manufacturing (TSMC) and Toshiba
Other Prominent Vendors in the market are: Intel, Micron, SanDisk, SK Hynix, STATS ChipPAC, United Microelectronics, and Xilinx.
Commenting on the report, an analyst from Technavio’s team said: “Continuous miniaturization of electronic devices, and quick replacement cycle of mobile devices are expected to increase the demand for 3D ICs during the forecast period. Further, the increasing collaboration and R&D expenditure will help the vendors to come up with new products, which will increase the number of applications of 3D ICs during the forecast period.”
According to the report, the greater demand for high functionality devices and automated products is forcing original equipment manufacturers (OEMs to integrate their devices with 3D ICs, thereby creating demand for 3D ICs during the forecast period. The proliferation of IoT devices has enabled the OEMs to innovate and improve their products by using 3D ICs. The increase in awareness of energy-efficient lighting is expected to create the demand for 3D LEDs during the forecast period.
Further, the report states that due to high complexities in design and production cost, the adoption of 3D ICs is still in the nascent stage. Further, due to lack of established standards, the ecosystem of the supply chain is not yet established, which is hindering the growth of ICs.

Companies Mentioned

Advanced Semiconductor Engineering (ASE), Samsung, STMicroelectronics, Taiwan Semiconductors Manufacturing (TSMC), Toshiba, Intel, Micron, SanDisk, SK Hynix, STATS ChipPAC, United Microelectronics, Xilinx.

  • Executive summary
    • Highlights
  • Scope of the report
    • Market overview
      • Table Global 3D IC market segments: A snapshot
    • Top-vendor offerings
      • Table Product offerings
  • Market research methodology
    • Research methodology
    • Economic indicators
    • PEST analysis
  • Introduction
    • Key market highlights
  • Market landscape
    • Industry overview
      • Table Global semiconductor market overview 2014
    • Technology landscape
      • Table 2.5D IC block diagram
      • Table 3D IC block diagram
    • Ecosystem of 3D ICs
    • Market overview
    • Market size and forecast
      • Table Global semiconductor market (% share)
      • Table Global 3D IC market 2014-2019 ($ billions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by product types
    • Market overview
      • Table Global 3D IC market by products 2014 (% share)
    • Market size and forecast
      • Table Global 3D IC market 2014-2019 by products (% share)
      • Table Global 3D IC market 2014-2019 by products ($ billions)
  • Geographical segmentation
    • Market overview
      • Table Global 3D IC market by geography 2014 (% share)
    • Market size and forecast
      • Table Global 3D IC market by geography 2014-2019 (% share)
      • Table Global 3D IC market by geography 2014-2019 ($ billions)
      • Table CAGR of global 3D IC market by geography 2014-2019
  • Market drivers
    • Impact of drivers
      • Table Impact of market drivers on key customer segments
      • Table IoT spending and device penetration
  • Market challenges
  • Impact of drivers and challenges
    • Table Impact of drivers and challenges
  • Market trends
  • Vendor landscape
    • Competitive scenario
    • Key vendors
    • Other prominent vendors
  • Key vendor analysis
    • ASE
      • Table ASE: Business segmentation 2014 by revenue
      • Table ASE: Business segmentation by revenue 2013 and 2014 (in billions)
      • Table ASE: Geographical segmentation by revenue 2013
    • Samsung Electronics
      • Table Samsung Electronics: Business segmentation 2013
      • Table Samsung Electronics: Business segmentation by revenue 2013 and 2014 ($ billions)
      • Table Samsung Electronics: Geographical segmentation by revenue 2014
    • STMicroelectronics
      • Table STMicroelectronics: Business segmentation 2014 by revenue
      • Table STMicroelectronics: Business segmentation by revenue 2013 and 2014 ($ in billions)
      • Table STMicroelectronics: Geographical segmentation by revenue 2014
    • TSMC
      • Table TSMC: Business segmentation by revenue 2014
      • Table TSMC: Business segmentation by revenue 2013 and 2014 ($ billions)
      • Table TSMC: Geographical segmentation by revenue 2014
    • Toshiba
  • Key recommendations for vendors/investors
  • Appendix
    • List of abbreviations
  • Explore Technavio

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