Global 3D IC Market 2015-2019
Market outlook of the 3D IC market
Technavio’s research analyst predicts the global 3D IC market to grow at a CAGR above 79% during the forecast period. The demand for compact and high-performance ICs in smartphones, tablet PCs, smart TVs, automotive products, and heavy equipment is the primary growth driver for this market. In comparison to 2D ICs, they have better performance and high bandwidth. Moreover, 3D ICs have a lesser number of interconnections between the packages, consumes less power, and require less space on electronic boards.
The high proliferation of IoT devices is expected to boost the market growth during the forecast period. Vendors in IoT market are constantly innovating in designing, manufacturing, and packaging. This enables them to come up with new IoT products in different verticals such as consumer electronics, healthcare, and manufacturing. 3D MEMS and sensors are used to capture data in a real-time scenario, which helps the company in increasing the returns by streamlining the process, increasing productivity, and enabling predictive maintenance. They also reduce the maintenance cost and the possibility of a sudden stop of work due to machinery failure.
Product segmentation and analysis of the 3D IC market
Technavio Announces the Publication of its Research Report – Global 3D IC Market 2015-2019
Technavio recognizes the following companies as the key players in the Global 3D IC Market: Advanced Semiconductor Engineering (ASE), Samsung, STMicroelectronics, Taiwan Semiconductors Manufacturing (TSMC) and Toshiba
Other Prominent Vendors in the market are: Intel, Micron, SanDisk, SK Hynix, STATS ChipPAC, United Microelectronics, and Xilinx.
Commenting on the report, an analyst from Technavio’s team said: “Continuous miniaturization of electronic devices, and quick replacement cycle of mobile devices are expected to increase the demand for 3D ICs during the forecast period. Further, the increasing collaboration and R&D expenditure will help the vendors to come up with new products, which will increase the number of applications of 3D ICs during the forecast period.”
According to the report, the greater demand for high functionality devices and automated products is forcing original equipment manufacturers (OEMs to integrate their devices with 3D ICs, thereby creating demand for 3D ICs during the forecast period. The proliferation of IoT devices has enabled the OEMs to innovate and improve their products by using 3D ICs. The increase in awareness of energy-efficient lighting is expected to create the demand for 3D LEDs during the forecast period.
Further, the report states that due to high complexities in design and production cost, the adoption of 3D ICs is still in the nascent stage. Further, due to lack of established standards, the ecosystem of the supply chain is not yet established, which is hindering the growth of ICs.
Advanced Semiconductor Engineering (ASE), Samsung, STMicroelectronics, Taiwan Semiconductors Manufacturing (TSMC), Toshiba, Intel, Micron, SanDisk, SK Hynix, STATS ChipPAC, United Microelectronics, Xilinx.