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STATS ChipPAC Pte Ltd - Strategic SWOT Analysis Review

STATS ChipPAC Pte Ltd - Strategic SWOT Analysis Review

- provides a comprehensive insight into the company’s history, corporate strategy, business structure and operations. The report contains a detailed SWOT analysis, information on the company’s key employees, key competitors and major products and services.

This up-to-the-minute company report will help you to formulate strategies to drive your business by enabling you to understand your partners, customers and competitors better.


  • Business description – A detailed description of the company’s operations and business divisions.
  • Corporate strategy – GlobalData’s summarization of the company’s business strategy.
  • SWOT analysis – A detailed analysis of the company’s strengths, weakness, opportunities and threats.
  • Company history – Progression of key events associated with the company.
  • Major products and services – A list of major products, services and brands of the company.
  • Key competitors – A list of key competitors to the company.
  • Key employees – A list of the key executives of the company.
  • Executive biographies – A brief summary of the executives’ employment history.
  • Key operational heads – A list of personnel heading key departments/functions.
  • Important locations and subsidiaries – A list of key locations and subsidiaries of the company, including contact details.

STATS ChipPAC Pte Ltd (STATS ChipPAC) formerly STATS ChipPAC Ltd., a business unit of JCET-SC (Singapore) Pte Ltd, is a provider of fully integrated, multi-site, and end-to-end semiconductor packaging and testing solutions. It offers packaging design, assembly, test, and distribution solutions. The company semiconductor solutions through a broad technology portfolio ranging from leadframe and laminate packages to advanced fan-out and fan-in wafer level technology, flip chip interconnect, system-in-package, to through Silicon Via (TSV) and 2.5D/3D packaging. STATS ChipPAC’s packaging solutions include embedded wafer level ball grid array, encapsulated wafer level chip scale packaging, fcCuBE technology, and FlexLine wafer level manufacturing method. It markets services through its direct sales force in the US, South Korea, Singapore, China, Taiwan, and Switzerland. The company serves customers in the communication, consumer and computing sectors across North America, Asia, and Europe. It has manufacturing facilities in Singapore, South Korea and China. STATS ChipPAC is headquartered in Ang Mo Kio, Singapore.

Reasons to Buy
  • Gain key insights into the company for academic or business research purposes. Key elements such as SWOT analysis and corporate strategy are incorporated in the profile to assist your academic or business research needs.
  • Identify potential customers and suppliers with this report’s analysis of the company’s business structure, operations, major products and services and business strategy.
  • Understand and respond to your competitors’ business structure and strategies with GlobalData’s detailed SWOT analysis. In this, the company’s core strengths, weaknesses, opportunities and threats are analyzed, providing you with an up to date objective view of the company.
  • Examine potential investment and acquisition targets with this report’s detailed insight into the company’s strategic, business and operational performance.
Note: Some sections may be missing if data is unavailable for the company.

Section 1 - About the Company
STATS ChipPAC Pte Ltd - Key Facts
STATS ChipPAC Pte Ltd - Key Employees
STATS ChipPAC Pte Ltd - Key Employee Biographies
STATS ChipPAC Pte Ltd - Major Products and Services
STATS ChipPAC Pte Ltd - History
STATS ChipPAC Pte Ltd - Company Statement
STATS ChipPAC Pte Ltd - Locations And Subsidiaries
Head Office
Other Locations & Subsidiaries
Section 2 – Company Analysis
STATS ChipPAC Pte Ltd - Business Description
STATS ChipPAC Pte Ltd - SWOT Analysis
SWOT Analysis - Overview
STATS ChipPAC Pte Ltd - Strengths
Strength - Partnership with Cavendish Kinetics
Strength - Synergy with Parent Company
Strength - Integrated Offerings
STATS ChipPAC Pte Ltd - Weaknesses
Weakness - Operational Performance
Weakness - Working Capital Deficit
STATS ChipPAC Pte Ltd - Opportunities
Opportunity - Positive Outlook for Semiconductors: Asia Pacific
Opportunity - Increase in Production of Printed Circuit Boards: Taiwan and China
Opportunity - Demand for Smartphones: the US
Opportunity - Prospects for Growth in Demand for IoT: Japan
STATS ChipPAC Pte Ltd - Threats
Threat - Regional and Economic Influences
Threat - Rapid Technological Changes
Threat - Regulations
STATS ChipPAC Pte Ltd - Key Competitors
Section 3 – Appendix
About GlobalData
Contact Us
List of Tables
STATS ChipPAC Pte Ltd, Key Facts
STATS ChipPAC Pte Ltd, Key Employees
STATS ChipPAC Pte Ltd, Key Employee Biographies
STATS ChipPAC Pte Ltd, Major Products and Services
STATS ChipPAC Pte Ltd, History
STATS ChipPAC Pte Ltd, Other Locations
STATS ChipPAC Pte Ltd, Subsidiaries
STATS ChipPAC Pte Ltd, Key Competitors

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