Thin-Film Power Inductors

Global Thin-Film Power Inductors Market to Reach US$1.1 Billion by 2030

The global market for Thin-Film Power Inductors estimated at US$884.2 Million in the year 2024, is expected to reach US$1.1 Billion by 2030, growing at a CAGR of 4.1% over the analysis period 2024-2030. Surface Mount Technology, one of the segments analyzed in the report, is expected to record a 3.3% CAGR and reach US$720.6 Million by the end of the analysis period. Growth in the Through Hole Technology segment is estimated at 5.7% CAGR over the analysis period.

The U.S. Market is Estimated at US$240.9 Million While China is Forecast to Grow at 7.3% CAGR

The Thin-Film Power Inductors market in the U.S. is estimated at US$240.9 Million in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$227.2 Million by the year 2030 trailing a CAGR of 7.3% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 1.7% and 3.1% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 2.4% CAGR.

Global "Thin-Film Power Inductors" Market – Key Trends & Drivers Summarized

Why Are Thin-Film Power Inductors Becoming Indispensable in Miniature Electronics?
Thin-film power inductors are becoming vital components in today’s rapidly shrinking electronic devices, playing a key role in power management within smartphones, tablets, wearables, and IoT modules. As power efficiency becomes a defining metric in consumer and industrial electronics, these components offer a distinct advantage due to their low-profile form factor, high current handling, and excellent frequency response. Their miniaturized architecture makes them ideal for surface-mount devices in dense circuit layouts, where real estate is at a premium. Thin-film inductors also provide greater design flexibility compared to wire-wound alternatives, supporting multilayer configurations that allow integration directly onto semiconductor substrates. This embedded potential reduces parasitic losses and enhances electrical performance in RF circuits and DC-DC converters. Moreover, the compatibility of thin-film processes with semiconductor fabrication techniques is enabling their co-fabrication with other components, which is crucial for system-in-package (SiP) architectures. The surging use of these inductors in increasingly power-hungry yet size-constrained applications such as 5G modems and ultra-slim laptops underscores their expanding importance across multiple electronics markets.

Could the Surge in IoT and 5G Devices Transform the Demand Landscape for Thin-Film Inductors?
The global rollout of 5G networks and the exponential increase in IoT-connected devices are transforming the requirements for passive components. Thin-film power inductors are emerging as essential components in RF front-end modules, where they contribute to noise suppression, signal conditioning, and power regulation. As IoT devices multiply and diversify—from smart homes to industrial monitoring systems—the demand for efficient, compact, and high-frequency passive components is soaring. Thin-film inductors meet these demands by offering high-Q performance, stability over a wide temperature range, and resistance to electromagnetic interference (EMI). Additionally, the increasing complexity of wireless modules, including multi-band and dual-antenna systems, is necessitating greater filtering precision—an area where thin-film inductors excel. In wearable electronics and medical implants, where space and power constraints are even more stringent, these inductors provide essential performance enhancements without compromising the size or weight of the device. Their robustness in harsh environments also makes them attractive for automotive telematics and advanced driver-assistance systems (ADAS), further broadening their applicability across next-generation connected technologies.

What Technological Innovations Are Shaping the Next Generation of Thin-Film Power Inductors?
Innovations in thin-film deposition techniques and magnetic material science are significantly enhancing the performance characteristics of thin-film power inductors. Manufacturers are leveraging atomic layer deposition (ALD), sputtering, and electroplating to create precise, high-purity metallic and dielectric layers that improve current handling, frequency range, and thermal stability. Magnetic materials like nanocrystalline alloys and amorphous films are being integrated to push saturation flux density and minimize core losses, enabling more efficient energy conversion even in compact designs. Furthermore, advancements in 3D thin-film patterning are allowing for intricate coil geometries that optimize inductance values while minimizing footprint. These innovations are complemented by improvements in packaging technologies, including chip-scale and wafer-level packaging, which further reduce parasitic effects and improve performance in high-density environments. Collaboration between inductor manufacturers and semiconductor foundries is also increasing, aiming to produce co-packaged solutions tailored for high-performance computing, mobile SoCs, and edge AI processors. This convergence of materials, processes, and integration is shaping a new class of power inductors suited for future-proof, compact, and high-efficiency electronics.

The Growth in the Thin-Film Power Inductors Market Is Driven by Several Factors…
The global market for thin-film power inductors is being propelled by specific shifts in technology trends, end-use device architectures, and consumer expectations. First, the miniaturization of electronic devices—spanning smartphones, wearables, and medical implants—demands highly compact, efficient, and thermally stable inductive components. Second, the integration of high-speed processing cores and multi-band RF functionalities in mobile and IoT devices requires passive components with excellent high-frequency characteristics and low electromagnetic interference, making thin-film inductors a natural fit. Third, the proliferation of 5G-enabled modules and multi-antenna configurations is raising demand for high-performance passive filters and power regulators embedded within increasingly tight form factors. Additionally, the automotive industry`s pivot to electric vehicles (EVs), autonomous systems, and advanced infotainment units is creating new opportunities for thin-film inductors that can operate reliably in high-temperature and vibration-prone environments. In industrial automation and robotics, compact power modules powered by DC-DC converters are turning to thin-film inductors for their space-saving advantages. Finally, continuous progress in semiconductor fabrication—particularly in fan-out wafer-level packaging and system-on-chip (SoC) integration—is further embedding these components into next-gen electronic designs, making them indispensable to the evolving global electronics supply chain.

SCOPE OF STUDY:

The report analyzes the Thin-Film Power Inductors market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Type (Surface Mount Technology, Through Hole Technology); Application (Consumer Electronics, Automotive, Industrial, Healthcare, Other Applications)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 42 Featured) -

• Bourns, Inc.
• Chilisin Electronics Corp.
• Coilcraft, Inc.
• Coilmaster Electronics Co., Ltd.
• Cyntec Co., Ltd.
• EPCOS AG (TDK Group)
• Johanson Technology Inc.
• KEMET Corporation
• KOA Corporation
• KYOCERA AVX Components Corporation
• Laird Performance Materials
• Murata Manufacturing Co., Ltd.
• Panasonic Corporation
• Pulse Electronics Corporation
• Samsung Electro-Mechanics
• Sumida Corporation
• TAIYO YUDEN Co., Ltd.
• TDK Corporation
• Vishay Intertechnology, Inc.
• Würth Elektronik GmbH & Co. KG

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