Printed Circuit Boards (PCBs)

Printed Circuit Boards (PCBs)

Global Printed Circuit Boards (PCBs) Market to Reach $76 Billion by 2027
In the changed post COVID-19 business landscape, the global market for Printed Circuit Boards (PCBs) estimated at US$54.8 Billion in the year 2020, is projected to reach a revised size of US$76 Billion by 2027, growing at a CAGR of 4.8% over the analysis period 2020-2027. Multi-Layer, one of the segments analyzed in the report, is projected to record a 5.2% CAGR and reach US$49.9 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Double-Sided segment is readjusted to a revised 3.9% CAGR for the next 7-year period.

The U.S. Market is Estimated at $6.2 Billion, While China is Forecast to Grow at 5.7% CAGR
The Printed Circuit Boards (PCBs) market in the U.S. is estimated at US$6.2 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$19.6 Billion by the year 2027 trailing a CAGR of 5.7% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 3.6% and 4.4% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 3.9% CAGR.Single-Sided Segment to Record 4.5% CAGR
In the global Single-Sided segment, USA, Canada, Japan, China and Europe will drive the 4.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$4.9 Billion in the year 2020 will reach a projected size of US$6.6 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets.

Select Competitors (Total 225 Featured) -

  • Jabil Inc.
  • Plexus Corp.
  • TTM Technologies, Inc.
  • Benchmark Electronics
  • Advanced Circuits
  • Murrietta Circuits
  • SigmaTron International, Inc.
  • AP Circuits
  • Compeq Manufacturing Co. Ltd.
  • Ibiden Co. Ltd.
  • Unimicron Technology Corp.
  • Tripod Technology Corp.
  • Zhen Ding Technology Holding Ltd.
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I. METHODOLOGY
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
Influencer Market Insights
World Market Trajectories
What are PCBs, Where are they Used & Why are they the Backbone of Electronics?
PCBs Are a Key Part of the Electronics Value Chain. COVID-19 Exposes the Risk of Value Chain Modularity
COVID-19 Emerges as a Black Swan Event for the Electronics Industry
Among the Hammered Companies in the Supply Chain is the “Semiconductor Industry”
Measuring the Impact of COVID-19 On the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020
Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020
Falling Consumer Confidence Impacts Retail Sales of Consumer & Automotive Electronics
Rapidly Eroding Consumer Confidence Thwarts Hopes for a Quick Recovery: Global Consumer Confidence Index Points for 4Q2019, 1Q2020 & 2Q2020
Shrinking Disposable Incomes Take its Toll on Consumer Demand for Electronics: Global 1Q Sell-In Shipments of Electronic Products Estimated in Jan-2020 Vs March 2020 (In Million Units)
Deteriorating Business Confidence & Virus Led Economic Recession Impacts Prospects for Industrial Electronics
Virus Led Recession Frustrates Recovery of Upstream & Downstream Markets in the Electronics Industry: Global GDP Growth (In %) for the Years 2019, 2020 & 2021
Manufacturing Industry Bites the Dust Severing All Planned Digital & Electronic Plant Upgrade Investments: Global Manufacturing PMI Index Score January 2020 to May 2020
It’s a Bumpy Road to Recovery as Loosening Up of Restrictions Triggers a Second Wave of Infections
Rising Global Infections Dampen Sentiment & Keep Businesses on Tenterhooks: Global Number of COVID-19 Infections Per Day in the Month of June 2020
Despite Moves to Reopen the Economy, Battered Business Confidence Plummets to New Depths: Business Confidence Index (BCI) Points
Printed Circuit Boards (PCBs) – Global Key Competitors Percentage Market Share in 2022 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
Recent Market Activity
World Brands
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Digital Transformation Catalyzed by the Pandemic Provides the Perfect Platform for Growth in the Post COVID-19 Period.
The Scenario Bodes Well for All Things Electronic & Digital. Special Focus on PCBs for Electronic Wearables
It’s Not CIOs or CFOs, its COVID-19 Leading Digital Transformation Globally: Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
Post COVID-19 As Technology Steps Forward to Help With Social Distancing, Renewed Focus Will Be Shed on Industrial Automation
As a Lesson Learnt in Social Distancing from the COVID-19 Pandemic, Use of Industrial Robots to Spike in the Post COVID-19 Period: Industrial Robot Density (Units Per 10,000 Workers) for the Years 2019 & 2023
As Telemedicine Storms into the Spotlight in the Post COVID-19 Period, Medical Wearables to Offer Opportunities for Rigid-flex PCBs
COVID-19 Pandemic Catalyzes Migration to New Models of Remote Care Delivery & Boosts Importance of Electronics Subsystems Supporting Smart Wearables: Global Number of Telemedicine Patients (In Million) for the Years 2016, 2018, 2020, 2023 & 2025
A Return to Economic Normalcy Will Reignite Growth Drivers in the Consumer Electronics End-Use Sector
Smart Homes Emerge as a Disruptive Trend Enhancing Lives of Homeowners & Also Creating New Market Opportunities Players in the Electronics Value Chain: Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022
The Coming Era of Electronification of Medical Devices to Bring Attractive Opportunities for Medical PCBs
A 47.1% Increase in Growth in the Post COVID-19 Period for the Medical Devices Industry Encourages an Optimistic Outlook for Medical PCBs: Global Medical Devices Industry (In US$ Billion) for the Years 2000, 2023 & 2025
PCBs are the Core of IoT Devices. Disruptions Caused by the Pandemic & the Push for Connected Tech to Benefit Market Growth
A Review of the IoT Opportunity for Flex and HDI PCBs
IoT to Take a Quantum Leap With the Pandemic Highlighting the Importance of Remote Operations in Ensuring Business Resiliency: Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
Coronavirus Outbreak Makes Driverless Cars Attractive. Autonomous Cars Hold Robust Potential for Growth of PCBs in the Post COVID Period
Non-Contact Deliveries Made Popular by the Pandemic Will Ready the PCB Market for the Coming Age of Drones
What Does this Mean for PCB Designers and Manufacturers?
In the “Touch-Me-Not” Environment to Follow in the Post Pandemic Period, Use of Drones Will Rise to New Highs: Number of Countries Worldwide Using Drones/UAVs by Type 2019 & 2025
As Post Pandemic Economic Rebuilding Efforts Get Underway, Focus on Pandemic Ready Smart Cities Will Create a Hotbed of Opportunities for PCBs
Focus on Reshaping City Resilience to Future Pandemics & Crisis Will Spur Rejuvenated Spending on Smart City Projects in the Post COVID-19 Period, Providing a Goldmine of Opportunities for Electronic Technologies: Global Smart City Spending (In US$ Billion) for the Years 2021, 2023 & 2025
It’s a Slower & Longer Road to Recovery for PCBs Used in Defense & Avionics
With the Aviation Industry on the Brink of Annihilation, Pre-Pandemic Digitalization Plans Will Take a Long Time to Witness a Return to Implementation: Expected Revenue Losses in Global Aviation (In US$ Billion)
Massive Employment Losses in Tourism Highlights How Far the Aviation Industry is from Making a Meaningful Recovery: Employment Losses in Tourism (In Million) by End of 2020
Integration of Artificial Intelligence Into PCB Design & Production Comes of Age
4. GLOBAL MARKET PERSPECTIVE
TABLE 1: World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 2: World Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 3: World 15-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2021 & 2027
TABLE 4: World Recent Past, Current & Future Analysis for Multi-Layer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 5: World Historic Review for Multi-Layer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 6: World 15-Year Perspective for Multi-Layer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 7: World Recent Past, Current & Future Analysis for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 8: World Historic Review for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 9: World 15-Year Perspective for Double-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 10: World Recent Past, Current & Future Analysis for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 11: World Historic Review for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 12: World 15-Year Perspective for Single-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 13: World Recent Past, Current & Future Analysis for Standard Multilayer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 14: World Historic Review for Standard Multilayer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 15: World 15-Year Perspective for Standard Multilayer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 16: World Recent Past, Current & Future Analysis for High-Density Interconnect (HDI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 17: World Historic Review for High-Density Interconnect (HDI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 18: World 15-Year Perspective for High-Density Interconnect (HDI) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 19: World Recent Past, Current & Future Analysis for IC Substrate by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 20: World Historic Review for IC Substrate by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 21: World 15-Year Perspective for IC Substrate by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 22: World Recent Past, Current & Future Analysis for Rigid 1-2 Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 23: World Historic Review for Rigid 1-2 Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 24: World 15-Year Perspective for Rigid 1-2 Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 25: World Recent Past, Current & Future Analysis for Rigid-Flex by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 26: World Historic Review for Rigid-Flex by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 27: World 15-Year Perspective for Rigid-Flex by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 28: World Recent Past, Current & Future Analysis for Other Substrate Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 29: World Historic Review for Other Substrate Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 30: World 15-Year Perspective for Other Substrate Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 31: World Recent Past, Current & Future Analysis for Computer & Peripherals by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 32: World Historic Review for Computer & Peripherals by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 33: World 15-Year Perspective for Computer & Peripherals by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 34: World Recent Past, Current & Future Analysis for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 35: World Historic Review for Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 36: World 15-Year Perspective for Communications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 37: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 38: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 39: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 40: World Recent Past, Current & Future Analysis for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 41: World Historic Review for Industrial Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 42: World 15-Year Perspective for Industrial Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 43: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 44: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 45: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 46: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 47: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 48: World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
TABLE 49: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 50: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 51: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
III. MARKET ANALYSIS
UNITED STATES
Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2022 (E)
Semiconductor Industry in the U.S.
TABLE 52: USA Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 53: USA Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 54: USA 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 55: USA Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 56: USA Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 57: USA 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 58: USA Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 59: USA Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 60: USA 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
CANADA
TABLE 61: Canada Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 62: Canada Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 63: Canada 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 64: Canada Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 65: Canada Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 66: Canada 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 67: Canada Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 68: Canada Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 69: Canada 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
JAPAN
Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2022 (E)
Semiconductor Industry in Japan
TABLE 70: Japan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 71: Japan Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 72: Japan 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 73: Japan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 74: Japan Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 75: Japan 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 76: Japan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 77: Japan Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 78: Japan 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
CHINA
Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2022 (E)
TABLE 79: China Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 80: China Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 81: China 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 82: China Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 83: China Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 84: China 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 85: China Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 86: China Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 87: China 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
EUROPE
Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2022 (E)
TABLE 88: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 89: Europe Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 90: Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2021 & 2027
TABLE 91: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 92: Europe Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 93: Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 94: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 95: Europe Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 96: Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 97: Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 98: Europe Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 99: Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
FRANCE
Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2022 (E)
TABLE 100: France Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 101: France Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 102: France 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 103: France Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 104: France Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 105: France 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 106: France Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 107: France Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 108: France 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
GERMANY
Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2022 (E)
TABLE 109: Germany Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 110: Germany Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 111: Germany 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 112: Germany Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 113: Germany Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 114: Germany 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 115: Germany Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 116: Germany Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 117: Germany 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
ITALY
TABLE 118: Italy Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 119: Italy Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 120: Italy 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 121: Italy Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 122: Italy Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 123: Italy 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 124: Italy Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 125: Italy Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 126: Italy 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
UNITED KINGDOM
Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2022 (E)
TABLE 127: UK Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 128: UK Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 129: UK 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 130: UK Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 131: UK Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 132: UK 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 133: UK Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 134: UK Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 135: UK 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF EUROPE
TABLE 136: Rest of Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 137: Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 138: Rest of Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 139: Rest of Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 140: Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 141: Rest of Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 142: Rest of Europe Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 143: Rest of Europe Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 144: Rest of Europe 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
ASIA-PACIFIC
Printed Circuit Boards (PCBs) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2022 (E)
TABLE 145: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 146: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 147: Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Geographic Region - Percentage Breakdown of Value Sales for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2012, 2021 & 2027
TABLE 148: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 149: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 150: Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 151: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 152: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 153: Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 154: Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 155: Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 156: Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
SOUTH KOREA
TABLE 157: South Korea Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 158: South Korea Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 159: South Korea 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 160: South Korea Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 161: South Korea Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 162: South Korea 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 163: South Korea Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 164: South Korea Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 165: South Korea 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
TAIWAN
Taiwan, a Semiconductor Behemoth
TABLE 166: Taiwan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 167: Taiwan Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 168: Taiwan 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 169: Taiwan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 170: Taiwan Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 171: Taiwan 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 172: Taiwan Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 173: Taiwan Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 174: Taiwan 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF ASIA-PACIFIC
TABLE 175: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 176: Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 177: Rest of Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 178: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 179: Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 180: Rest of Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 181: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 182: Rest of Asia-Pacific Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 183: Rest of Asia-Pacific 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF WORLD
TABLE 184: Rest of World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 185: Rest of World Historic Review for Printed Circuit Boards (PCBs) by Type - Multi-Layer, Double-Sided and Single-Sided Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 186: Rest of World 15-Year Perspective for Printed Circuit Boards (PCBs) by Type - Percentage Breakdown of Value Sales for Multi-Layer, Double-Sided and Single-Sided for the Years 2012, 2021 & 2027
TABLE 187: Rest of World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 188: Rest of World Historic Review for Printed Circuit Boards (PCBs) by Substrate Type - Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 189: Rest of World 15-Year Perspective for Printed Circuit Boards (PCBs) by Substrate Type - Percentage Breakdown of Value Sales for Standard Multilayer, High-Density Interconnect (HDI), IC Substrate, Rigid 1-2 Sided, Rigid-Flex and Other Substrate Types for the Years 2012, 2021 & 2027
TABLE 190: Rest of World Recent Past, Current & Future Analysis for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 191: Rest of World Historic Review for Printed Circuit Boards (PCBs) by End-Use - Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
TABLE 192: Rest of World 15-Year Perspective for Printed Circuit Boards (PCBs) by End-Use - Percentage Breakdown of Value Sales for Computer & Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
IV. COMPETITION
Total Companies Profiled: 225

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