PCBs in Computers and Peripherals

Global PCBs in Computers and Peripherals Market to Reach US$26.8 Billion by 2030

The global market for PCBs in Computers and Peripherals estimated at US$21.1 Billion in the year 2024, is expected to reach US$26.8 Billion by 2030, growing at a CAGR of 4.1% over the analysis period 2024-2030. Wireless, one of the segments analyzed in the report, is expected to record a 3.4% CAGR and reach US$17.3 Billion by the end of the analysis period. Growth in the Wired segment is estimated at 5.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$5.7 Billion While China is Forecast to Grow at 7.4% CAGR

The PCBs in Computers and Peripherals market in the U.S. is estimated at US$5.7 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$5.4 Billion by the year 2030 trailing a CAGR of 7.4% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 1.7% and 3.2% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 2.4% CAGR.

Global PCBs in Computers and Peripherals Market – Key Trends & Drivers Summarized

How Are Increasing Processing Demands and Miniaturization Trends Reshaping PCB Requirements in Computing Devices?

Printed circuit boards (PCBs) are the central nervous system of modern computers and peripheral devices, providing electrical connectivity and mechanical support for integrated circuits, processors, and interface modules. As desktop PCs, laptops, servers, and peripherals such as printers, external drives, and gaming accessories grow more compact and powerful, there is increasing demand for high-density PCB architectures that offer superior thermal dissipation, signal integrity, and space optimization. With modern computing devices relying on multi-core processors, GPUs, and high-speed memory, the complexity of PCB design is reaching new heights.

The adoption of microvia technology, surface-mount components, and multilayer stack-ups with advanced interconnects is enabling manufacturers to meet form factor constraints without compromising performance. High-layer-count rigid PCBs dominate in high-end motherboards, while rigid-flex PCBs are gaining popularity in thin-and-light devices like ultrabooks, tablets, and detachable keyboards. This convergence of miniaturization and multifunctionality is driving the need for precise design rules, advanced laminates, and superior fabrication processes.

Why Are Thermal Management, EMI Shielding, and Signal Integrity Becoming Central to PCB Design in Computing?

The need for enhanced thermal performance is a critical driver in PCB design for computing equipment. As processing power increases, so does heat generation, especially in compact systems where air flow is limited. Designers are integrating thermal vias, copper pours, and heat sinks directly into PCBs to improve thermal conductivity and prevent hotspots. In data-intensive applications such as gaming, CAD, or AI modeling, thermal management features are no longer optional—they are mission-critical.

Simultaneously, maintaining signal integrity in high-speed data transmission is vital for peripheral devices such as USB-C hubs, graphic cards, external GPUs, and SSD enclosures. Electromagnetic interference (EMI) shielding through copper planes, differential pair routing, and controlled impedance PCB traces ensures clean signal propagation across dense interconnect paths. This is especially important in modern interfaces such as PCIe Gen4/Gen5, Thunderbolt, HDMI 2.1, and DDR5 memory buses, all of which require precision-engineered board layouts.

How Are AI PCs, Edge Computing, and Peripherals Innovation Expanding PCB Application Scenarios?

The emergence of AI-integrated computing systems, edge servers, and compact multi-function peripherals is fueling demand for versatile PCB configurations. AI-enabled PCs, neural processing units (NPUs), and ARM-based computing platforms require custom boards that combine logic, power management, and machine learning accelerators in confined form factors. This is driving demand for advanced PCBs capable of integrating heterogeneous computing modules while supporting high-speed data transfers and low-latency performance.

In peripherals, PCB innovation supports compact designs, wireless functionality, and sensor integration in devices like biometric scanners, wireless keyboards, VR accessories, and digital pens. The growing use of PCBs with embedded antennas, Bluetooth/Wi-Fi chips, and flexible interconnects enables seamless communication and ergonomic design. These enhancements reflect consumer demand for peripheral devices that are not only responsive and durable but also smart and connected.

What’s Fueling the Growth of PCBs in Computers and Peripherals Market Globally?

The growth in the PCBs in computers and peripherals market is driven by several factors including surging demand for high-performance computing systems, widespread digital transformation across enterprises, and consumer appetite for compact, multifunctional devices. A key growth driver is the proliferation of AI-driven applications, gaming, hybrid work models, and cloud computing—all of which depend on increasingly powerful yet space-efficient PCBs.

Additionally, the ongoing expansion of remote learning, content creation, and e-commerce is sustaining demand for notebooks, tablets, and productivity peripherals. OEMs and ODMs are ramping up investment in next-generation board technologies that support faster, cooler, and more energy-efficient devices. As computing continues to evolve toward intelligence, portability, and interconnectivity, PCB technologies will remain critical to enabling smarter, faster, and more reliable computer systems worldwide.

SCOPE OF STUDY:

The report analyzes the PCBs in Computers and Peripherals market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Connectivity (Wireless, Wired); End-Use (Residential, Commercial)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 43 Featured) -

• Advanced Circuits
• AT&S
• BMK Group
• Cirexx International
• Compeq Manufacturing Co., Ltd.
• Elec & Eltek International Co., Ltd.
• Ellington Electronics Technology Group
• EMSG Inc.
• Excello Circuits
• HiTech Circuits Co., Ltd.
• JHYPCB
• Lanner Electronics Inc.
• Murrietta Circuits
• Onanon Inc.
• Park Aerospace Corp
• PCBCart
• Sanmina Corporation
• Sierra Circuits
• TTM Technologies, Inc.
• Unimicron Technology Corporation

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