Liquid Photoresists

Global Liquid Photoresists Market to Reach US$2.8 Billion by 2030

The global market for Liquid Photoresists estimated at US$2.2 Billion in the year 2024, is expected to reach US$2.8 Billion by 2030, growing at a CAGR of 4.1% over the analysis period 2024-2030. Positive Photoresist, one of the segments analyzed in the report, is expected to record a 4.7% CAGR and reach US$2.0 Billion by the end of the analysis period. Growth in the Negative Photoresist segment is estimated at 2.6% CAGR over the analysis period.

The U.S. Market is Estimated at US$588.4 Million While China is Forecast to Grow at 7.7% CAGR

The Liquid Photoresists market in the U.S. is estimated at US$588.4 Million in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$566.0 Million by the year 2030 trailing a CAGR of 7.7% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 1.6% and 3.3% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 2.4% CAGR.

Global Liquid Photoresists Market – Key Trends & Drivers Summarized

Why Are Liquid Photoresists Indispensable in Semiconductor and PCB Fabrication?

Liquid photoresists are light-sensitive materials used to transfer patterns onto semiconductor wafers and printed circuit boards (PCBs) during photolithography processes. They are fundamental to microfabrication, enabling precise definition of integrated circuit (IC) structures, MEMS components, and fine-line patterns in advanced electronics. Comprising polymer binders, sensitizers, and solvents, these resists undergo chemical changes upon exposure to light, allowing selective removal during development and etching steps. Their adaptability to ultra-fine patterning and thin film deposition makes them essential for leading-edge nodes in logic, memory, and packaging technologies.

In semiconductor manufacturing, liquid photoresists are used in multiple layers of device construction, each demanding precise control over resolution, adhesion, and etch resistance. With device miniaturization reaching sub-10nm scales, photoresists must now support extreme ultraviolet (EUV) lithography and other next-gen patterning technologies. Meanwhile, the rise of advanced packaging techniques such as 2.5D/3D ICs and fan-out wafer-level packaging (FOWLP) is increasing demand for thick-film and high-aspect-ratio liquid photoresists capable of maintaining fidelity under challenging process conditions.

How Are Formulation Innovations Driving Resolution and Compatibility Improvements?

Recent developments in photoresist chemistry are addressing the critical need for higher resolution, lower line edge roughness (LER), and improved process control. Chemically amplified resists (CARs), which use a catalytic acid generated during exposure to drive further reactions, are enabling higher sensitivity and faster throughput. Additive engineering—including anti-reflective coatings, adhesion promoters, and post-application baking techniques—is being refined to reduce defects and enhance cross-sectional integrity during etching and stripping stages.

New resist formulations compatible with EUV and DUV (deep ultraviolet) sources are being commercialized to support advanced lithographic patterning, especially in DRAM, NAND, and logic chip production. In packaging and PCB applications, thick-film and negative-tone photoresists are gaining traction for bumping, redistribution layers (RDLs), and substrate fabrication. Environmentally friendly solvents and low-outgassing resists are also being developed to meet sustainability goals in cleanroom operations. These innovations are expanding the capabilities of photoresists across both front-end and back-end semiconductor processes.

What Trends Are Influencing Demand Across Semiconductor and Display Manufacturing?

The demand for high-performance liquid photoresists is being fueled by aggressive scaling roadmaps in semiconductor manufacturing. Foundries and IDMs are increasing investments in EUV lithography, where resist performance is a key determinant of pattern resolution and yield. The move toward heterogeneous integration and advanced IC packaging is further pushing the need for photoresists with tailored viscosity, film thickness, and thermal characteristics to support multi-layer stacking and fine-pitch redistribution.

In the display industry, particularly in OLED and high-resolution LCD fabrication, photoresists are used for TFT patterning, color filter formation, and microlens fabrication. As displays evolve toward higher pixel densities and flexible substrates, photoresist materials must meet requirements for transparency, adhesion, and chemical stability. Additionally, the expansion of 5G, automotive electronics, and AI chip development is accelerating lithographic demand in compound semiconductors and power electronics, further diversifying the scope of photoresist applications.

What Is Driving Growth in the Liquid Photoresists Market Globally?

The growth in the liquid photoresists market is driven by ongoing advancements in semiconductor manufacturing, the proliferation of advanced packaging technologies, and the expanding demand for precision patterning in electronics. A major growth driver is the adoption of EUV and other advanced lithographic tools by leading chipmakers, requiring highly specialized resist materials with superior resolution and stability. The acceleration of 3D NAND, system-in-package (SiP), and wafer-level packaging technologies is also increasing usage of thick-film photoresists and dielectric-compatible formulations.

Technological convergence in displays, sensors, and compound semiconductors is expanding the market across adjacent industries, including optoelectronics, MEMS, and flexible electronics. Supply chain developments, including localization of resist manufacturing in Asia-Pacific and strategic partnerships between material suppliers and equipment vendors, are further supporting market scalability. As chip density, interconnect complexity, and device diversity continue to rise, the demand for high-performance liquid photoresists is expected to experience sustained growth across the global electronics value chain.

SCOPE OF STUDY:

The report analyzes the Liquid Photoresists market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Type (Positive Photoresist, Negative Photoresist); Application (Semiconductors & ICs, LCDs, Printed Circuit Boards, Other Applications)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 34 Featured) -

• Asahi Kasei Corporation
• BASF SE
• Chimei Corporation
• Daxin Materials Corporation
• Dongjin Semichem Co., Ltd.
• DuPont de Nemours, Inc.
• Everlight Chemical Industrial Corp.
• Fujifilm Electronic Materials
• Great Eastern Resins Industrial Co.
• Hitachi Chemical Co., Ltd.
• JSR Corporation
• KISCO Ltd.
• LG Chem Ltd.
• Merck KGaA
• Mitsui Chemicals, Inc.
• Nagase & Co., Ltd.
• Shin-Etsu Chemical Co., Ltd.
• Sumitomo Chemical Co., Ltd.
• Tokyo Ohka Kogyo Co., Ltd.
• Toray Industries, Inc.

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