Dry Etching Equipment

Global Dry Etching Equipment Market to Reach US$15.6 Billion by 2030

The global market for Dry Etching Equipment estimated at US$11.1 Billion in the year 2024, is expected to reach US$15.6 Billion by 2030, growing at a CAGR of 5.8% over the analysis period 2024-2030. Inductively Coupled Plasma, one of the segments analyzed in the report, is expected to record a 5.4% CAGR and reach US$6.0 Billion by the end of the analysis period. Growth in the Capacitive Coupled Plasma segment is estimated at 7.1% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.9 Billion While China is Forecast to Grow at 5.7% CAGR

The Dry Etching Equipment market in the U.S. is estimated at US$2.9 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$2.5 Billion by the year 2030 trailing a CAGR of 5.7% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.4% and 5.0% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 4.7% CAGR.

Global Dry Etching Equipment Market – Key Trends & Drivers Summarized

Why Is Dry Etching Equipment Pivotal in Advanced Semiconductor Manufacturing?

Dry etching equipment plays a critical role in semiconductor fabrication, enabling the precise removal of material layers from silicon wafers using plasma or reactive gases, rather than the wet chemicals used in traditional etching processes. As chip architectures grow increasingly complex and miniaturized—pushing toward nodes below 5nm—dry etching becomes essential for achieving the high-resolution patterning, anisotropic profiles, and atomic-level accuracy required for advanced device performance. This equipment is indispensable for processes such as gate etching, contact hole formation, and hard mask patterning in the production of DRAM, NAND flash, and logic chips. Unlike wet etching, which lacks directional control, dry etching enables highly controlled, vertical etch profiles crucial for fabricating multi-layered, three-dimensional structures like FinFETs and 3D NAND. With the growing adoption of EUV lithography and the move toward heterogeneous integration, demand for dry etching systems is surging across foundries and integrated device manufacturers (IDMs). Furthermore, as electronics power everything from smartphones and servers to electric vehicles and quantum computers, dry etching equipment forms the technological backbone of progress in computing power, data storage, and energy efficiency. Without it, the semiconductor industry would be unable to meet the geometric scaling and performance requirements of next-generation electronics.

How Are Technological Innovations Enhancing the Capabilities of Dry Etching Equipment?

Technological advancements are transforming dry etching equipment into highly sophisticated tools capable of atomic-scale precision and integration with automated fabrication workflows. Plasma-enhanced etching systems, which use reactive ion etching (RIE) or inductively coupled plasma (ICP), are now being developed with high-density plasma sources, advanced gas distribution systems, and multiple bias controls to allow finer tuning of etch rates, selectivity, and uniformity across large wafer sizes. Atomic Layer Etching (ALE), a next-generation dry etching technique, is gaining momentum for enabling ultra-thin material removal one atomic layer at a time, which is essential for patterning high-aspect-ratio features and minimizing surface damage. In addition, artificial intelligence and machine learning are being integrated into etching systems to provide real-time process monitoring, predictive maintenance, and autonomous parameter adjustments. Equipment manufacturers are also enhancing vacuum chamber design, temperature control, and residue management to improve yield and tool uptime. The introduction of hybrid etch-deposition systems allows simultaneous etching and passivation, enhancing profile control and reducing process steps. These innovations are not only pushing the boundaries of semiconductor scalability but also improving process reliability, throughput, and total cost of ownership—making advanced dry etching equipment an enabler of both technical progress and manufacturing efficiency in the semiconductor sector.

Why Do Application-Specific Demands and Regional Trends Shape Dry Etching Equipment Usage?

The usage and specification of dry etching equipment vary significantly by application type—such as logic chips, memory devices, image sensors, and power semiconductors—as well as by regional industry dynamics. Logic devices at advanced nodes require highly selective, damage-free etching to preserve nanoscale features and maintain transistor performance, while memory devices like NAND and DRAM demand deep, high-aspect-ratio etching for dense vertical structures. Compound semiconductors such as GaN and SiC, used in RF and power devices, present unique material challenges requiring specialized etching chemistries and hardware configurations. Geographically, Asia-Pacific leads the global dry etching equipment market, with Taiwan, South Korea, China, and Japan hosting the world’s largest semiconductor fabs and contributing the majority of capital equipment spending. In particular, Taiwan’s TSMC and South Korea’s Samsung are heavily investing in advanced etch tools to support their aggressive scaling roadmaps. In North America, companies like Intel and GlobalFoundries are expanding capacity in response to supply chain security initiatives and chip act legislation, which is boosting domestic equipment demand. Europe focuses on automotive-grade semiconductors and specialty applications, contributing to demand for etching tools tailored to power electronics and MEMS. These regional variations, combined with the diversity of chip technologies, make flexibility, customization, and localized service support essential factors for success in the dry etching equipment industry.

What Are the Key Drivers Fueling Growth in the Global Dry Etching Equipment Market?

The growth in the dry etching equipment market is being propelled by a convergence of semiconductor innovation, expanding device complexity, and escalating global demand for electronics across industries. One of the most significant growth drivers is the continual push for smaller, faster, and more energy-efficient chips, which require ever more precise pattern transfer technologies achievable only through advanced dry etching. The rise of 5G networks, AI computing, cloud data centers, autonomous vehicles, and the Internet of Things (IoT) is accelerating the need for high-performance semiconductors, thereby increasing investment in front-end fabrication equipment. Additionally, the shift from planar to 3D architectures—like FinFETs and Gate-All-Around (GAA) transistors—has elevated the complexity of etch steps, leading to higher demand for multi-function etching platforms. Government-backed initiatives such as the U.S. CHIPS Act and Europe’s IPCEI (Important Projects of Common European Interest) are also driving semiconductor sovereignty and spurring domestic investments in fabs and tooling. Moreover, global supply chain disruptions have prompted chipmakers to diversify production and invest in more geographically distributed capacity, expanding the customer base for etching equipment providers. Environmental considerations are influencing equipment design as well, with energy efficiency and process gas recycling becoming important differentiators. With strong capital expenditure cycles and technological momentum, the dry etching equipment market is set to grow in tandem with the semiconductor industry’s march toward next-generation computing and connectivity.

SCOPE OF STUDY:

The report analyzes the Dry Etching Equipment market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Type (Inductively Coupled Plasma, Capacitive Coupled Plasma, Reactive Ion Etching, Deep Reactive Ion Etching, Other Types); Application (Logic & Memory, MEMS, Power Device, Other Applications)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 32 Featured) -

• Advanced Micro-Fabrication Equipment Inc.
• Applied Materials, Inc.
• DISCO Corporation
• EV Group (EVG)
• GigaLane Co., Ltd.
• Hitachi High-Technologies Corporation
• Lam Research Corporation
• Mattson Technology, Inc.
• Meyer Burger Technology AG
• NAURA Technology Group Co., Ltd.
• Oxford Instruments plc
• Panasonic Corporation
• Plasma-Therm LLC
• Samco Inc.
• SPTS Technologies Ltd.
• SÜSS MicroTec SE
• Suzhou Delphi Laser Co., Ltd.
• Tokyo Electron Limited
• ULVAC Technologies, Inc.
• Veeco Instruments Inc.

AI INTEGRATIONS
We`re transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR
Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

Please note: Reports are sold as single-site single-user licenses. Electronic versions require 24-48 hours as each copy is customized to the client with digital controls and custom watermarks. The Publisher uses digital controls protecting against copying and printing is restricted to one full copy to be used at the same location.

The latest version of Adobe Acrobat Reader is required to view the report. Upon ordering an electronic version, the Publisher will provide a link to download the purchased report.

Prior to fulfillment of an order, the client will be required to sign a document detailing the purchase terms for a publication from this publisher.