The Global Market for Thermal Interface Materials 2023-2033

The Global Market for Thermal Interface Materials 2023-2033

The effective transfer/removal of heat from a semiconductor device is crucial to ensure reliable operation and to enhance the lifetime of these components. The development of high-power and high-frequency electronic devices has greatly increased issues with excessive heat accumulation. There is therefore a significant requirement for effective thermal management materials to remove excess heat from electronic devices to ambient environment.

Thermal interface materials (TIMs) offer efficient heat dissipation to maintain proper functions and lifetime for these devices. TIMs are materials that are applied between the interfaces of two components (typically a heat generating device such as microprocessors, photonic integrated circuits, etc. and a heat dissipating device e.g. heat sink) to enhance the thermal coupling between these devices. A range of Carbon-based, metal/solder and filler-based TIMs are available both commercially and in the research and development (R&D) phase.

Report contents include:
Analysis of recent commercial and R&D developments in thermal interface materials (TIMs).
Market trends and drivers.
Market map.
Analysis of thermal interface materials (TIMs) including:
Thermal Pads/Insulators.
Thermally Conductive Adhesives.
Thermal Compounds or Greases.
Thermally Conductive Epoxy/Adhesives.
Phase Change Materials.
Metal-based TIMs.
Carbon-based TIMs.
Market analysis. Markets covered include:
Consumer electronics.
Electric Vehicles (EV) batteries.
Data Center infrastructure.
ADAS sensors.
EMI shielding.

Global market revenues for thermal interface materials (TIMs), historical and forecast to 2033.

Profiles of 87 producers. Companies profiled include Arieca, Carbice Corporation, CondAlign, Fujipoly, Henkel, Indium Corporation, KULR Technology Group, Inc., Parker-Hannifin Corporation, Shin-Etsu Chemical Co., Ltd, and SHT Smart High-Tech AB.

    • Thermal management-active and passive
    • What are thermal interface materials (TIMs)?
      • Types
      • Thermal conductivity
        • Table Thermal conductivities ( ) of common metallic, carbon, and ceramic fillers employed in TIMs.
    • Comparative properties of TIMs
      • Table Commercial TIMs and their properties.
    • Advantages and disadvantages of TIMs, by type
      • Table Advantages and disadvantages of TIMs, by type.
    • Prices
      • Table Thermal interface materials prices.
    • Table Characteristics of some typical TIMs.
    • Thermal greases and pastes
    • Thermal gap pads
    • Thermal gap fillers
    • Thermal adhesives and potting compounds
    • Phase Change Materials
      • Properties of Phase Change Materials (PCMs)
        • Table Properties of PCMs.
      • Types
        • Table PCM Types and properties.
        • Table Advantages and disadvantages of organic PCMs.
        • Table Advantages and disadvantages of organic PCM Fatty Acids.
        • Table Advantages and disadvantages of salt hydrates
        • Table Advantages and disadvantages of low melting point metals.
        • Table Advantages and disadvantages of eutectics.
      • Thermal energy storage (TES)
      • Application in TIMs
        • Table Benefits and drawbacks of PCMs in TIMs.
    • Metal-based TIMs
      • Solders and low melting temperature alloy TIMs
      • Liquid metals
      • Solid liquid hybrid (SLH) metals
    • Carbon-based TIMs
      • Multi-walled nanotubes (MWCNT)
        • Table Properties of CNTs and comparable materials.
      • Single-walled carbon nanotubes (SWCNTs)
        • Table Typical properties of SWCNT and MWCNT.
        • Table Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive.
      • Vertically aligned CNTs (VACNTs)
        • Table Thermal conductivity of CNT-based polymer composites.
      • BN nanotubes (BNNT) and nanosheets (BNNS).
        • Table Comparative properties of BNNTs and CNTs.
      • Graphene
        • Table Properties of graphene, properties of competing materials, applications thereof.
      • Nanodiamonds
        • Table Properties of nanodiamonds.
      • Graphite
        • Table Comparison between Natural and Synthetic Graphite.
        • Table Classification of natural graphite with its characteristics.
        • Table Characteristics of synthetic graphite.
      • Hexagonal Boron Nitride
        • Table Properties of hexagonal boron nitride (h-BN).
    • Metamaterials
      • Types and properties
      • Application as thermal interface materials
    • Self-healing thermal interface materials
      • Extrinsic self-healing
      • Capsule-based
      • Vascular self-healing
      • Intrinsic self-healing
      • Healing volume
      • Types of self-healing materials, polymers and coatings
        • Table Types of self-healing coatings and materials.
        • Table Comparative properties of self-healing materials.
      • Applications in thermal interface materials
    • Consumer electronics
      • Market overview
    • Electric Vehicles (EV)
      • Market overview
    • Data Centers
      • Market overview
    • ADAS Sensors
      • Market overview
    • EMI shielding
      • Market overview
    • 5G
      • Market overview
    • Global revenues for TIMs 2018-2033, by market
      • Table Global revenues for TIMs 2018-2033, by market (millions USD)
    • Future market prospects
    • 3M
    • AI Technology Inc.
    • AOK Technologies
    • AOS Thermal Compounds LLC
    • Aismalibar S.A.
    • Arkema
    • Arieca, Inc.
    • ATP Adhesive Systems AG
    • Bando Chemical Industries, Ltd.
    • BNNano
    • BNNT LLC
    • Boyd Corporation
    • BYK
    • Carbice Corp.
    • Carbon Waters
    • Carbodeon Ltd. Oy
      • Table Carbodeon Ltd. Oy nanodiamond product list.
    • CondAlign AS
    • Detakta Isolier- und Messtechnik GmbH & Co. KG
    • Dexerials Corporation
    • Deyang Carbonene Technology
    • Dow Corning
    • Dupont (Laird Performance Materials)
    • Dymax Corporation
    • ELANTAS Europe GmbH
    • Elkem Silcones
    • Enerdyne Thermal Solutions, Inc
    • Epoxies Etc.
    • First Graphene Ltd
    • Fujipoly
    • Fujitsu Laboratories
    • GLPOLY
    • Global Graphene Group
    • Goodfellow Corporation
    • Graphmatech AB
    • GuangDong KingBali New Material Co., Ltd.
    • HALA Contec GmbH & Co. KG
    • Hamamatsu Carbonics Corporation
    • H.B. Fuller Company
    • Henkel AG & Co. KGAA
    • Hamamatsu Carbonics
    • Honeywell
    • Hongfucheng New Materials
    • HyMet Thermal Interfaces SIA
    • Indium Corporation
    • Inkron
    • Kerafol Keramische Folien GmbH & Co. KG
    • Kitagawa
    • KULR Technology Group, Inc.
    • Leader Tech Inc.
    • LiSAT
    • Liquid Wire, Inc.
    • MG Chemicals Ltd
    • Minoru Co., Ltd.
    • Mithras Technology AG
    • Molecular Rebar Design, LLC
    • Momentive Performance Materials
    • Nanoramic Laboratories
    • Nano Tim
    • NeoGraf Solutions, LLC
    • Nolato Silikonteknik
    • Ntherma Corporation
    • OCSiAl Group
    • Panasonic
    • Parker Hannifin Corporation
    • Plasmonics, Inc.
    • Polymer Science, Inc.
    • Polytec PT GmbH
    • Protavic
    • Ray-Techniques Ltd.
      • Table Ray-Techniques Ltd. nanodiamonds product list.
      • Table Comparison of ND produced by detonation and laser synthesis.
    • Rovilus, Inc.
    • Saint-Gobain
    • Samyang Corporation
    • Schlegel Electronic Materials
    • Sekisui Chemical
    • Sekisui Polymatech Europe BV
    • Shenhe Liyang Technology
    • Shinko Electric Industries Co., Ltd.
    • Shin-Etsu Chemical Co. Ltd.
    • SHT Smart High Tech AB
    • Sika AG
    • Sixth Element
    • STOCKMEIER Urethanes GmbH & Co. KG
    • Suzhou Kanronics Electronic Technology Co., Ltd
    • Versarien
    • Wacker Chemie AG
    • Zalman Tech Co., Ltd.
    • Zeon Specialty Materials

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