Market Research Logo

Electronic Circuit Board Level Underfill Material Market: Global Industry Analysis (2012 - 2016) and Opportunity Assessment (2017 - 2027)

Electronic Circuit Board Level Underfill Material Market: Global Industry Analysis (2012 - 2016) and Opportunity Assessment (2017 - 2027)

Owing to increasing number and use of electronics products, the demand for board level underfill material is expected to increase in the coming years

The development of underfill technology is driven by the advances of the flip-chip technology and are generally epoxies that are loaded with a filler such as silica. Underfill materials offer stress relieving to solder joints, extend thermal aging and lifetime of device. Underfill technology is used to distribute and redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. These underfill are made from different materials such as epoxy, silica, alumina, urethane and many others.

Future Market Insights has covered a detailed analysis on the electronic circuit board level underfill material market. This analysis includes segment wise intelligence, regional intelligence, competitive intelligence as well as weightage on trends, opportunities, drivers and restraints that have influence on the growth of the global market for electronic circuit board level underfill material. According to the acumen gleaned by Future Market Insights, the global electronic circuit board level underfill material is anticipated to grow at a high rate during the assessment period. During the 2012-2016 timeline, the global electronic circuit board level underfill material market reflected a comparatively slow growth rate, but it is projected to grow at a CAGR of 5.7% throughout the 2017-2027 timeline. In 2017, it is valued at around US$ 255 Mn and is estimated to reach a value of more than US$ 440 Mn by the end of the year of assessment. The main aspects contributing to the growth of the global electronic circuit board level underfill material market include increasing demand for smartphones, growth in consumer electronics sector, growing investments in electronics sector and increasing focus on electronics miniaturization.

Underfill segment to maintain status quo throughout the period of assessment

The underfill segment in the product type category is anticipated to grow at a significant pace in the coming years. This segment reflected a higher market share since past years and dominated the global market during the 2012-2016 timeline. It is likely to continue with this trend in the coming years and maintain its status quo. In 2017, this segment reflected a value of around US$ 147 Mn thus leading the global market. By the end of the year of assessment, this segment is poised to slate a value of more than US$ 260 Mn. The underfill segment is projected to grow at a high value CAGR throughout the forecast period as it is a preferred technology and has a high demand in the flip chips board type. This is the most lucrative segment from both revenue share ad growth perspectives.

electronic circuit board level underfill material market
Edge bonds to significantly contribute to the growth of the underfill segment

Underfill segment is further categorized into edge bonds and capillary fills sub segments. Of these, the edge bonds sub segment is expected to largely contribute to the market share of the parent segment. This sub segment is estimated to reach valuation of about US$ 165 Mn growing at a high value CAGR of 6.9% during the forecast period. Edge bonds technology is expected to be growing at this high CAGR owing to their low cost, fast processing and better rework ability. Edge/Corner bonding improves the mechanical reliability performance of the board. The capillary fills sub segment is projected to grow at a relatively slow value CAGR of 4.4% during the said period.


1. Executive Summary
1.1. Market Overview
1.2. Market Analysis
1.3. FMI Analysis and Recommendations
1.4. Wheel of Fortune
2. Market Introduction
2.1. Market Definition
2.2. Market Taxonomy
3. Market Viewpoint
3.1. Macro-Economic Factors
3.1.1. Electronics Industry
3.1.2. Global Semi-Conductor Sales
3.1.3. Global ICT Spending on Telecom Services
3.1.4. World GDP Growth Outlook
3.2. Opportunity Analysis
3.3. Parent Market Overview
4. Global Board Level Underfill Material Market Analysis and Forecast
4.1. Global Board Level Underfill Material Market: Market Size and Forecast Analysis
4.2. Supply Chain
5. Forecast Assumptions
6. Global Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027, By Product Type
6.1. Introduction / Key Findings
6.2. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis by Product Type, 2012–2016
6.3. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Product Type, 2017–2027
6.3.1. Underfills
6.3.1.1. Capillary fills
6.3.1.2. Edgebonds
6.3.2. Glob Top Encapsulations
6.4. Key Trends / Developments
6.5. Market Attractiveness Analysis By Product Type
7. Global Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027, By Board Type
7.1. Introduction / Key Findings
7.2. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis By Board Type , 2012–2016
7.3. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Board Type , 2017–2027
7.3.1. CSP (Chip Scale Package)
7.3.2. BGA (Ball Grid Array)
7.3.3. Flip Chip
7.4. Key Trends / Developments
7.5. Market Attractiveness Analysis By Board Type
8. Global Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027, By Material
8.1. Introduction / Key Findings
8.2. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis By Material , 2012–2016
8.3. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Material, 2017–2027
8.3.1. Quartz/Silicon Based
8.3.2. Alumina Based
8.3.3. Epoxy Based
8.3.4. Urethane Based
8.3.5. Acrylic Based
8.3.6. Other
8.4. Key Trends / Developments
8.5. Market Attractiveness Analysis By Material
9. Global Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027 By Region
9.1. Introduction / Key Findings
9.2. Historical Market Size (US$ Mn) and Volume Analysis By Region, 2012 – 2016
9.3. Current Market Size (US$ Mn) and Volume Forecast By Region, 2017 - 2027
9.3.1. North America
9.3.2. Western Europe
9.3.3. Asia Pacific Excl. Japan (APEJ)
9.3.4. Latin America
9.3.5. Eastern Europe
9.3.6. Middle East and Africa (MEA)
9.3.7. Japan
9.4. Market Attractiveness Analysis By Region
10. North America Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027
10.1. Introduction
10.2. Pricing Analysis
10.3. Regional Market Dynamics
10.3.1. Drivers
10.3.2. Restraints
10.3.3. Trends
10.4. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis By Taxonomy, 2012-2016
10.4.1. By Country
10.4.2. By Product Type
10.4.3. By Board Type
10.4.4. By Material
10.5. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Country, 2017–2027
10.5.1. U.S.
10.5.2. Canada
10.6. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Product Type, 2017–2027
10.6.1. Underfills
10.6.1.1. Capillary fills
10.6.1.2. Edgebonds
10.6.2. Glob Top Encapsulations
10.7. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Board Type , 2017–2027
10.7.1. CSP (Chip Scale Package)
10.7.2. BGA (Ball Grid Array)
10.7.3. Flip Chip
10.8. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Material, 2017–2027
10.8.1. Quartz/Silicon Based
10.8.2. Alumina Based
10.8.3. Epoxy Based
10.8.4. Urethane Based
10.8.5. Acrylic Based
10.8.6. Other
10.9. Drivers and Restraints: Impact Analysis
10.10. Market Attractiveness Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Board Type
10.10.4. By Material
10.11. Key Representative Market Participants
10.12. Market Presence (Intensity Map)
11. Western Europe Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027
11.1. Introduction
11.2. Pricing Analysis
11.3. Regional Market Dynamics
11.3.1. Drivers
11.3.2. Restraints
11.3.3. Trends
11.4. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis By Taxonomy, 2012-2016
11.4.1. By Country
11.4.2. By Product Type
11.4.3. By Board Type
11.4.4. By Material
11.5. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Country, 2017–2027
11.5.1. Germany
11.5.2. Italy
11.5.3. France
11.5.4. U.K.
11.5.5. Spain
11.5.6. BENELUX
11.5.7. Rest of Western Europe
11.6. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Product Type, 2017–2027
11.6.1. Underfills
11.6.1.1. Capillary fills
11.6.1.2. Edgebonds
11.6.2. Glob Top Encapsulations
11.7. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Board Type , 2017–2027
11.7.1. CSP (Chip Scale Package)
11.7.2. BGA (Ball Grid Array)
11.7.3. Flip Chip
11.8. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Material, 2017–2027
11.8.1. Quartz/Silicon Based
11.8.2. Alumina Based
11.8.3. Epoxy Based
11.8.4. Urethane Based
11.8.5. Acrylic Based
11.8.6. Other
11.9. Drivers and Restraints: Impact Analysis
11.10. Market Attractiveness Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Board Type
11.10.4. By Material
11.11. Key Representative Market Participants
11.12. Market Presence (Intensity Map)
12. Asia Pacific Excl. Japan (APEJ) Board Level Underfill Material Market Analysis 2012–2016 and Forecast 2017–2027
12.1. Introduction
12.2. Pricing Analysis
12.3. Regional Market Dynamics
12.3.1. Drivers
12.3.2. Restraints
12.3.3. Trends
12.4. Historical Market Size (US$ Mn) and Volume (Tons) Trend Analysis By Taxonomy, 2012-2016
12.4.1. By Country
12.4.2. By Product Type
12.4.3. By Board Type
12.4.4. By Material
12.5. Current Market Size (US$ Mn) and Volume (Tons) Forecast By Country, 2017–2027
12.5.1. Mainland China
12.5.2. India
12.5.3. ASEAN
12.5.4. Australia and New Zealand
12.5.5. South Korea
12.5.6. Taiwan

Download our eBook: How to Succeed Using Market Research

Learn how to effectively navigate the market research process to help guide your organization on the journey to success.

Download eBook

Share this report