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IMAPS Poland 2016

IMAPS Poland 2016

The International Microelectronics and Packaging Society (IMAPS) Poland Chapter was established in September 1982. In the beginning, it was the ISHM-Poland Chapter and from 1997 it became the IMAPS-Poland Chapter. The IMAPS is a non-profit making organization whose aim is to spread knowledge relating to hybrid microelectronics; a key technology in the assembly and application of semiconductors, thin film circuits and printed circuit boards (PCBs) to form practical miniaturized electronic equipment. In 2008, the IMAPS joined with the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, bringing into formation the IMAPS-CPMT organization.

The 40th IMAPS Poland International Conference was held in Ksiaz Castle, Walbrzych and took place between 25 and 28 September 2016. This event was organized by the Wroclaw University of Science and Technology. The scope of the Conference covered all aspects of electronics between the chip and the system and it was attended by 93 participants, including 16 guests from abroad. During the Conference, 18 invited lectures and 63 posters were presented. The conference was supported by six international journals indexed in the Journal Citation Report database and one domestic journal.

This year, as in the previous years, two young scientists have been awarded the prizes of a refund of their conference fees for the next IMAPS 2017 Poland Conference. Also, two awards for ‘Women in Science’ were given by the Visegrad International Network for Microelectronics Engineering Scientists (VINmes).

In this eBook of Soldering and Surface Mount Technology, ten of the conference’s peer reviewed papers have been published, covering the processes and procedures associated with soldering and assembly technology.


Corrosion induced tin whisker growth in electronic devices: a review,IMAPS 2016 Poland – Guest Editorial,Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing,New method for determining correction factors for pin-in-paste solder volumes,Optimization of solder paste quantity considering the properties of solder joint ,Real-time profiling of reflow process in VPS chamber,Stability of electrical properties for mechanically exposed thick- and thin-film resistors on flexible substrates,Structure and thermal behavior of lead-free solders prepared by rapid solidification of their melt,Studying heat transfer on inclined printed circuit boards during vapour phase soldering,The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials,X-ray inspection and Six-Sigma in analysis of LED thermal pad coverage

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