IMAPS Poland 2016
The International Microelectronics and Packaging Society (IMAPS) Poland Chapter was established in September 1982. In the beginning, it was the ISHM-Poland Chapter and from 1997 it became the IMAPS-Poland Chapter. The IMAPS is a non-profit making organization whose aim is to spread knowledge relating to hybrid microelectronics; a key technology in the assembly and application of semiconductors, thin film circuits and printed circuit boards (PCBs) to form practical miniaturized electronic equipment. In 2008, the IMAPS joined with the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, bringing into formation the IMAPS-CPMT organization.
The 40th IMAPS Poland International Conference was held in Ksiaz Castle, Walbrzych and took place between 25 and 28 September 2016. This event was organized by the Wroclaw University of Science and Technology. The scope of the Conference covered all aspects of electronics between the chip and the system and it was attended by 93 participants, including 16 guests from abroad. During the Conference, 18 invited lectures and 63 posters were presented. The conference was supported by six international journals indexed in the Journal Citation Report database and one domestic journal.
This year, as in the previous years, two young scientists have been awarded the prizes of a refund of their conference fees for the next IMAPS 2017 Poland Conference. Also, two awards for ‘Women in Science’ were given by the Visegrad International Network for Microelectronics Engineering Scientists (VINmes).
In this eBook of Soldering and Surface Mount Technology, ten of the conference’s peer reviewed papers have been published, covering the processes and procedures associated with soldering and assembly technology.
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