A new approach to construction of extended kit for M-Sequence UWB sensor system based on LTCC,Comparison of diffused layer prepared using liquid dopant solutions and pastes for solar cell with screen printed electrodes,IMAPS 2015 Poland – Guest Editorial,Influence of ITO layer application on electrical parameters of silicon solar cells with screen printed front electrode,Influence of the SiNx:H layer deposited by PECVD technique on the surface and grain boundary passivation of mc-Si,Influence of various multilayer LTCC systems on dielectric properties’ stability in GHz frequency range,Multilayer capacitors with bismuth copper tantalate dielectric fabricated in LTCC technology,Multilayer thick-film thermoelectric microgenerator based on LTCC technology,Reduction of dielectric constant of LTCC substrates by introduction of controlled porosity,The influence of a mounting manner of power MOS transistors on characteristics of the Totem-Pole circuit with RLC load,The LTCC device for miniature plasma generators characterization,The utilization of LTCC-PDMS bonding technology for microfluidic system applications – a simple fluorescent sensor
The International Microelectronics and Packaging Society (IMAPS) Poland Chapter was established in September 1982. In the beginning, it was the ISHM-Poland Chapter and, from 1997, it became the IMAPS-Poland Chapter. The IMAPS is a non-profit-making organization whose aim is to spread knowledge relating to hybrid microelectronics – a key technology in the assembly and application of semiconductors, thin-film circuits and printed circuit boards (PCBs) to form practical miniaturized electronic equipment. In 2008, the IMAPS joined with the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, bringing into formation the IMAPS–CPMT organization. In this eBook, eleven papers have been selected from the conference. All of them were subjected to Microelectronics International’s regular reviewing procedure.