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IMAPS (2016)

IMAPS (2016)

The International Microelectronics and Packaging Society (IMAPS) Poland Chapter was established in September 1982. In the beginning, it was the ISHM-Poland Chapter and from the 1997 it became the IMAPS-Poland Chapter.

The IMAPS is a non-profit making organization whose aim is to spread of knowledge relating to hybrid microelectronics; a key technology in the assembly and application of semiconductors, thin film circuits and printed circuit boards (PCBs) to form practical miniaturized electronic equipment. In 2008, the IMAPS joined with IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, bringing into formation the IMAPS-CPMT organization.

The 40th IMAPS Poland International Conference was held in Walbrzych in Ksiaz Castle and took place between 25 and 28 September 2016. This event was organized by the Wroclaw University of Science and Technology. The scope of the Conference covered the everything in electronics between the chip and the system. The conference was attended by 93 participants, including 16 guests from abroad. During the Conference, 18 invited lectures and 63 posters were presented. The conference was supported by six international journals indexed in Journal Citation Report database and one domestic journal.

This year, as in the previous year, two young Scientists have been awarded winning the refund of the conference fee during the next IMAPS 2017 Poland Conference.

Also two awards for Women in science have been given by Visegrad International Network for Microelectronics Engineering Scientists (VINmes).

In the eBook of Circuit World seven papers have been collected, covering the processes and procedures associated with PCB technology. All of them were subjected to the journal’s regular reviewing procedure.

Assessment of stability and reliability of embedded components in printed circuit boards,Drops forming in inkjet printing of flexible electronic circuits,Effects of varying laser trimming geometries on thin film resistors,IMAPS 2016 Poland – Guest Editorial,Investigation of nano-inks behaviour on flexible and rigid substrates under various conditions,Investigations of mutual thermal coupling between SiC Schottky diodes situated in the common case ,Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates,RFID monitoring system of fiber optic connectors

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