EMPC-IMAPS Poland 2018

EMPC-IMAPS Poland 2018

In the special issue of Soldering and Surface Mount Technology six papers have been collected (1 review and 5 research papers), covering the processes and procedures associated with soldering and assembly technology.

Advances in pressure sensing for vapour phase soldering process monitoring,EMPC-IMAPS Poland 2018 – Guest Editorial,Experimental approach to thermal conductivity of macro solder joints with voids,Machine learning based prediction of component self-alignment in vapour phase and infrared soldering,Measurement and regulation of saturated vapour height level in VPS chamber,Non-newtonian numerical modelling of solder paste viscosity measurement,Vapour Phase Soldering (VPS) technology: A review

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