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EMPC/IMAPS 2017 Poland

EMPC/IMAPS 2017 Poland

The IMAPS is a non-profit making organization whose aim is to spread knowledge relating to hybrid microelectronics; a key technology in the assembly and application of semiconductors, thin film circuits and printed circuit boards (PCBs) to form practical miniaturized electronic equipment. In 2008, the IMAPS joined with the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, bringing into formation the IMAPS-CPMT organization. In this special issue of Microelectronics International, ten papers have been collected, covering the processes and procedures associated with LTCC technology, photovoltaics and LED issues.

Antireflective and passivation properties of the photovoltaic structure with Al2O3 layer of different thickness,Application of microwave heating in ceramic-based microfluidic module,Borosilicate spray-on glass solutions for fabrication silicon solar cell back surface field,Capacitive touch sensor,EMPC/IMAPS 2017 Poland - guest editorial,High voltage applications of Low Temperature Co-fired Ceramics,Low temperature Co-Fired Ceramics technology for active eddy current turbocharger speed sensors,Multilayer thick-film ceramic for Multichip Modules with laser microvias,Smart LED High CRI lighting systems,Temperature transducer with frequency output made in LTCC technology,The investigation of basic microfluidic elements in LTCC structures

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