Market Research Logo

Global Outsourced Semiconductor Assembly and Test Market (OSAT) Market with Focus on IC Packaging (2018-2022)

Global Outsourced Semiconductor Assembly and Test Market (OSAT) Market with Focus on IC Packaging (2018-2022)

Scope of the Report

The report titled “Global Outsourced Semiconductor Assembly and Test Market (OSAT) Market with Focus on IC Packaging: Size, Trends & Forecasts (2018-2022)”, provides an in-depth analysis of the global OSAT market by value and by region. Further, analysis includes IC Packaging market by value, by volume and by segment. The report also provides the analysis of the OSAT market by value for China region.

The report also assesses the key opportunities in the market and outlines the factors that are and will be driving the growth of the industry. Growth of the overall global OSAT market with focus on IC packaging market has also been forecasted for the period 2018-2022, taking into consideration the previous growth patterns, the growth drivers and the current and future trends.

The OSAT market with focus on IC packaging market is dominated by few players, but there are other new players, private label players as well. However, the competition in the global OSAT market with focus on IC packaging market is dominated by Advanced Semiconductor Engineering, (ASE) Inc., Amkor Technology, Inc., ChipMOS Technologies Inc. (ChipMOS), Mubadala Investment Company (GlobalFoundries Inc.), who are also profiled with their financial information and respective business strategies.

Country Coverage

China

Company Coverage

Advanced Semiconductor Engineering, (ASE) Inc.
Amkor Technology, Inc.
ChipMOS Technologies Inc. (ChipMOS)
Mubadala Investment Company (GlobalFoundries Inc.)

Executive Summary

An Integrated Circuit (IC) is defined as the circuit that is comprised of inseparable and electrically interconnected elements. An IC is basically a semiconductor wafer in which millions of components, like, tiny resistors, capacitors, and transistors, are fabricated. ICs have distinct characteristics like, they are very small in size, have less weight, require low power, and are highly reliable, etc.

The OSATs offer Integrated Circuit packaging services on the open market to the integrated semiconductor manufacturers (ISMs), and fabless companies, and to IDMs and foundries as well. Outsourced Semiconductor Assembly and Test (OSAT) provide third-party Integrated Circuit (IC) packaging and test services.

The OSAT market can be segmented on the basis of technology used in IC packaging. OSAT is based on three major IC packaging technologies, named as Wirebond Packaging, Flip Chip Packaging and Wafer level Packaging.

The global OSAT market with focus on IC packaging has increased at a significant CAGR over the years and projections are made that the market would rise in the next four years i.e. 2018-2022 tremendously. The OSAT market is expected to increase due to rising automotive production, rising Internet of Things (IoT), growing personal electronics, increasing smartphone users, rising urban population etc. Yet the market faces some challenges such as volatile demand from cryptocurrency, etc.


1. Executive Summary
2. Introduction
2.1 Integrated Circuit (IC): An Overview
2.1.1 Characteristics of Integrated Circuit (IC)
Table 1: Characteristics of Integrated Circuit (IC)
2.1.2 Integrated Circuit (IC) Manufacturing Process
Table 2: Integrated Circuit (IC) Manufacturing Process
2.2 Segmentation of Integrated Circuit (IC): An Overview
Table 3: Segmentation of Integrated Circuit (IC)
2.3 Outsourced Semiconductor Assembly and Test (OSAT): An Overview
Table 4: Technology Used in IC Packaging
2.4 Outsourced Semiconductor Assembly and Test (OSAT):Value Chain
Table 5: Value Chain of OSAT
3. Global Market Analysis
3.1 Global OSAT Market: An Analysis
3.1.1 Global OSAT Market by Value
Table 6: Global OSAT Market by Value; 2013-2018 (US$ Billion)
3.1.2 Global OSAT Market by Region (China, Rest of World)
Table 7: Global OSAT Market by Region; 2017 (Percentage, %)
3.2 Global IC Packaging Market: An Analysis
3.2.1 Global IC Packaging Market by Value
Table 8: Global IC Packaging Market by Value; 2014-2017 (US$ Billion)
Table 9: Global IC Packaging Market by Value; 2018-2022 (US$ Billion)
3.2.2 Global IC Packaging Market by Segment (Wirebond Packaging, Flip Chip Packaging and Wafer Level Packaging)
Table 10: Global IC Packaging Market by Segment; 2017 (Percentage, %)
3.2.3 Global IC Packaging Market by Volume
Table 11: Global IC Packaging Market by Volume; 2014-2017 (Million Units)
Table 12: Global IC Packaging Market by Volume; 2018-2022 (Million Units)
3.2.4 Global IC Packaging Market Volume by Segment (Wirebond Packaging, Flip Chip Packaging and Wafer Level Packaging)
Table 13: Global IC Packaging Market Volume by Segment; 2017 (Percentage, %)
3.3 Global IC Packaging Market: Segment Analysis
3.3.1 Global Wirebond (WB) Packaging Market by Value
Table 14: Global Wirebond Packaging (WB) Market by Value; 2014-2017 (US$ Billion)
Table 15: Global Wirebond Packaging (WB) Market by Value; 2018-2022 (US$ Billion)
3.3.2 Global Wirebond (WB) Packaging Market by Volume
Table 16: Global Wirebond (WB) Packaging Market by Volume; 2014-2017 (Million Units)
Table 17: Global Wirebond (WB) Packaging Market by Volume; 2018-2022 (Million Units)
3.3.3 Global Flip Chip (FC) Packaging Market by Value
Table 18: Global Flip Chip (FC) Packaging Market by Value; 2014-2017 (US$ Billion)
Table 19: Global Flip Chip (FC) Packaging Market by Value; 2018-2022 (US$ Billion)
3.3.4 Global Flip Chip (FC) Packaging Market by Volume
Table 20: Global Flip Chip (FC) Packaging Market by Volume; 2014-2017 (Thousand Units)
Table 21: Global Flip Chip (FC) Packaging Market by Volume; 2018-2022 (Thousand Units)
3.3.5 Global Wafer Level Packaging (WLP) Market by Value
Table 22: Global Wafer Level Packaging (WLP) Market by Value; 2014-2017 (US$ Billion)
Table 23: Global Wafer Level Packaging (WLP) Market by Value; 2018-2022 (US$ Billion)
3.3.6 Global Wafer Level Packaging (WLP) Market by Volume
Table 24: Global Wafer Level Packaging (WLP) Market by Volume; 2014-2017
(Thousand Units)
Table 25: Global Wafer Level Packaging (WLP) Market by Volume; 2018-2022
(Thousand Units)
4. China Market Analysis
4.1 China OSAT Market: An Analysis
Table 26: China OSAT Market by Value; 2013-2018 (US$ Billion)
5. Market Dynamics
5.1 Growth Drivers
5.1.1 Rising Automotive Production
Table 27: Global Automotive Production; 2013-2017 (Million)
5.1.2 Increasing Usage of Camera in Automotive
Table 28: Global Automotive Camera Shipment; 2013-2020 (Million Units)
5.1.3 Rising Demand for Fingerprint Sensors
Table 29: Global Fingerprint Sensors Shipment; 2014-2018 (Million Units)
5.1.4 Rising Internet of Things (IoT)
Table 30: Global Internet of Things (IoT) Connected Devices Installed Base; 2015-2022 (Billion)
5.1.5 Increasing Smartphone Users
Table 31: Global Smartphone Users; 2014-2020 (Billion)
5.1.6 Growing Personal Electronics
Table 32: Global Personal Electronics Market; 2013-2020 (Billion Units)
5.1.7 Rising Urban Population
Table 33: Global Urban Population by Region; 2015-2025 (Billion)
5.2 Challenges
5.2.1 Threat from Foundry’s Forward Integration
5.2.2 Rising Raw Material Cost
5.2.3 Volatile Demand from Cryptocurrency
5.3 Market Trends
5.3.1 Growing Demand for AI-related Semiconductor
Table 34: Global AI-related Semiconductor Revenue; 2017-2022 (US$ Billion)
5.3.2 Wafer Level Chip Scale Packaging (WLCSP)Technology
Table 35: Global WLCSP Market; 2012-2022 (US$ Billion)
5.3.3 Rising Demand for Domestic Consumer Robotics
Table 36: Global Domestic Consumer Robotics Market; 2015-2022 (US$ Billion)
5.3.4 Increasing Flexible Devices
Table 37: Global Wearable Technology by Shipments; 2013-2018 (Million)
6. Competitive Landscape
6.1 Global OSAT Market Players by Share
Table 38: Global OSAT Market Players by Share
6.2 Global OSAT Market Players Financial Comparison
Table 39: Global OSAT Market Players Financial Comparison; 2017
7. Company Profile
7.1 Advanced Semiconductor Engineering, Inc. (ASE)
7.1.1 Business Overview
7.1.2 Financial Overview
Table 40: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues; 2013-2017 (US$ Billion)
Table 41: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues by Segment; 2017 (Percentage, %)
Table 42: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues by Region; 2017 (Percentage, %)
7.1.1 Business Strategy
7.2 Amkor Technology, Inc.
7.2.1 Business Overview
7.2.2 Financial Overview
Table 43: Amkor Technology, Inc. Net Sales; 2013-2017 (US$ Billion)
Table 44: Amkor Technology, Inc. Net Sales by Segment; 2017 (Percentage, %)
Table 45: Amkor Technology, Inc. Net Sales by Region; 2017 (Percentage, %)
7.2.1 Business Strategy
7.3 ChipMOS Technologies Inc. (ChipMOS)
7.3.1 Business Overview
7.3.2 Financial Overview
Table 46: ChipMOS Revenue; 2013-2017 (US$ Million)
Table 47: ChipMOS Revenue by Segment; 2017 (Percentage,%)
Table 48: ChipMOS Revenue by Region; 2017 (Percentage,%)
7.3.3 Business Strategy
7.4 Mubadala Investment Company (GlobalFoundries Inc.)
7.4.1 Business Overview
7.4.2 Financial Overview
Table 49: Mubadala Investment Company Revenue; 2013-2017
(US$ Billion)
Table 50: Mubadala Investment Company Revenue by Segment; 2017 (Percentage, %)
Table 51: Mubadala Investment Company Revenue by Region; 2017 (Percentage, %)
7.4.3 Business Strategy

Download our eBook: How to Succeed Using Market Research

Learn how to effectively navigate the market research process to help guide your organization on the journey to success.

Download eBook

Share this report