Opportunities in the Supply Chain for High-Speed Electronics, 2012-2018
A Strategic Review of PCB, Material and Interconnection Trends and Needs for Electronic Assemblies for High-Speed Telecom, Datacom Networks and High-End Computers over the period 2012 to 2018.
400GE networks have been roadmapped as the next step up from 100GE. This will drive a doubling of channel data rates from 25Gbps to 50Gbps
16G Fibre Channel in the data storage arena will be followed by an upgrade to 32Gbps in 2014. This is being challenged by 40G FC over Ethernet
The copper and fibre interface continues to change. Silicon photonics is an emerging key enabler for high speed interfaces.
4G/LTE wireless communication is driving the development of more compact, intelligent and flexible base stations.
Convergence of satellite and terrestrial mobile communications
Low loss, low CTE build-up solutions and silicon substrates for packaging high speed semiconductors.
This study provides a totally integrated assessment of the high speed electronics value chain
Identification and quantification of the opportunities for small, medium and large technology vendors
Comprehensive roadmaps detailing the technologies, materials and processes that will be needed to participate in these markets
Identifies key technology and market drivers of this major market sector
STUDY BACKGROUND AND SCOPE
The demand for greater bandwidth for cloud computing, video streaming, mobile TV and internet is driving a requirement for greater bandwidth and higher data transmission rates across all network infrastructure systems.
BPA has reviewed the technological drivers for key systems in the high speed data and telecommunication networking market to identify the features that will impact on the requirements and specifications for printed circuits boards, IC packaging, interconnection and associated assembly, materials and processing.
The 2013 High Speed Report explores the implications for IC packaging and interconnection technologies, markets and the supply chain. This report is for strategists and business managers keen to develop current and future business opportunities. Key issues reviewed in this study will improve your understanding and help your company to succeed in the high-speed interconnection and packaging and their ancillary materials requirements:
High speed technology trends over the next five years
Winning technologies and protocols
Key players in the supply chain
Current and future market opportunities
PCB, advanced IC packaging and materials market size and forecasts for 2012-2018 including:
Forecast Demand for Low-Loss Laminates for Routers, Servers and Base Stations
Demand for High-End Routers
Demand for High-Speed Digital PCBs and Low Loss Laminate for Routers
Worldwide Server Shipment Forecast
Demand for PCBs and Low Loss for Servers
Worldwide Demand for Base Stations
Worldwide Demand for Base Station Transceivers
Demand for Low-Loss Laminate for Wireless Base S
Forecast Demand for HSD PCBs for Network Infrastructure Equipment
Worldwide Demand for Opto-PCBs
Transceiver Modules Worldwide Demand
Worldwide Demand for Advanced Flip Chip Substrates for High-Speed Systems