Thin-layer Deposition: CVD, Ion Implantation and Epitaxy
The global chemical vapor deposition (CVD) market is expected to increase from $5 billion in 2014 to nearly $6.8 billion by the end of 2019, a compound annual growth rate (CAGR) of 6.3% for the five-year period, 2014 to 2019.
This report provides:
An overview of the global markets for thin-layer deposition technologies, including chemical vapor deposition (CVD), ion implementation and epitaxy.
Analyses of global market trends, with data from 2013, estimates for 2014, and projections of CAGRs through 2019.
Discussion of the advantages and limitations of each technology.
Domestic and international technological issues.
Analysis of the industry's manufacturing capacity and consumption by various regional markets.
STUDY GOALS AND OBJECTIVES
In recent years, the semiconductor industry has experienced a relatively positive and steady growth, primarily fueled by the demand for semiconductors, electronic components and devices for everyday items such as smartphones, tablets and laptops. The numerous processes involved in the manufacturing of semiconductors are crucial to their ability to perform per user specifications. Thin-layer deposition is an important process in the manufacturing of semiconductors and electronic components.
Thin-layer deposition entails depositing a thin layer of a particular material onto a substance or substrate. The thickness of this layer varies in terms of nanometers.
BCC Research’s goal in conducting this study was to determine the current status of the global market for thin-layer deposition by looking at three important technologies: chemical vapor deposition (CVD), ion implantation and molecular beam epitaxy (MBE). Each technology has its own unique advantages and suits specific requirements for the designated type of deposition. This report provides an in-depth analysis of these three technologies for the period from 2013 to 2019.
The primary objective of this study is to present a comprehensive analysis of these key technologies in thin-layer deposition and to provide insight into future market trends.
REASONS FOR DOING THE STUDY
The requirement for thin-layer deposition has changed considerably over the years. This is due to the fact that the numerous electronic devices currently being manufactured are considerably smaller and compact in comparison to their predecessors. Such changes require the technology and the equipment used for thin-layer deposition to be in tune with end-user requirements. In this aspect, BCC Research conducted an extensive study into some of the most common thin-layer deposition technologies and provided a detailed analysis of their various advantages and uses. The research includes the services function of each technology. BCC Research believes that the changing dynamics in thin-layer deposition is of key interest to various industry participants.