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Plastics in Electronics Components: Technologies and Global Markets

Plastics in Electronics Components: Technologies and Global Markets

The global electronic component market volume was 3.6 billion pounds in 2014. This market should reach nearly 3.8 billion pounds in 2015 and more than 4.4 billion pounds by 2020, demonstrating a compound annual growth rate (CAGR) of 3.3% from 2015 to 2020.

This report provides:

An overview of the global market for plastics in electronic components.

Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020.

Information about pricing of resins, molders of electronic components, testing agencies and requirements related to electronic components.

Discussion of emerging and developmental technologies and applications that have the greatest commercial potential through 2020.

Coverage of single devices such as connectors, capacitors, switches, bobbins, multiple-component devices such as printed circuit boards and interconnects, and encapsulants.

Comprehensive company profiles of major players in the industry.


SCOPE AND FORMAT

This study covers all electronic components where plastics are used to a significant extent. It concentrates on components produced by injection molding, compression molding and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures.

The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronic components, and it looks at interpolymer competition.

CHAPTER 1 INTRODUCTION
OBJECTIVES
SCOPE AND FORMAT
REASONS FOR DOING THE STUDY
INTENDED AUDIENCE
METHODOLOGY AND INFORMATION SOURCES
RELATED BCC RESEARCH REPORTS
ANALYST'S CREDENTIALS
BCC RESEARCH WEBSITE
DISCLAIMER
CHAPTER 2 SUMMARY
SUMMARY TABLE GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF POLYMER, THROUGH 2020 (MILLION POUNDS)
SUMMARY FIGURE GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF POLYMER, 2014-2020 (MILLION POUNDS)
CHAPTER 3 POLYMERS USED IN ELECTRONIC COMPONENTS
OVERVIEW
TYPES OF POLYMERS
THERMOPLASTICS
STANDARD NYLONS
Background
Properties
Major Types
Nylon 66
Nylon 6
Reinforced Nylons
Background
Processing
Applications
TABLE 1 EXAMPLES OF STANDARD NYLONS USED TO MOLD
ELECTRONIC COMPONENTS BY TRADE NAME
Recent Developments
BASF Nylon Polymerization Plant in China
Invista to Make Nylon 66 Polymer in China
Lanxess Starts Up Nylons Unit in Antwerp
"Super 66" from Solvay Engineering Plastics
Wax-Free Nylons from Akro-Plastic
Enhanced Thermal Aging in New Zytel from DuPont
Halogen-Free Flame-Retardant Reinforced Nylon From BASF
Market Estimates and Forecasts
TABLE 2 GLOBAL STANDARD NYLON ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
THERMOPLASTIC POLYESTERS
Background
Polybutylene Terephthalate
Properties
Applications
TABLE 3 EXAMPLES OF POLYBUTYLENE TEREPHTHALATES USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
Recent Developments
Sipchem Starts Up Polybutylene Terephthalate Plant
Carbon-Fiber-Reinforced Polybutylene Terephthalate From BASF
Flame Retardant Polybutylene Terephthalate from Polyplastics
Halogen-Free Reinforced Flame Retardant Grades From Lanxess
Hydrolysis-Resistant Polybutylene Terephthalates from BASF
Hydrolysis-Resistant Polybutylene Terephthalates from DuPont
Hydrolysis-Resistant Polybutylene Terephthalates from Lanxess
Polyethylene Terephthalate
Background
Properties and Grades
Applications
Recent Developments
Halogen-Free Rynite from DuPont
Thermally Conductive Polyethylene Terephthalate from DSM
Polycyclohexylenedimethylene Terephthalate
Background
Properties
Recent Developments
Glass-Reinforced Compound from Solvay
Market Estimates and Forecasts
TABLE 4 GLOBAL POLYBUTYLENE TEREPHTHALATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
TABLE 5 GLOBAL PET/PCT ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
POLYPHENYLENE SULFIDE
Background
Properties
Advantages and Disadvantages
Applications
TABLE 6 EXAMPLES OF POLYPHENYLENE SULFIDE AND POLYPHENYLENE SULFIDE BLENDS USED TO MOLD
ELECTRONIC COMPONENTS BY TRADE NAME
Recent Developments
Solvay Completes Acquisition of Ryton PPS
Lumena Completes Polyphenylene Sulfide Expansion, Has Some
Liquidity Problems
DIC Planning Polyphenylene Sulfide Compounding Plant in China
Chlorine-Free Polyphenylene Sulfide From SK Chemicals
Celanese Adds Polyphenylene Sulfide to Compounding Capacity in Nanjing
Idemitsu Transfers Polyphenylene Sulfide Business to Lion Idemitsu
Composites
Toray to Establish New Production Base for Torelina Polyphenylene
Sulfide in South Korea
Halogen-Free Polyphenylene Sulfide from Celanese
Market Estimates and Forecasts
TABLE 7 GLOBAL POLYPHENYLENE SULFIDE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
POLYIMIDES
Background
Properties and Applications
Polyimide Films
Polyetherimide
Background and Properties
Applications
Recent Developments
Ultem Shortage
Polyamide-Imide
Background and Properties
Applications
Market Estimates and Forecasts
TABLE 8 GLOBAL POLYIMIDE* ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
POLYCARBONATES
Background
General Grades
Properties
Overview
Property Advantages and Disadvantages
Polyester Carbonates
Impact of Bisphenol A on Polycarbonate Usage
Processing
Applications
TABLE 9 EXAMPLES OF POLYCARBONATES USED TO MOLD
ELECTRONIC COMPONENTS BY TRADE NAME
Alloys/Blends
Supply and Demand
Recent Developments
Sabic Codevelops Conductive Transparent Polycarbonate Film
Mitsubishi Gas Chemical Doubles Specialty Polycarbonate Capacity
Teijin Shutting Polymer Plant in Singapore
Trinseo Realigns Businesses
Market Estimates and Forecasts
TABLE 10 GLOBAL POLYCARBONATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
POLYPHTHALAMIDES AND OTHER HIGH-TEMPERATURE NYLONS
Overview
Polyphthalamides
Properties and Applications
TABLE 11 EXAMPLES OF POLYPHTHALAMIDE POLYMERS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
Other High-Temperature Nylons
Nylon 46
Nylon 4T
Nylon 9T
MXD6
Recent Developments
Biosourced Nylon 610, MXD6-Based Compound from Solvay
Specialty Polymers
DuPont Adding Zytel HTN Capacity
6T and 10T Types from Evonik
Solvay Compounding in China
Market Estimates and Forecasts
TABLE 12 GLOBAL POLYPHTHALAMIDES AND HIGH-TEMPERATURE NYLONS ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
LIQUID CRYSTAL POLYMERS
Background
Properties
Applications
TABLE 13 EXAMPLES OF LIQUID CRYSTAL POLYMERS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME
Recent Developments
Polyplastics Launches Second-Generation Laperos Liquid Crystal
Polymer
New Xydar Liquid Crystal Polymer for High-Speed Surface-Mount
Device Connectors
Market Estimates and Forecasts
TABLE 14 GLOBAL LIQUID CRYSTAL POLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
SULFONE POLYMERS
Background
Properties
Applications
Producer Scenario
Recent Developments
BASF Opens Ultrason Plant in South Korea
Another High-Temperature Sulfone from Solvay
Market Estimates and Forecasts
TABLE 15 GLOBAL SULFONE POLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
ALLOYS/BLENDS
Background
Polyphenylene Ether/High-Impact Polystyrene
Background
Properties
Polyphenylene Ether/Nylon
Background and Properties
Polycarbonate/Polyester Blends
Market Estimates and Forecasts
TABLE 16 GLOBAL POLYMER ALLOY/BLEND ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
FLUOROPOLYMERS
Background
Properties and Applications
Producers
Recent Developments
DuPont Establishes Chemours
Solvay Sets Up Fluoropolymer Joint Venture in China
Market Estimates and Forecasts
TABLE 17 GLOBAL FLUOROPOLYMER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
POLYARYLETHERKETONES
Background
Properties
Applications
TABLE 18 EXAMPLES OF PAEK USED TO MOLD ELECTRONIC
COMPONENTS BY TRADE NAME
Recent Developments
Solvay Builds U.S. Specialty Polymers PEEK Production Unit
New Victrex Polymer Plant
Victrex Opens PAEK Films Plant
New Capacity from Gharda
Market Estimates and Forecasts
TABLE 19 GLOBAL POLYARYLETHERKETONE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
CYCLIC OLEFIN COPOLYMERS
Background
Properties and Applications
Producers
THERMOPLASTIC MARKET ESTIMATES AND FORECASTS SUMMARY
TABLE 20 GLOBAL THERMOPLASTIC ELECTRONIC COMPONENT MARKET BY TYPE, THROUGH 2020 (MILLION POUNDS)
THERMOSET POLYMERS
OVERVIEW
GENERAL PROPERTIES
TABLE 21 THERMOSET PROPERTIES AND MANUFACTURING PROCESSES
EPOXY RESINS
Background
Chemistry and Properties
Processing
Applications
Important Epoxy Grades and Producers
TABLE 22 EXAMPLES OF EPOXY RESINS USED FOR ELECTRONIC
COMPONENTS BY TRADE NAME
Recent Developments
Dow Possibly Exiting Epoxies
PPE from Sabic Acts as Epoxy Modifier
Market Estimates and Forecasts
TABLE 23 GLOBAL EPOXY RESIN ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
POLYURETHANES
Background
Reaction-Injection Molding Products
Applications
Producers
TABLE 24 EXAMPLES OF POLYURETHANE SYSTEMS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
Recent Developments
Market Estimates and Forecasts
TABLE 25 GLOBAL POLYURETHANE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS PHENOLICS
Background
Molding Compounds
Applications
Producers
TABLE 26 EXAMPLES OF PHENOLICS USED FOR ELECTRONIC
COMPONENTS BY TRADE NAME
Market Estimates and Forecasts
TABLE 27 GLOBAL PHENOLIC ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
UNSATURATED POLYESTERS
Background
Applications
Overview
Electrical/Electronic
Producers
TABLE 28 EXAMPLES OF UNSATURATED POLYESTER AND VINYL ESTER RESINS AND COMPOUNDS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME
Market Estimates and Forecasts
TABLE 29 GLOBAL UNSATURATED POLYESTER ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
DIALLYL PHTHALATE
Overview
Background and Applications
Producers
Market Estimates and Forecasts
TABLE 30 GLOBAL DIALLYL PHTHALATE ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
BT-EPOXY RESINS AND CYANATE ESTERS
THERMOSET MARKET ESTIMATES AND FORECASTS SUMMARY
TABLE 31 GLOBAL THERMOSET ELECTRONIC COMPONENT MARKET BY TYPE, THROUGH 2020 (MILLION POUNDS)
CHAPTER 4 OVERVIEW OF KEY COMPONENTS, PRINTED CIRCUIT BOARDS AND ENCAPSULANTS
INTRODUCTION
FOCUS OF THIS REPORT
RESIN CONSUMPTION
BACKGROUND
MARKETS
GROWTH
MARKET DRIVERS
PRINTED CIRCUIT BOARDS
OVERVIEW
PROPERTY REQUIREMENTS FOR LAMINATES
Electrical
Mechanical
Thermal
Other Property Requirements
PHYSICAL COMPOSITION
ASSEMBLY TECHNOLOGIES
PCB SUBSTRATES
TABLE 32 IMPORTANT TECHNICAL FACTORS TO CONSIDER WHEN SELECTING PRINTED CIRCUIT BOARD SUBSTRATE MATERIALS
FR-2 Paper/Phenolic
FR-4 Epoxy
Other Types
SPECIFIC POLYMERS USED IN PRINTED CIRCUIT BOARDS
Epoxies
Polyimides
Cyanate Esters
Polytetrafluoroethylene
Bismaleimide-Triazine Resins
Phenolics
Melamine
OTHER MATERIALS USED IN PRINTED CIRCUIT BOARDS
Copper Foils
FIBER REINFORCEMENTS
Glass Cloth
Aramid Fibers
PRODUCTION OF CIRCUITRY
ENVIRONMENTAL ISSUES
Flame Retardants
RECENT DEVELOPMENTS
Extruded Thermoplastic Circuit Board
High Thermal Conductivity PCB Material
FLEXIBLE PRINTED CIRCUIT BOARDS
Background
Applications
Technology
Standards
Advantages
Materials Used
Overview
Polyimides
Polyesters
Aramids
Epoxy Resins
Adhesiveless Laminates
Rigid-Flex Circuits
Recent Developments
High-Temperature Flexible Circuit Material System From DuPont
Flame-Retardant Polyester Film From Teijin DuPont Films
Polyimide-Based System for High Temperatures
Kaneka Expands Film Business
SKC Kolon PI Expanding
Comparison Between Rigid and Flexible Circuit Boards
TABLE 33 COMPARISON BETWEEN RIGID AND FLEXIBLE CIRCUIT
BOARDS
Producers of Rigid and Flexible Circuit Boards
TABLE 34 MAJOR PRODUCERS OF RIGID AND FLEXIBLE CIRCUIT
BOARDS
SOLDERING
Background
Some Technologies
Lead-Free Electronic Soldering
PRODUCTION STATISTICS
INDUSTRY TRENDS
ELECTRONIC PACKAGING
Overview
Background
Wire Bonding
Chip-On-Board
Tape Automated Bonding
Flip Chip Bonding
Package Types
Dual-in-Line
Pin Grid Arrays
Ball Grid Arrays
Other Key, Selected Electronic Packaging/Interconnection Technologies
Multichip Modules
Printed Circuit Board Assembly Techniques
Overview
Through-Hole technology
Surface-Mount Technology
Intrusive Reflow
Process
Advantages and Disadvantages of SMT vs. Through-Hole
Advantages
Disadvantages
Soldering Techniques
Resin and Material Usage
Competitive Resin Scenario for Surface-Mount Technology Devices
Three-Dimensional Molded Interconnected Devices
Background
Applications
Manufacturing Technologies
TABLE 35 POLYMERS SUITABLE FOR PRODUCTION OF 3D-MIDS
USING LDS TECHNOLOGY
Alternative MID Technologies
TABLE 36 ADVANTAGES AND DISADVANTAGES OF LDS AND TWO-COMPONENT MOLDING FOR 3D-MIDS
Recent Developments
Laser Plasma Coating
Integrated Plastic-Metal Injection Molding
Three-Dimensional Printed Electronics
MARKET ESTIMATES AND FORECASTS
TABLE 37 GLOBAL PRINTED CIRCUIT BOARD MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 38 GLOBAL PCB* MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 39 GLOBAL PRINTED CIRCUIT BOARD MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
ENCAPSULANTS
DEFINITIONS AND BACKGROUND
PRIMARY PURPOSES OF ENCAPSULATION
ENCAPSULANT MATERIALS
Overview
Impact of Thermoplastics
Types
TABLE 40 TYPES OF ENCAPSULANT MATERIALS - ADVANTAGES AND DISADVANTAGES
EPOXY ENCAPSULATION FORMULATIONS
TABLE 41 EPOXY ENCAPSULANT FORMULATIONS
ENCAPSULATED ELECTRICAL AND ELECTRONIC COMPONENTS
Background
Specific Encapsulant Applications
EPOXY ENCAPSULANT SYSTEMS
SILICONE ENCAPSULANTS
THERMOPLASTIC ENCAPSULANTS
MAJOR SELECTED ENCAPSULANT PRODUCERS AND THEIR PRODUCT LINES
Bostik
Henkel
Huntsman
Lord Chemical
MARKET ESTIMATES AND FORECASTS
TABLE 42 GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 43 GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 44 GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
CHAPTER 5 MOLDED ELECTRONIC PRODUCTS
OVERVIEW
BACKGROUND
POLYMERS USED
MARKET DRIVERS
CONNECTORS
BACKGROUND
TRENDS
APPLICATIONS FOR ELECTRONIC CONNECTORS
MATERIAL SELECTION
FLAME RETARDANCE
STANDARDS RELATING TO CONNECTORS
MANUFACTURERS
TABLE 45 MAJOR MANUFACTURERS OF ELECTRONIC CONNECTORS
END-USE MARKETS
Background
Automotive Industry
Appliances
Other Markets
MARKET ESTIMATES AND FORECASTS
TABLE 46 GLOBAL ELECTRONIC CONNECTOR MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 47 GLOBAL ELECTRONIC CONNECTOR MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION
POUNDS)
TABLE 48 GLOBAL ELECTRONIC CONNECTOR MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
SWITCHES
BACKGROUND
MARKET ESTIMATES AND FORECASTS
TABLE 49 GLOBAL ELECTRONIC SWITCH MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 50 GLOBAL ELECTRONIC SWITCH MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 51 GLOBAL ELECTRONIC COMPONENT SWITCH MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
COIL FORMERS
BACKGROUND
MANUFACTURERS
TABLE 52 SELECTED MANUFACTURERS MOLDING COIL FORMERS FOR ELECTRONIC APPLICATIONS
MARKET ESTIMATES AND FORECASTS
TABLE 53 GLOBAL COIL-FORMER MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 54 GLOBAL COIL-FORMER MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 55 GLOBAL COIL-FORMER MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
RELAYS
BACKGROUND
MARKET ESTIMATES AND FORECASTS
TABLE 56 GLOBAL RELAY MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 57 GLOBAL RELAY MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 58 GLOBAL RELAY MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
CAPACITORS
BACKGROUND
APPLICATIONS
CAPACITOR MATERIALS
CONSUMPTION BY MARKET SEGMENT
MARKET ESTIMATES AND FORECASTS
TABLE 59 GLOBAL CAPACITOR MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
OTHER MOLDED ELECTRONIC COMPONENTS
RESISTORS
Background
Applications
Inductors/Transformers
Plastics Usage
MARKET ESTIMATES AND FORECASTS
TABLE 60 GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 61 GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOPLASTIC TYPE, THROUGH 2020 (MILLION POUNDS)
TABLE 62 GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION POUNDS)
SUMMARY OF MARKET ESTIMATES AND FORECASTS
TABLE 63 GLOBAL ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
TABLE 64 GLOBAL THERMOPLASTIC ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
TABLE 65 GLOBAL THERMOSET ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS)
CHAPTER 6 USES AND INDUSTRY TRENDS
OVERVIEW
SNAPSHOT OF THE ELECTRONIC DEVICE MARKET
COMPUTERS
OVERVIEW
DESKTOPS
ELECTRONIC DISPLAYS
BACKGROUND
PRINTERS
OVERVIEW
INKJET PRINTERS
MONOCHROME LASER PRINTERS
COLOR LASER PRINTERS
MANUFACTURERS
''ALL-IN-ONE'' MACHINES
PHONES
CORDED
CORDLESS
FAX MACHINES
SCANNERS
MOBILE ELECTRONIC DEVICES
PHONES
LAPTOPS/NOTEBOOKS/NETBOOKS
TABLETS
E-READERS
DIGITAL MUSIC PLAYERS
AUTOMOTIVE MARKET
OVERVIEW
ELECTRIC CARS
CAFE ISSUES
OVERVIEW OF ELECTRONIC COMPONENTS IN AUTOMOTIVE PRODUCTS
MATERIAL USAGE
CONNECTORS
SENSORS
FLEXIBLE CIRCUITRY IN AUTOMOTIVE
CHAPTER 7 TECHNOLOGY TRENDS AND RECENT PATENTS RELATED TO ELECTRONIC COMPONENTS
BACKGROUND
IMPORTANCE OF MINIATURIZATION
THIN-WALLING ELECTRONIC COMPONENTS
BACKGROUND
EFFECTS OF THIN-WALLING ON PERFORMANCE REQUIREMENTS AND DESIGN
APPLICATION REQUIREMENTS
MATERIAL AND PROCESS SELECTION
PROPERTIES REQUIRED
CHALLENGES IN DOWNSIZING
SOFTWARE THAT AIDS THIN-WALL DESIGN
FLEXIBLE ELECTRONICS
OVERVIEW
WEARABLE ELECTRONICS
CLOUD COMPUTING AND BIG DATA
THE INTERNET OF EVERYTHING
CHANGES IN ELECTRONIC COMPONENT MANUFACTURING THAT COULD
IMPACT RESIN CHOICES
RECENT PATENTS RELATED TO THE INDUSTRY
MULTI-FUNCTIONAL KEYBOARD ASSEMBLIES - Apple Inc. (Cupertino, Calif.) - 20140118264 - May 1, 2014
ELECTRONIC DEVICE IN PLASTIC - Thiel, David (Nathan, Australia), Madhusudanrao, Neeli (Nathan, Australia) - 20140146501 - May 29, 2014
A METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT - BASF (Ludwigshafen, Germany) - WO/2014/113323 - July 24, 2014
METHOD FOR SURFACE MOUNTING ELECTRONIC COMPONENT, AND SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED THEREON - Omron Corp. (Kyoto, Japan) - 20130175074 - July 24, 2014
PRINTED THREE-DIMENSIONAL (3D) FUNCTIONAL PART AND METHOD OF MAKING - President and Fellows of Harvard College - WO2014209994 A2 - December 31, 2014
FLEXIBLE ELECTRONIC DEVICES - Apple Inc. (Cupertino, Calif.) - 8929085 A2 - January 6, 2015
PRINTED CIRCUIT BOARD ASSEMBLY - Samsung Electro-Mechanics Co.
(Suwon-si, Gyeonggi-do, South Korea) - 8971047- March 3, 2015
CASE OF ELECTRONIC DEVICE HAVING LOW-FREQUENCY ANTENNA
PATTERN EMBEDDED THEREIN, MOLD THEREFOR AND METHOD OF MANUFACTURING THEREOF - Samsung Electro-Mechanics Co. (Suwon-si, Gyeonggi-do, South Korea) - 8976074- March 10, 2015
EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE - Sumitomo Bakelite Co. Ltd. (Tokyo, Japan) - 8987355 - March 24, 2015
PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD - Ajinomoto Co. Inc. (Tokyo, Japan) - 8992713- March 31, 2015
CHAPTER 8 ELECTRONIC COMPONENT INDUSTRY OVERVIEW AND PLASTICS PRODUCERS
TOP SEMICONDUCTOR PRODUCERS AND CUSTOMERS
TABLE 66 TOP GLOBAL SEMICONDUCTOR PRODUCER COMPANIES, 2014 ($ BILLIONS)
TABLE 67 TOP GLOBAL SEMICONDUCTOR CUSTOMERS, 2014 ($ BILLIONS)
MANUFACTURING AND MARKETING ASPECTS
GLOBALIZATION
WHAT COMPONENT SUPPLIERS ARE DOING
PLASTICS PRODUCERS
OVERVIEW
TABLE 68 TRADE NAMES OF SELECTED, KEY PLASTICS USED IN ELECTRONIC COMPONENTS
POLYMER PRODUCERS ACCORDING TO MATERIAL TYPE
THERMOSETS
Epoxy Resins
Polyurethanes
Phenolics
Unsaturated Polyesters
Diallyl Phthalate
THERMOPLASTICS
Standard Nylons
Polyesters
Polyphenelene Sulfide
Polyimides
Polycarbonates
Liquid Crystal Polymers
Sulfone Polymers
Fluoropolymers
Polyphthalamides/HTNs
Polyaryletherketones
Alloys and Blends
CHAPTER 9 ENVIRONMENTAL ISSUES
OVERVIEW
PRINTED CIRCUIT BOARD DISPOSAL
BROMINE-FREE PRINTED CIRCUIT BOARDS
HALOGEN-FREE FLAME RETARDANTS FOR THERMOPLASTICS
RECYCLING
ELECTRONIC INDUSTRY INTERFACE
OVERVIEW
REASONS FOR INCREASED ENVIRONMENTAL REGULATIONS FOR ELECTRONIC EQUIPMENT
THE EUROPEAN UNION ROHS DIRECTIVE
THE EUROPEAN UNION WEEE DIRECTIVE
EPEAT
CHAPTER 10 PERFORMANCE REQUIREMENTS RELATED TO ELECTRONIC COMPONENTS
OVERVIEW
FLAMMABILITY STANDARDS
Definitions
FLAMMABILITY TESTS
Overview
UL 94
Glow-Wire Flammability Index - IEC 60695
UL 1694
UL 746C
OTHER STANDARDS
UL 1446
UL 1950
CHAPTER 11 SELECTED COMPANY PROFILES
ASAHI KASEI CHEMICAL
ASHLAND SPECIALTY CHEMICALS
BASF
CELANESE
COVESTRO
CYTEC INDUSTRIES INC.
DSM
DUPONT
EMS GRIVORY
EPIC RESINS
HENKEL AG
HUNTSMAN ADVANCED MATERIALS
INTERPLASTIC CORP.
KINGFA
LANXESS
MITSUBISHI ENGINEERING PLASTICS
POLYPLASTICS
SABIC INNOVATIVE PLASTICS
SOLVAY SPECIALTY POLYMERS
SUMITOMO BAKELITE
TORAY PLASTICS
VICTREX
CHAPTER 12 APPENDIX: ACRONYMS

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